I/O-Link Market

Name: I/O-Link Market
Brand: Future Market Insights
SKU: Electronics, Semiconductors, and ICT
Price: 5000 USD
Availability: InStock
Rating: 3.9 (15 reviews)

I/O-Link Market: Semiconductor & Electronics Vertical Sub-segment to Hold Prominent Share: Global Industry Analysis 2013-2017 and Opportunity Assessment 2018-2027

2019-01-23
REP-GB-8627
120 pages

An Incisive, In-depth Analysis on the I O Link Market

This study offers a comprehensive, 360 degree analysis on the I O Link market, bringing to fore insights that can help stakeholders identify the opportunities as well as challenges. It tracks the global I O Link market across key regions, and offers in-depth commentary and accurate quantitative insights. The study also includes incisive competitive landscape analysis, and provides key recommendations to market players on winning imperatives and successful strategies.

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I/O-Link systems and technologies find applications in advanced and automated industrial setups. I/O-Link systems comprise I/O-Link devices and I/O-Link masters. I/O-Link devices include modules, actuators, sensor nodes, RFID read heads and others. I/O-Link systems and technologies are making it possible to drive industrial communication from the lowest level of automation. I/O-Link devices offer various benefits such as open-standard according to IEC 61131-9, central data management, simple & standardised wiring, a significantly reduced variety of interfaces for actuators & sensors and consistent communication between actuators, sensors & controllers.

The Industrial Revolution 4.0 is Completely Transforming the Various Industry Verticals in Developed as well as Developing Economies

The global I/O-Link market is segmented on the basis of component, vertical, applications and by region. Based on component, the global I/O-Link market is sub-segmented into I/O-Link devices and I/O-Link masters. Due to the growing popularity of sensors, modules and actuators, the I/O-Links devices segment is expected to create potential growth opportunities for the vendors of I/O-Links. The I/O-Link devices sub-segment is projected to witness a double-digit growth rate during the forecast period. The I/O-Link devices sub-segment is also projected to create an incremental opportunity of US$ 5,781.4 Mn between 2018 and 2027. Moreover, the growing adoption of I/O-Link masters in field applications for automation in various industry verticals is estimated to create demand for I/O-Link masters during the forecast period.

Continuous Expansion of the Internet of Things (IoT) Ecosystem in Various Countries is One of the Major Factors Driving the I/O-Link Market

Furthermore, the continuous adoption of next-generation connected technologies, such as IoT (Internet of Things), industrial robotics and cloud technologies, is one of the prominent factors that is expected to boost the global I/O-Link market during the forecast period. The growth of the global automation industry and high-speed Internet technologies is expected to have a positive impact on the growth of the global I/O-Link market.

The Discrete Manufacturing Industry is Becoming a Key Source of Demand for I/O-Link Systems and Technologies

Based on the vertical, the global I/O-Link market is segmented into semiconductor & electronics, automotive, medical and others. Due to a shift from fieldbus to Ethernet protocols by various industries, the global I/O-Link market is projected witness a double-digit growth rate during the forecast period. The next-generation and advanced technologies, such as 5G wireless, Internet of Things (IoT), sensors & modules and carrier-grade Wi-Fi, are rapidly taking place in the manufacturing processes. Due to these factors, the automotive sub-segment is expected to create an incremental opportunity of US$ 2,066.8 Mn during the forecast period. In addition, the automotive industry is completely moving towards next-generation vehicle technologies such as vehicle-to-vehicle communication, driverless vehicles, electric vehicles and others. Due to these factors, the automotive sub-segment will be a target area for the providers of I/O-Link technology and systems in the coming years.

Adoption of Ethernet Communication Protocol in Various Industries for Efficiency and Greater Operating Safety is Boosting the Global I/O-Link Market

On the basis of applications, the global I/O-Link market is sub-segmented into handling assembly automation, intralogistics, machine tools and packaging. The handling assembly automation sub-segment is expected to witness a double-digit growth rate during the forecast period. Due to increasing automation in the assembly lines, handling assembly automation is also expected to create potential business opportunities for the vendors of I/O-Links. Furthermore, due to the growing adoption of advanced connected systems in various logistics processes, the intralogistics sub-segment is projected to exhibit a high CAGR during the forecast period.

Due to Increasing Foreign Direct Investment and the Increasing Commitment to 5G Technologies in India and China, the Asia Pacific Region is Expected to Grow at a High CAGR during the Forecast Period

Geographically, the Asia pacific I/O-Link market is expected to grow with a high CAGR during the forecast period owing to factors such as the ongoing technological advancements in the manufacturing sector and the increasing penetration of high-speed Internet connectivity.China and India are the major contributors to the growth of the Asia Pacific I/O-Link market. Growth in digitisation in India and China is one of the major factors boosting the I/O-Link market in these countries. As present, China is the most connected country in the world. Moreover, the Chinese government is undertaking initiatives to develop connected infrastructure. In addition, India is one of the fastest-growing economies in the world and governments are creating a favourable business environment for foreign investors. Owing to these factors, Asia Pacific is one of the prominent investment areas for the vendors of I/O-Links. Moreover, the North America region is becoming a key source of demand for I/O-Links because the adoption of advanced automation systems in North America is high as compared to other regions.

Market Participants

According to FMI analysis, business partnership with other I/O-Link manufacturers and long-term business contracts are projected to help the vendors of I/O-Links increase revenue from the market. In addition, new innovation strategies and research & development strategies will enable them to benefit from the new growth opportunities available in the I/O-Link market. Some of the major market participants profiled in the global I/O-Link market report are: Leuze electronic GmbH + Co. KG, SICK AG, OMRON Corporation, Pepperl+Fuchs, Rockwell Automation, Inc., Banner Engineering, Hans TURCK GmbH Co. KG, Siemens AG, Balluff GmbH and ifm electronic FZC.

Report Synopsis

Future Market Insights (FMI) offers a 9-year forecast of the I/O-Link between 2018 and 2027. In terms of value, the I/O-Link market is expected to register a double-digit CAGR during the forecast period. This study demonstrates the global I/O-Link market dynamics and trends across six regions: North America, Latin America, Europe, Japan, APEJ and MEA, which influence the current nature and the future status of the I/O-Link market over the forecast period.

Report Description

This I/O-Link market research report provides a detailed analysis of the I/O-Link market and offers insights on the various factors driving the popularity of I/O-Link systems. The I/O-Link market report includes an extensive analysis of key industry drivers, challenges, market trends and market structure. The I/O-Link market study provides a comprehensive assessment of the stakeholder strategies and imperatives for succeeding in the business. The report segregates the market based on product type, vertical, and different regions globally.

The I/O-Link market is expected to witness significant value growth during the forecast period owing to an increase in the demand for I/O-Link systems from various industry verticals and the increasing adoption of sensors, modules, actuators and connected devices in industrial communication.

The I/O-Link market report starts with an overview of the I/O-Link market in terms of value. In addition, this section includes an analysis of the key trends, drivers and challenges from the supply, demand and economy side, which are influencing the I/O-Link market.

A detailed analysis has been provided for every segment in terms of the market size analysis for the I/O-Link market across different regions. This section also provides a detailed analysis of the key trends of the I/O-Link market.

The next section contains a detailed analysis of the I/O-Link market across various countries in the region. It provides a market outlook for 2018–2027 and sets the forecast within the context of the I/O-Link market, which includes latest technological developments as well as offerings in the market. This I/O-Link market study discusses the key trends within countries contributing to the growth of the market, as well as analyses the degrees at which the drivers are influencing this market in each region. The key regions and countries assessed in the I/O-Link market report include North America (U.S. & Canada), Latin America (Brazil, Mexico & the rest of Latin America), Europe (Germany, U.K., Spain, France, Russia & the rest of Europe), Japan, APEJ (China, India, Malaysia, Singapore, Australia & the rest of APEJ) and MEA (GCC Countries, Israel, South Africa & the rest of MEA). This I/O-Link market report evaluates the present scenario and the growth prospects of the I/O-Link market across various regions globally for the period 2018 –2027. FMI has considered 2017 as the base year, and provided data for the remaining 12 months.

To offer an accurate forecast, we have started by sizing the current I/O-Link market, which forms the basis of how the I/O-Link market will grow in the future. Given the characteristics of the I/O-Link market, FMI has triangulated the outcome of different types of analysis based on technology trends.

As previously highlighted, the global I/O-Link is split into a number of segments. All the segments in terms of component, vertical, application and different regions are analysed in terms of the basis points to understand the relative contributions of individual segments to the growth of the I/O-Link market. This detailed information is important for the identification of the various key trends in the global I/O-Link market.

In addition, another key feature of the I/O-Link market report is the analysis of all the key segments in terms of absolute dollar opportunity. This is traditionally overlooked while forecasting a market. However, the absolute dollar opportunity is critical in assessing the level of opportunity that a provider can look to achieve, as well as to identify potential resources from a sales and delivery perspective in the global I/O-Link market.

In the final section of the I/O-Link market report, we have included a competitive landscape to provide clients a dashboard view based on the categories of providers in the value chain, their presence in the I/O-Link market and key differentiators. This section is primarily designed to provide clients an objective and detailed comparative assessment of key providers specific to a market segment in the I/O-Link supply chain, and the potential players for the same. Report audiences can gain segment-specific vendor insights to identify and evaluate the key competitors based on an in-depth assessment of their capabilities and success in the marketplace. The detailed profiles of providers are also included in the scope of the I/O-Link market report to evaluate their long-term and short-term strategies, key offerings and recent developments in the I/O-Link market. Some of the key competitors covered in the I/O-Link market report are: Leuze electronic GmbH + Co. KG, SICK AG, OMRON Corporation, Pepperl+Fuchs, Rockwell Automation, Inc., Banner Engineering, Hans TURCK GmbH Co. KG, Siemens AG, Balluff GmbH and ifm electronic FZC.

Key Segments

By Component
- I/O-Link Devices
- I/O-Link Masters
By Vertical
- Semiconductor and Electronics
- Automotive
- Medical
- Others
By Application
- Handling Assembly Automation
- Intralogistics
- Machine Tools
- Packaging