Semiconductor Assembly And Testing Services Market

Semiconductor Assembly and Testing Services (SATS) Market: Surging Adoption of Consumer Electronics Will Drive Demand for SATS Providers: Global Industry Analysis and Opportunity Assessment 2015-2021

The global semiconductor assembly and testing services market is value projected for a value worth US$ 24.72 Bn by the end of 2016. The market is likely to witness moderate growth over the next five years and is estimated to expand at a CAGR of 5.8% during a six-year forecast period 2015-2021.

Wafer Fabrication Technology Remains a Cost-intensive Affair for Semiconductor Companies

The semiconductor processing technology is rapidly shifting to larger wafer fabrication with smaller feature size; however, wafer fabrication involves higher CAPEX and operational costs for testing and packaging. Building and maintaining a state-of-the-art factory for wafer fabrication is an expensive affair. Swelling costs of advanced packaging solutions are also expected to favour the SATS market.  Semiconductor companies thus prefer to remain fabless and concentrate on their core capabilities, employing a third party expert for testing, assembly, and packaging of semiconductor assembly. This will primarily continue to create the demand for semiconductor assembly and testing service providers over the forecast period 2015-2021.

Superiority of SATS Providers Continues to Push Adoption

SATS providers operate in an efficient supply chain that functions at a reduced turnaround policy. Furthermore, these providers enable in-house testing and packaging, which is why serve a majority of integrated device manufacturers. These will remain the primary factors propelling the adoption of semiconductor assembly and testing service providers by 2021 end.

Fabless Companies Continue to Outsource Semiconductor Assembly, Testing, and Packaging

As the key players are fabless companies, which have to focus more on the design part in order to enhance the performance of ICs and chipsets, they often prefer outsourcing of semiconductor assembly, testing, and packaging services to third party SATS providers. Over half of the market is occupied by outsourced semiconductor assembly and testing (OSAT) services. This will continue to fuel the demand for SATS during the next few years.

Soaring Demand for Consumer Electronics Escalates the Demand for SATS Providers

The ever-growing need for connectivity and mobility is in turn bolstering the manufacturing and sales of consumer electronic devices, such as smartphones, tablets, PCs, laptops, wearables, AV devices, and gaming consoles. This is likely to spur the demand for high quality SATS providers in market. Moreover, the advent of technology in next-gen cars and automotive electronics will also possibly create a host of opportunities for SATS providers through to 2021.

Market Segmentation

By Service

By Packaging Solution

By Application

  • Assembly and packaging

  • Testing

  • Copper wire and gold wire bonding

  • Copper clip

  • Flip chip

  • Wafer level packaging

  • TSV

  • Communication

  • Computing and networking

  • Consumer electronics

  • Industrial

  • Automotive electronics

 Consumer Electronics Drive the Assembly and Packaging Service Segment

By service, assembly and packaging segment is likely to remain dominant over testing segment, with a remarkable CAGR over 2015-2021. This growth is primarily attributed to the proliferation of consumer electronics sector. Emergence of advanced packaging solutions will also indirectly drive this segment further.

Flip Chip Segment Gathers Higher Momentum in Terms of Packaging Solution

Based on packaging solution, copper wire and gold wire bonding segment will witness declining growth despite retaining the market dominance throughout the forecast period. This segment’s revenues are predicted to reach over US$ 14 Bn by 2021 end, whereas the market share will see a decline from nearly 53% expected in 2016, to around 45% in 2021. However, the flip chip segment is anticipated to witness robust growth at a CAGR of 8.1% over 2015-2021, accounting for over 21% market share in 2021. Wafer level packaging segment will also exhibit a significant CAGR.

Communication Remains the Largest Application Segment

On the basis of application, communication segment is likely to maintain dominance over the forecast period. The consumer electronics application segment will however register stellar growth at the highest CAGR during 2015-2021.

Regional Segmentation

The global semiconductor assembly and testing services market is regionally segmented into four key markets:

  • North America
  • Europe
  • Asia Pacific
  • Middle East and Africa

Although APAC is expected to remain the leading market with over 86% share of the entire market, FMI indicates that this region will witness a moderate CAGR over the forecast period, registering a steady decline in the Y-o-Y growth by 2021 end. However, North America is projected to observe stable growth throughout the forecast period, accounting for over 28% share in 2021.

global sats market_image for preview analysis

Key Market Players

The leading companies competing in the global semiconductor assembly and testing services market are ASE Group, Amkor Technologies Inc., Silicon Precision Industries Co. Ltd., Psi Technologies Inc. (IMI), STATS ChipPAC Ltd. (JCET), Global Foundries, Powertech Technology Inc., Chipbond Technology Corporation, and CORWIL Technology corporation. A majority of the low-end service providers are currently competing on price-effective products. Key players are increasingly investing in R&D of innovative, cost-effective packaging solutions.

Future Market Insights, through a newly published report, “Global Market Study on Semiconductor Assembly and Testing Services (SATS): Global Industry Analysis and Opportunity assessment 2015–2021”, offers a six-year forecast for the global semiconductor assembly and testing services  market over 2015-2021. Our study demonstrates key market dynamics and developments across various regions of the country that are expected to influence the current status and future prospects of the global semiconductor assembly and testing services  market. The primary objective of this report is to provide information on key drivers, restraints, opportunities, regulations, price, value chain analysis, and updates on developments in the global semiconductor assembly and testing services market, and conduct a quantitative as well as qualitative assessment of the market across various regional market segments.

Report Description

To understand and assess market opportunities and trends, the global semiconductor assembly and testing services market report is categorically split on the basis of service, application, packaging solution, and geography. The report starts with a market overview and provides market definition and analysis of the value chain, pricing, cost structure, drivers, restraints, opportunities, trends, and regulations in the global semiconductor assembly and testing services market. The sections that follow include an analysis of the global semiconductor assembly and testing services market - by service, application, packaging solution, and region. All these sections evaluate the qualitative and quantitative aspects of the global semiconductor assembly and testing services market on the basis of various factors affecting the market. To give a brief idea of revenue opportunities on segment-basis, the report also provides shipment (KT) data, absolute $ opportunity, and total incremental opportunity for each segment over the forecast period.

In the final section of the report, we have highlighted the global semiconductor assembly and testing services market structure and a detailed competition landscape with company market share and performance to provide report audiences with a dashboard view of key players operating in the global semiconductor assembly and testing services market.

Research Methodology

For market data analysis, we have considered 2015 as the base year, with market numbers estimated for 2016 and a comprehensive forecast made for 2017–2021. To calculate market size, the report considers the weighted average price, based on service and application across key regions of the country. The forecast assesses the total revenue as well as shipment of the global semiconductor assembly and testing services market. In order to provide an accurate forecast, we have started by sizing up the current market, which forms the basis of how the global semiconductor assembly and testing services market is expected to develop in the future. Critical market data – including the base number and segment splits – has been derived through in-depth secondary research. This data is then triangulated on the basis of different verticals, considering both supply side and demand side drivers and other dynamics of the various regional markets, along with primary interviews of manufacturers and industry experts operating in the global semiconductor assembly and testing services market.

Given the ever-fluctuating nature of the global economy, we have not only conducted forecasts in terms of CAGR, but have also analysed the market based on key parameters such as year-on-year (Y-o-Y) growth rate to understand market predictability and to identify the right opportunities across the global semiconductor assembly and testing services market. We have also analysed the different segments of the global semiconductor assembly and testing services market in terms of basis point share (BPS) to understand individual segment’s relative contribution to market growth. This detailed level of information is important for identifying the various key trends governing the global semiconductor assembly and testing services market. Another important feature of our report is an analysis of all the key segments in terms of absolute dollar opportunity, critical in evaluating the scope of opportunity that a provider can look to achieve, as well as to identify potential resources from a delivery perspective in the global semiconductor assembly and testing services market. The overall absolute dollar opportunity along with the segmental split is mentioned in the report. Further, to understand key market segments in terms of growth and performance, we have developed a market attractiveness index to help providers identify real market opportunities in the global semiconductor assembly and testing services market.

Table Of Content

1. Global Semiconductor Assembly and Testing Services Market- Executive Summary 

2. Assumptions & Acronyms Used

3. Research Methodology

4. Market Overview

4.1. Introduction

4.1.1. Global Semiconductor Assembly and Testing Services Market Definition

4.1.2. Global Semiconductor Assembly and Testing Services Market Taxonomy

4.2. Global Semiconductor Assembly and Testing Services Market Dynamics

4.2.1. Drivers

4.2.2. Restraints

4.3. Value Chain

4.4. Global Semiconductor Assembly and Testing Services Market Forecast, 2015-2021

4.4.1. Global Semiconductor Assembly and Testing Services Market Size (Value) Forecast

4.4.1.1. Y-o-Y Growth Projections

4.4.1.2. Absolute $ Opportunity

4.5. Global Semiconductor Assembly and Testing Services Market Trends

4.6. Global Semiconductor Assembly and Testing Services Market Snapshot (2014)

4.6.1. Market Share By Services

4.6.2. Market Share By Packaging Solutions

4.6.3. Market Share By Applications

4.6.4. Market Share By Regions

5. Global Semiconductor Assembly and Testing Services Market Analysis, By Services

5.1. Introduction

5.2. Global Semiconductor Assembly and Testing Services Market Forecast By Services

5.2.1. Assembly & Packaging services (Interconnecting technologies) 

5.2.1.1. Copper and gold wire bonding

5.2.1.2. Copper clip

5.2.1.3. Flip Chip

5.2.1.4.Wafer Level Packaging

5.2.1.5. TSV

5.2.2. Testing Services

5.3. Basis Point Share (BPS) Analysis, By Services

5.4. Y-o-Y Growth Comparison, By Services

5.5. Market Absolute $ Opportunity, By Services

5.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Services

5.7. Qualitative Analysis

6. Global Semiconductor Assembly and Testing Services Market Analysis, By Packaging Solutions

6.1. Introduction

6.2. Global Semiconductor Assembly and Testing Services Market Forecast By Packaging Solutions

6.2.1. Copper/gold Wire Bonding

6.2.2. Copper Clip

6.2.3. Flip Chip

6.2.4. Wafer Level Packaging

6.2.5. 3D TSV

6.3. Basis Point Share (BPS) Analysis, By Packaging Solutions

6.4. Y-o-Y Growth Comparison, By Packaging Solutions

6.5. Absolute $ Opportunity, By Packaging Solutions

6.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Packaging Solutions

6.7. Qualitative Analysis

7. Global Semiconductor Assembly and Testing Services Market Analysis, By Applications

7.1. Introduction

7.2. Global Semiconductor Assembly and Testing Services Market Forecast By Applications

7.2.1. Communications

7.2.2. Computing & Networking

7.2.3. Consumer Electronics

7.2.4. Industrial

7.2.5. Automotive Electronics

7.3. Basis Point Share (BPS) Analysis, By Applications

7.4. Y-o-Y Growth Comparison, By Applications

7.5. Absolute $ Opportunity

7.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Packaging Solutions

7.7. Qualitative Analysis

8. Global Semiconductor Assembly and Testing Services Market Analysis, By Region

8.1. Introduction

8.2. Global Semiconductor Assembly and Testing Services Market Forecast By Region

8.2.1. North America Market Value Forecast

8.2.2. Asia Pacific (Excluding Taiwan) Market Value Forecast 

8.2.3. Taiwan Market Value Forecast

8.2.4. Europe Market Value Forecast

8.2.5. Middle East & Africa Market Value Forecast

8.2.6. Latin America Market Value Forecast

8.3. Y-o-Y Growth Projections, By Region

8.4. Basis Point Share (BPS) Analysis, By Region

8.5. Market Attractiveness Analysis, By Region

9. North America North America Semiconductor Assembly and Testing Services Market Analysis

9.1. Market overview

9.2. Introduction

9.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity

9.3. North America Semiconductor Assembly and Testing Services Market Forecast

9.3.1. Market Value Forecast By Services

9.3.1.1. Assembly & Packaging services 

9.3.1.2. Testing services

9.3.1.2.1. Y-o-Y Growth Comparison, By Services

9.3.1.2.2. Basis Point Share (BPS) Analysis, By Services

9.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)

9.3.2.1. Copper/gold wire bonding

9.3.2.2. Copper Clip

9.3.2.3. Flip Chip

9.3.2.4. Wafer level Packaging

9.3.2.5. 3D TSV

9.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions

9.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions

9.3.3. Market Value Forecast By Applications

9.3.3.1. Communications

9.3.3.2. Computing and Networking

9.3.3.3. Consumer Electronics

9.3.3.4. Industrial

9.3.3.5. Automotive Electronics

9.3.3.5.1. Y-o-Y Growth Comparison, By Applications

9.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications

9.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis

9.3.4.1. By Services

9.3.4.2. By Packaging Solutions

9.3.4.3. By Applications

9.3.5. Drivers & Restraints: Impact Analysis

10. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services Market Analysis

10.1. Market overview

10.2. Introduction

10.2.1. Y-o-Y Growth Projections, By Country

10.2.2. Basis Point Share (BPS) Analysis, By Country

10.3. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services Market Forecast

10.3.1. Market Value Forecast By Country

10.3.1.1. China Absolute $ Opportunity

10.3.1.2. Japan Absolute $ Opportunity

10.3.1.3. Singapore Absolute $ Opportunity

10.3.1.4. Thailand Absolute $ Opportunity

10.3.1.5. Philippines Absolute $ Opportunity

10.3.1.5.1. Y-o-Y Growth Comparison, By Countries

10.3.1.5.2. Basis Point Share (BPS) Analysis, By Countries

10.3.2. Market Value Forecast By Services

10.3.2.1. Assembly & Packaging services 

10.3.2.2. Testing services

10.3.2.2.1. Y-o-Y Growth Comparison, By Services

10.3.2.2.2. Basis Point Share (BPS) Analysis, By Services

10.3.3. Market Value Forecast By Packaging Solutions (Interconnecting technologies)

10.3.3.1. Copper/gold wire bonding

10.3.3.2. Copper Clip

10.3.3.3. Flip Chip

10.3.3.4. Wafer level Packaging

10.3.3.5. 3D TSV

10.3.3.5.1. Y-o-Y Growth Comparison, By Packaging solutions

10.3.3.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions

10.3.4. Market Value Forecast By Applications

10.3.4.1. Communications

10.3.4.2. Computing and Networking

10.3.4.3. Consumer Electronics

10.3.4.4. Industrial

10.3.4.5. Automotive Electronics

10.3.4.5.1. Y-o-Y Growth Comparison, By Applications

10.3.4.5.2. Basis Point Share (BPS) Analysis, By Applications

10.3.5. Semiconductor Assembly and Testing Services Market Attractiveness Analysis

10.3.5.1. By countries

10.3.5.2. By Services

10.3.5.3. By Packaging Solutions

10.3.5.4. By Applications

10.3.6. Drivers & Restraints: Impact Analysis

11. Taiwan Semiconductor Assembly and Testing Services Market Analysis

11.1. Market overview

11.2. Introduction

11.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity

11.3. Taiwan Semiconductor Assembly and Testing Services Market Forecast

11.3.1. Market Value Forecast By Services

11.3.1.1. Assembly & Packaging services 

11.3.1.2. Testing services

11.3.1.2.1. Y-o-Y Growth Comparison, By Services

11.3.1.2.2. Basis Point Share (BPS) Analysis, By Services

11.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)

11.3.2.1. Copper/gold wire bonding

11.3.2.2. Copper Clip

11.3.2.3. Flip Chip

11.3.2.4. Wafer level Packaging

11.3.2.5. 3D TSV

11.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions

11.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions

11.3.3. Market Value Forecast By Applications

11.3.3.1. Communications

11.3.3.2. Computing and Networking

11.3.3.3. Consumer Electronics

11.3.3.4. Industrial

11.3.3.5. Automotive Electronics

11.3.3.5.1. Y-o-Y Growth Comparison, By Applications

11.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications

11.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis

11.3.4.1. By Services

11.3.4.2. By Packaging Solutions

11.3.4.3. By Applications

11.3.5. Drivers & Restraints: Impact Analysis

12. Europe Semiconductor Assembly and Testing Services Market Analysis

12.1. Market overview

12.2. Introduction

12.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity

12.3. Europe Semiconductor Assembly and Testing Services Market Forecast

12.3.1. Market Value Forecast By Services

12.3.1.1. Assembly & Packaging services 

12.3.1.2. Testing services

12.3.1.2.1. Y-o-Y Growth Comparison, By Services

12.3.1.2.2. Basis Point Share (BPS) Analysis, By Services

12.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)

12.3.2.1. Copper/gold wire bonding

12.3.2.2. Copper Clip

12.3.2.3. Flip Chip

12.3.2.4. Wafer level Packaging

12.3.2.5. 3D TSV

12.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions

12.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions

12.3.3. Market Value Forecast By Applications

12.3.3.1. Communications

12.3.3.2. Computing and Networking

12.3.3.3. Consumer Electronics

12.3.3.4. Industrial

12.3.3.5. Automotive Electronics

12.3.3.5.1. Y-o-Y Growth Comparison, By Applications

12.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications

12.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis

12.3.4.1. By Services

12.3.4.2. By Packaging Solutions

12.3.4.3. By Applications

12.3.5. Drivers & Restraints: Impact Analysis

13. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services Market Analysis

13.1. Market overview

13.2. Introduction

13.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity

13.3. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services Market Forecast

13.3.1. Market Value Forecast By Services

13.3.1.1. Assembly & Packaging services 

13.3.1.2. Testing services

13.3.1.2.1. Y-o-Y Growth Comparison, By Services

13.3.1.2.2. Basis Point Share (BPS) Analysis, By Services

13.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)

13.3.2.1. Copper/gold wire bonding

13.3.2.2. Copper Clip

13.3.2.3. Flip Chip

13.3.2.4. Wafer level Packaging

13.3.2.5. 3D TSV

13.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions

13.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions

13.3.3. Market Value Forecast By Applications

13.3.3.1. Communications

13.3.3.2. Computing and Networking

13.3.3.3. Consumer Electronics

13.3.3.4. Industrial

13.3.3.5. Automotive Electronics

13.3.3.5.1. Y-o-Y Growth Comparison, By Applications

13.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications

13.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis

13.3.4.1. By Services

13.3.4.2. By Packaging Solutions

13.3.4.3. By Applications

13.3.5. Drivers & Restraints: Impact Analysis

14. Latin America Semiconductor Assembly and Testing Services Market Analysis

14.1. Market overview

14.2. Introduction

14.2.1. Semiconductor Assembly and Testing Services Market Absolute $ Opportunity

14.3. Latin America Semiconductor Assembly and Testing Services Market Forecast

14.3.1. Market Value Forecast By Services

14.3.1.1. Assembly & Packaging services 

14.3.1.2. Testing services

14.3.1.2.1. Y-o-Y Growth Comparison, By Services

14.3.1.2.2. Basis Point Share (BPS) Analysis, By Services

14.3.2. Market Value Forecast By Packaging Solutions (Interconnecting technologies)

14.3.2.1. Copper/gold wire bonding

14.3.2.2. Copper Clip

14.3.2.3. Flip Chip

14.3.2.4. Wafer level Packaging

14.3.2.5. 3D TSV

14.3.2.5.1. Y-o-Y Growth Comparison, By Packaging solutions

14.3.2.5.2. Basis Point Share (BPS) Analysis, By Packaging solutions

14.3.3. Market Value Forecast By Applications

14.3.3.1. Communications

14.3.3.2. Computing and Networking

14.3.3.3. Consumer Electronics

14.3.3.4. Industrial

14.3.3.5. Automotive Electronics

14.3.3.5.1. Y-o-Y Growth Comparison, By Applications

14.3.3.5.2. Basis Point Share (BPS) Analysis, By Applications

14.3.4. Semiconductor Assembly and Testing Services Market Attractiveness Analysis

14.3.4.1. By Services

14.3.4.2. By Packaging Solutions

14.3.4.3. By Applications

14.3.5. Drivers & Restraints: Impact Analysis

15. Competition Landscape

15.1. Competition Dashboard

15.2. Competitive Strategies

15.3. Market Structure

15.4. Company Profiles

15.4.1. ASE Group

15.4.1.1. Revenue

15.4.1.2. Products/Brand Offerings

15.4.1.3. Company Highlights

15.4.2. Amkor Technology Inc.

15.4.3. STATS chipPAC Ltd. (JCET)

15.4.4. Powertech Technology Inc.

15.4.5. Silicon Precision Industries Company Ltd.

15.4.6. CORWIL Technology Corp.

15.4.7. Chipbond Technology Corporation

15.4.8. Integrated Microelectronics Inc.(Psi Technologies Inc.)

15.4.9. GlobalFoundries Inc.

List of Tables

Table 1: Global Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)

Table 2: Global Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn)

Table 3: Global Semiconductor Assembly and Testing Services Market Size Forecast By Applications (US$ Mn)

Table 4: Global Semiconductor Assembly and Testing Services Market Size Forecast By Geography (US$ Mn)

Table 5: North America Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)

Table 6: North America Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn)

Table 7: North America Semiconductor Assembly and Testing Services Market Value Forecast By Applications (US$ Mn)

Table 8: APAC Semiconductor Assembly and Testing Services Market Value Forecast By Country (US$ Mn)

Table 9: APAC Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)

Table 10: APAC Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn)

Table 11: APAC Semiconductor Assembly and Testing Services Market Value Forecast By Applications (US$ Mn)

Table 12: Taiwan Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)

Table 13: Taiwan Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn)

Table 14: Taiwan Semiconductor Assembly and Testing Services Market Value Forecast By Applications (US$ Mn)

Table 15: Europe Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)

Table 16: Europe Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn)

Table 17: Europe Semiconductor Assembly and Testing Services Market Value Forecast By Application (US$ Mn)

Table 18: Middle-East & Africa Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)

Table 19: Middle-East & Africa Semiconductor Assembly and Testing Services Market Value Forecast by Packaging solutions (US$ Mn)

Table 20: Middle-East & Africa Semiconductor Assembly and Testing Services Market Value Forecast By Application (US$ Mn)

Table 21: Latin America Semiconductor Assembly and Testing Services Market Value Forecast By Services (US$ Mn)

Table 22: Latin America Semiconductor Assembly and Testing Services Market Value Forecast By Packaging Solutions (US$ Mn)

Table 23: Latin America Semiconductor Assembly and Testing Services Market Value Forecast By Application (US$ Mn)

List of Figures

Figure 1: Global Semiconductor Assembly and Testing Services Market Incremental Opportunity, 2014–2021

Figure 2: Global Semiconductor Assembly and Testing Services Market Revenue by Services, 2014

Figure 3: Global Semiconductor Assembly and Testing Services Market Revenue By Application, 2014

Figure 4: Global Semiconductor Market Absolute $ Opportunity, 2014–2021

Figure 5: Global Semiconductor Market Y-o-Y Growth, 2014–2021

Figure 6: Global Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021

Figure 7: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth, 2014–2021

Figure 8: Global Semiconductor Assembly and Testing Services Market – Scenario Forecast

Figure 9: Market value of IoT devices, 2013 – 2020

Figure 10: Fluctuation in exchange rates, 2010–2015 (US$/NT$)

Figure 11: Global Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021

Figure 12: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021

Figure 13: Global Assembly & Packaging Services Segment Absolute $ Opportunity, 2014–2021

Figure 14: Global Testing services Segment Absolute $ Opportunity, 2014–2021

Figure 15: Global Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021

Figure 16: Global Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021

Figure 17: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021

Figure 18: Global Copper Wire & Gold Wire Bonding Segment Absolute $ Opportunity, 2014–2021

Figure 19: Global Copper Clip Segment Absolute $ Opportunity, 2014–2021

Figure 20: Global Flip Chip Segment Absolute $ Opportunity, 2014–2021

Figure 21: Global Wafer Level Packaging Segment Absolute $ Opportunity, 2014–2021

Figure 22: Global TSV Segment Absolute $ Opportunity, 2014–2021

Figure 23: Global Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021

Figure 24: Global Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021

Figure 25: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021

Figure 26: Global Communications Segment Absolute $ Opportunity, 2014–2021

Figure 27: Global Computing & Networking Segment Absolute $ Opportunity, 2014–2021

Figure 28: Global Consumer electronics Segment Absolute $ Opportunity, 2014–2021

Figure 29: Global Industrial Segment Absolute $ Opportunity, 2014–2021

Figure 30: Global Automotive electronics Segment Absolute $ Opportunity, 2014–2021    

Figure 31: Global Semiconductor Assembly and Testing Services Market Attractiveness by Application, 2015–2021    

Figure 32: Global Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Geography, 2014 & 2021    

Figure 33: Global Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Geography, 2014–2021    

Figure 34: Global Semiconductor Assembly and Testing Services Market Attractiveness by Geography, 2015–2021    

Figure 35: North America Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021    

Figure 36: North America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021    

Figure 37: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021    

Figure 38: North America Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021    

Figure 39: North America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021    

Figure 40: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021    

Figure 41: North America Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021    

Figure 42: North America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Application, 2014 & 2021

Figure 43: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021    

Figure 44: North America Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021    

Figure 45: APAC Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021    

Figure 46: APAC Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By countries, 2014 & 2021    

Figure 47: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison By countries, 2014–2021    

Figure 48: North America Semiconductor Assembly and Testing Services Market Attractiveness By countries, 2015–2021    

Figure 49: APAC  Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021    

Figure 50: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021    

Figure 51: North America Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021    

Figure 52: North America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021    

Figure 53: North America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021    

Figure 54: North America Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021    

Figure 55: APAC Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021    

Figure 56: APAC Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021    

Figure 57: APAC Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021    

Figure 58: Taiwan Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021    

Figure 59: Taiwan Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021    

Figure 60: Taiwan Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021    

Figure 61: Taiwan Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021    

Figure 62: Taiwan Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021    

Figure 63: Taiwan Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021    

Figure 64: Taiwan Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021    

Figure 65: Taiwan Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021    

Figure 66: Taiwan Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021    

Figure 67: Taiwan Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021    

Figure 68: Europe Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021    

Figure 69: Europe Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021    

Figure 70: Europe Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021    

Figure 71: Europe Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021    

Figure 72: Europe Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021    

Figure 73: Europe Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021    

Figure 74: Europe Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021    

Figure 75: Europe Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021    

Figure 77: Europe Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021    

Figure 78: MEA Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021    

Figure 79: MEA Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021    

Figure 80: MEA Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021    

Figure 81: MEA Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021    

Figure 82: MEA Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021

Figure 83: MEA Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021    

Figure 84: MEA Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021    

Figure 85: MEA Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis by Application, 2014 & 2021    

Figure 86: MEA Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021    

Figure 87: MEA Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021    

Figure 88: Latin America Semiconductor Assembly and Testing Services Market Absolute $ Opportunity, 2014–2021    

Figure 89: Latin America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Services, 2014 & 2021    

Figure 90: Latin America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Services, 2014–2021    

Figure 91: Latin America Semiconductor Assembly and Testing Services Market Attractiveness by Services, 2015–2021    

Figure 92: Latin America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Packaging Solutions, 2014 & 2021    

Figure 93: Latin America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Packaging Solutions, 2014–2021    

Figure 94: Latin America Semiconductor Assembly and Testing Services Market Attractiveness by Packaging Solutions, 2015–2021    

Figure 95: Latin America Semiconductor Assembly and Testing Services Market Value Share & BPS Analysis By Application, 2014 & 2021

Figure 96: Latin America Semiconductor Assembly and Testing Services Market Y-o-Y Growth Comparison by Application, 2014–2021    

Figure 97: Latin America Semiconductor Assembly and Testing Services Market Attractiveness by Applications, 2015–2021    

Figure 98: Market Share Analysis (%), 2014