Analytical Study of Industrial Electronics Packaging in Japan from (2024 to 2034)

The adoption of industrial electronics packaging in Japan is estimated to rise at a 3.4% CAGR through 2034. The overall demand for industrial electronics packaging in Japan is likely to surge considerably, crossing a valuation of US$ 106.8 million in 2024. By 2034, sales projections for industrial electronics packaging in Japan indicate attaining a valuation of US$ 149.6 million.

Key Trends to Boost Sales through 2034:

  • The idea of combining diverse materials and components, such as semiconductors, MEMS (Micro-Electro-Mechanical Systems), and sensors, into a single package is gaining momentum. Japan-based manufacturers can be at the forefront of developing packaging solutions for heterogeneous integration.
  • Japan has a substantial healthcare technology industry. Packaging solutions for medical devices, wearables, and implanted electronics with rigorous biocompatibility and sanitation requirements could emerge as a unique trend.
  • Transparent electronics, such as transparent screens and sensors, can present unique packaging issues. To retain transparency while maintaining protection, Japanese manufacturers can innovate in this area.
  • The integration of artificial intelligence (AI) into the design and manufacture of electronic packaging to maximize performance, minimize errors, and increase production efficiency can grow into a trend in Japan.
  • Japan’s space industry can promote innovation in electronics packaging for space shuttles and satellites, where components must endure high temperatures and radiation.
Attributes Details
Industry Size in Japan in 2024 US$ 106.8 million
Expected Industry Size of Japan by 2034 US$ 149.6 million
Forecasted CAGR between 2024 to 2034 3.4%

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Key Insights - Highlights on the Emerging Opportunities in the Japan Industrial Electronics Packaging Industry

  • The rollout of 5G networks, as well as the expansion of the Internet of Things (IoT), are driving demand for packaging solutions for high-frequency and low-power electrical components.
  • With Japan's emphasis on high-quality manufacturing, modern quality assurance and testing services are in great demand. Opportunities exist for companies that provide quality control and reliability testing for electronic packaging materials.
  • Semiconductor packaging manufacturing equipment is in high demand. Companies that provide cutting-edge industrial packaging equipment can benefit from Japan's burgeoning semiconductor industry.
  • Identifying and catering to niche electronics markets, such as unique wearable gadgets, electronic fabrics, or customized sensors for specific purposes, can provide packaging firms with opportunities to serve these niche sectors.
  • A diverse range of objects from Japan's cultural history needs to be preserved. Museums, archives, and cultural organizations could hold potential for specialized packaging solutions that safeguard and preserve cultural goods.

Comparative View of Adjacent Industrial Electronics Packaging in Key Markets

The table showcases a comparative overview of industrial electronics packaging and its respective adoption rates in Japan, Korea, and at the global level. As per the analysis, the Japan's rich expertise in robotics and automation could end up in the development of collaborative robot packaging solutions that secure sensitive electronics while promoting human-robot interaction.

In Korea, the demand for electric vehicles is rising. To preserve and improve the performance of electronic components in electric cars, manufacturers can provide specific packaging solutions. This is likely to create additional revenue sources in the coming years.

At the global level, the development of customization and on-demand production can result in distinctive packaging solutions throughout the world. Flexible and cost-effective solutions for providing bespoke packaging for specialized applications can be developed by manufacturers.

Industry Analysis of Industrial Electronics Packaging in Japan:

Attributes Industry Analysis of Industrial Electronics Packaging in Japan
Japan CAGR between 2024 and 2034 3.4%
Industry Size of Japan in 2024 US$ 106.8 million
Key Trend in Japan Rising interest in collaborative robotics packaging
Key Challenge Short product lifecycles need incredible innovations

Demand for Industrial Electronics Packaging in Korea:

Attributes Demand for Industrial Electronics Packaging in Korea
CAGR (2024 to 2034) 4.1%
Valuation (2024) US$ 68.5 million
Key Trend Rising demand for packaging in electric vehicle components
Key Challenge Sustainability adds to increased costs and complexity

Opportunity Assessment for the Global Industrial Electronics Packaging Market:

Attributes Opportunity Assessment for the Global Industrial Electronics Packaging Market
CAGR (2024 to 2034) 3.8%
Valuation (2024) US$ 2,025.80 million
Key Trend Increasing demand for customizable on-demand packaging
Key Challenge Supply chain disruptions are hard to tackle
Ismail Sutaria
Ismail Sutaria

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Category-wise insights

Resilience in Harsh Environments Boosts Demand for Rigid Packaging

Leading Packaging Type for Industrial Electronics Packaging in Japan Rigid
Total Value Share (2024) 93.30%

Rigid packaging materials are becoming more popular due to their inherent capacity to endure harsh environmental conditions such as temperature variations, moisture exposure, and dust intrusion. This attribute makes them an obvious choice for enterprises operating in circumstances where maintaining product integrity is a must. This is highly relevant for industrial electronics packaging. Rigid packaging's operational efficiency and simplicity of handling translate into tangible advantages in the supply chain and logistics zone. Businesses can boost the effectiveness of their supply chains by streamlining their packaging and shipping operations.

High Versatility Boosts Demand for Plastic Packaging in the Industry

Leading Material Type for Industrial Electronics Packaging in Japan Plastic
Total Value Share (2024) 58.10%

Plastics are well-suited for a variety of manufacturing techniques, such as injection molding and 3D printing, which enable quick prototyping and efficient production processes. This operational efficiency helps businesses achieve their strategic goals of lowering time-to-market and increasing production agility. Businesses that choose recyclable and eco-friendly plastics reflect the growing emphasis on sustainability. This matches with CSR and regulatory compliance goals, resulting in a more sustainable supply chain and a favorable brand image.

Competitive Landscape

The competitive environment of industrial electronics packaging in Japan is characterized by a dynamic interaction of established domestic giants, ingenious niche companies, and global firms. These entities are actively fighting for a dominant position in the industry. Japan has a vibrant ecosystem as a global electronics manufacturing hub. Businesses in Japan are specialized in precise packaging solutions, ranging from semiconductor packaging to bespoke enclosures for a wide range of applications.

Through a strong focus on quality, innovation, and sophisticated production skills, key industry companies such as Japan's Taiyo Yuden Co., Ltd., Kyocera Corporation, and Ibiden Co., Ltd. have established themselves as pioneers in electronics packaging. These behemoths frequently define industry norms, bolstering their domination in the industry.

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Strategies for Key Players to Tap into Potential Growth Opportunities

  • Diversify product portfolios to cater to specialized consumer needs by tapping into emerging technologies such as 5G, IoT, and quantum computing.
  • Consider potential acquisitions or partnerships with innovative startups in the electronics packaging sector to integrate cutting-edge technologies into your product portfolio.
  • Improve efficiency through automation and robotics in manufacturing processes, lowering production costs and enhancing competitiveness.

Recent Developments in Industrial Electronics Packaging in Japan

  • In May 2023, Samsung announced plans to create a US$ 222 million packaging development facility in Yokohama, where the firm already has an research and development center. Samsung is reportedly seeking a US$ 74 million subsidy from the government of Japan to finance the project.
  • In March 2023, Samsung Electronics Co Ltd stated that it is contemplating establishing a chip packaging test line in Japan to support its advanced packaging business and develop stronger relationships with Japanese manufacturers of semiconductor materials and equipment. For Samsung, the leading memory chip manufacturer in the world, it is going to be the first of its kind in Japan.

Some of the Key Players in Industrial Electronics Packaging in Japan

  • Taiyo Yuden Co., Ltd.
  • Kyocera Corporation
  • Ibiden Co., Ltd.
  • JSR Corporation
  • Taihan Fiberoptics Co., Ltd.
  • Nitto Denko Corporation
  • TDK Corporation
  • Shinko Electric Industries Co., Ltd.

Scope of the Report

Attribute Details
Estimated Industry Size in 2024 US$ 106.8 million
Projected Industry Size by 2034 US$ 149.6 million
Anticipated CAGR between 2024 to 2034 3.4% CAGR
Historical Analysis of Demand for Industrial Electronics Packaging in Japan 2019 to 2023
Demand Forecast for Industrial Electronics Packaging in Japan 2024 to 2034
Report Coverage Industry Size, Industry Trends, Analysis of key factors influencing Industrial Electronics Packaging adoption in Japan, Insights on Global Players and their Industry Strategy in Japan, Ecosystem Analysis of Local and Regional Japan Manufacturers
Key Cities Analyzed While Studying Opportunities in Industrial Electronics Packaging in Japan Kanto, Chubu, Kinki, Kyushu & Okinawa, Tohoku, Rest of Japan
Key Companies Profiled Taiyo Yuden Co., Ltd.; Kyocera Corporation; Ibiden Co., Ltd.; JSR Corporation; Taihan Fiberoptics Co., Ltd.; Nitto Denko Corporation; TDK Corporation; Shinko Electric Industries Co., Ltd.

Key Segments

By Product Type:

  • Testing & Measuring Equipment
  • Process Control Equipment
  • Industrial Controls Power
  • Electronics Industrial Automation Equipment & Others

By Material Type:

  • Plastic
  • PE
  • PET
  • PS
  • PP
  • PVC
  • Paper & Board

By Packaging Type:

  • Rigid
  • Corrugated Boxes
  • Containers
  • Protective Packs
  • Trays
  • Clamshells
  • Bin & Totes
  • Others
  • Flexible
  • Bags & Pouches
  • Tapes & Labels
  • Films & Others

By City:

  • Kanto
  • Chubu
  • Kinki
  • Kyushu & Okinawa
  • Tohoku
  • Rest of Japan

Frequently Asked Questions

How Rapidly is the Demand for Industrial Electronics Packaging in Japan Growing?

The expected CAGR through 2034 stands at 3.4%.

What is the Demand Outlook for Industrial Electronics Packaging in Japan?

The demand for industrial electronics packaging in Japan is projected to reach US$ 149.6 million by 2034.

Which Trends Influence the Demand for Industrial Electronics Packaging in Japan?

Ecofriendly packaging trends highly influence this industry in Japan.

What Strategies are used by Industrial Electronics Packaging Manufacturers in Japan?

Industrial electronics packaging manufacturers emphasize technological innovation.

What is the Leading Material Type for Industrial Electronics Packaging in Japan?

Plastic material type is highly popular in this industry.

Table of Content

1. Executive Summary

    1.1. Japan Market Outlook

    1.2. Demand-side Trends

    1.3. Supply-side Trends

    1.4. Technology Roadmap Analysis

    1.5. Analysis and Recommendations

2. Market Overview

    2.1. Market Coverage / Taxonomy

    2.2. Market Definition / Scope / Limitations

3. Market Background

    3.1. Market Dynamics

        3.1.1. Drivers

        3.1.2. Restraints

        3.1.3. Opportunity

        3.1.4. Trends

    3.2. Scenario Forecast

        3.2.1. Demand in Optimistic Scenario

        3.2.2. Demand in Likely Scenario

        3.2.3. Demand in Conservative Scenario

    3.3. Opportunity Map Analysis

    3.4. Product Life Cycle Analysis

    3.5. Supply Chain Analysis

        3.5.1. Supply Side Participants and their Roles

            3.5.1.1. Producers

            3.5.1.2. Mid-Level Participants (Traders/ Agents/ Brokers)

            3.5.1.3. Wholesalers and Distributors

        3.5.2. Value Added and Value Created at Node in the Supply Chain

        3.5.3. List of Raw Material Suppliers

        3.5.4. List of Existing and Potential Buyer’s

    3.6. Investment Feasibility Matrix

    3.7. Value Chain Analysis

        3.7.1. Profit Margin Analysis

        3.7.2. Wholesalers and Distributors

        3.7.3. Retailers

    3.8. PESTLE and Porter’s Analysis

    3.9. Regulatory Landscape

        3.9.1. By Key Regions

    3.10. Regional Parent Market Outlook

    3.11. Production and Consumption Statistics

    3.12. Import and Export Statistics

4. Japan Industry Analysis and Outlook 2019 to 2023 and Forecast, 2024 to 2034

    4.1. Historical Market Size Value (US$ Million) & Volume (Units) Analysis, 2019 to 2023

    4.2. Current and Future Market Size Value (US$ Million) & Volume (Units) Projections, 2024 to 2034

        4.2.1. Y-o-Y Growth Trend Analysis

        4.2.2. Absolute $ Opportunity Analysis

5. Japan Industry Analysis and Outlook 2019 to 2023 and Forecast 2024 to 2034, By Material Type

    5.1. Introduction / Key Findings

    5.2. Historical Market Size Value (US$ Million) & Volume (Units) Analysis By Material Type, 2019 to 2023

    5.3. Current and Future Market Size Value (US$ Million) & Volume (Units) Analysis and Forecast By Material Type, 2024 to 2034

        5.3.1. Plastic

            5.3.1.1. Polyethylene terephthalate (PET)

            5.3.1.2. Polyethylene (PE)

            5.3.1.3. Polypropylene (PP)

            5.3.1.4. Polystyrene (PS)

            5.3.1.5. Polyvinyl chloride (PVC)

        5.3.2. Paper & Paperboard

    5.4. Y-o-Y Growth Trend Analysis By Material Type, 2019 to 2023

    5.5. Absolute $ Opportunity Analysis By Material Type, 2024 to 2034

6. Japan Industry Analysis and Outlook 2019 to 2023 and Forecast 2024 to 2034, By Packaging Type

    6.1. Introduction / Key Findings

    6.2. Historical Market Size Value (US$ Million) & Volume (Units) Analysis By Packaging Type, 2019 to 2023

    6.3. Current and Future Market Size Value (US$ Million) & Volume (Units) Analysis and Forecast By Packaging Type, 2024 to 2034

        6.3.1. Flexible

            6.3.1.1. Bags & Pouches

            6.3.1.2. Films & others

            6.3.1.3. Tapes & Labels

        6.3.2. Rigid

            6.3.2.1. Bin & Totes

            6.3.2.2. Clamshells

            6.3.2.3. Container & Shippers

            6.3.2.4. Corrugated Box

            6.3.2.5. Others

            6.3.2.6. Protective Packaging

            6.3.2.7. Trays

    6.4. Y-o-Y Growth Trend Analysis By Packaging Type, 2019 to 2023

    6.5. Absolute $ Opportunity Analysis By Packaging Type, 2024 to 2034

7. Japan Industry Analysis and Outlook 2019 to 2023 and Forecast 2024 to 2034, By Product Type

    7.1. Introduction / Key Findings

    7.2. Historical Market Size Value (US$ Million) & Volume (Units) Analysis By Product Type, 2019 to 2023

    7.3. Current and Future Market Size Value (US$ Million) & Volume (Units) Analysis and Forecast By Product Type, 2024 to 2034

        7.3.1. Industrial Automation Equipment & Others

        7.3.2. Industrial Controls

        7.3.3. Power Electronics

        7.3.4. Process Control Equipment

        7.3.5. Testing & Measuring Equipment

    7.4. Y-o-Y Growth Trend Analysis By Product Type, 2019 to 2023

    7.5. Absolute $ Opportunity Analysis By Product Type, 2024 to 2034

8. Japan Industry Analysis and Outlook 2019 to 2023 and Forecast 2024 to 2034, By Region

    8.1. Introduction

    8.2. Historical Market Size Value (US$ Million) & Volume (Units) Analysis By Region, 2019 to 2023

    8.3. Current Market Size Value (US$ Million) & Volume (Units) Analysis and Forecast By Region, 2024 to 2034

        8.3.1. Kanto

        8.3.2. Chubu

        8.3.3. Kinki

        8.3.4. Kyushu & Okinawa

        8.3.5. Tohoku

        8.3.6. Rest of Japan

    8.4. Market Attractiveness Analysis By Region

9. Kanto Industry Analysis and Outlook 2019 to 2023 and Forecast 2024 to 2034

    9.1. Historical Market Size Value (US$ Million) & Volume (Units) Trend Analysis By Market Taxonomy, 2019 to 2023

    9.2. Market Size Value (US$ Million) & Volume (Units) Forecast By Market Taxonomy, 2024 to 2034

        9.2.1. By Material Type

        9.2.2. By Packaging Type

        9.2.3. By Product Type

    9.3. Market Attractiveness Analysis

        9.3.1. By Material Type

        9.3.2. By Packaging Type

        9.3.3. By Product Type

    9.4. Key Takeaways

10. Chubu Industry Analysis and Outlook 2019 to 2023 and Forecast 2024 to 2034

    10.1. Historical Market Size Value (US$ Million) & Volume (Units) Trend Analysis By Market Taxonomy, 2019 to 2023

    10.2. Market Size Value (US$ Million) & Volume (Units) Forecast By Market Taxonomy, 2024 to 2034

        10.2.1. By Material Type

        10.2.2. By Packaging Type

        10.2.3. By Product Type

    10.3. Market Attractiveness Analysis

        10.3.1. By Material Type

        10.3.2. By Packaging Type

        10.3.3. By Product Type

    10.4. Key Takeaways

11. Kinki Industry Analysis and Outlook 2019 to 2023 and Forecast 2024 to 2034

    11.1. Historical Market Size Value (US$ Million) & Volume (Units) Trend Analysis By Market Taxonomy, 2019 to 2023

    11.2. Market Size Value (US$ Million) & Volume (Units) Forecast By Market Taxonomy, 2024 to 2034

        11.2.1. By Material Type

        11.2.2. By Packaging Type

        11.2.3. By Product Type

    11.3. Market Attractiveness Analysis

        11.3.1. By Material Type

        11.3.2. By Packaging Type

        11.3.3. By Product Type

    11.4. Key Takeaways

12. Kyushu & Okinawa Industry Analysis and Outlook 2019 to 2023 and Forecast 2024 to 2034

    12.1. Historical Market Size Value (US$ Million) & Volume (Units) Trend Analysis By Market Taxonomy, 2019 to 2023

    12.2. Market Size Value (US$ Million) & Volume (Units) Forecast By Market Taxonomy, 2024 to 2034

        12.2.1. By Material Type

        12.2.2. By Packaging Type

        12.2.3. By Product Type

    12.3. Market Attractiveness Analysis

        12.3.1. By Material Type

        12.3.2. By Packaging Type

        12.3.3. By Product Type

    12.4. Key Takeaways

13. Tohoku Industry Analysis and Outlook 2019 to 2023 and Forecast 2024 to 2034

    13.1. Historical Market Size Value (US$ Million) & Volume (Units) Trend Analysis By Market Taxonomy, 2019 to 2023

    13.2. Market Size Value (US$ Million) & Volume (Units) Forecast By Market Taxonomy, 2024 to 2034

        13.2.1. By Material Type

        13.2.2. By Packaging Type

        13.2.3. By Product Type

    13.3. Market Attractiveness Analysis

        13.3.1. By Material Type

        13.3.2. By Packaging Type

        13.3.3. By Product Type

    13.4. Key Takeaways

14. Rest of Japan Industry Analysis and Outlook 2019 to 2023 and Forecast 2024 to 2034

    14.1. Historical Market Size Value (US$ Million) & Volume (Units) Trend Analysis By Market Taxonomy, 2019 to 2023

    14.2. Market Size Value (US$ Million) & Volume (Units) Forecast By Market Taxonomy, 2024 to 2034

        14.2.1. By Material Type

        14.2.2. By Packaging Type

        14.2.3. By Product Type

    14.3. Market Attractiveness Analysis

        14.3.1. By Material Type

        14.3.2. By Packaging Type

        14.3.3. By Product Type

    14.4. Key Takeaways

15. Market Structure Analysis

    15.1. Competition Dashboard

    15.2. Competition Benchmarking

    15.3. Market Share Analysis of Top Players

        15.3.1. By Regional

        15.3.2. By Material Type

        15.3.3. By Packaging Type

        15.3.4. By Product Type

16. Competition Analysis

    16.1. Competition Deep Dive

        16.1.1. DS Smith Plc.

            16.1.1.1. Overview

            16.1.1.2. Product Portfolio

            16.1.1.3. Profitability by Market Segments

            16.1.1.4. Sales Footprint

            16.1.1.5. Strategy Overview

                16.1.1.5.1. Marketing Strategy

                16.1.1.5.2. Product Strategy

                16.1.1.5.3. Channel Strategy

        16.1.2. Smurfit Kappa Group Plc.

            16.1.2.1. Overview

            16.1.2.2. Product Portfolio

            16.1.2.3. Profitability by Market Segments

            16.1.2.4. Sales Footprint

            16.1.2.5. Strategy Overview

                16.1.2.5.1. Marketing Strategy

                16.1.2.5.2. Product Strategy

                16.1.2.5.3. Channel Strategy

        16.1.3. UFP Technologies Inc.

            16.1.3.1. Overview

            16.1.3.2. Product Portfolio

            16.1.3.3. Profitability by Market Segments

            16.1.3.4. Sales Footprint

            16.1.3.5. Strategy Overview

                16.1.3.5.1. Marketing Strategy

                16.1.3.5.2. Product Strategy

                16.1.3.5.3. Channel Strategy

        16.1.4. Sealed Air Corporation

            16.1.4.1. Overview

            16.1.4.2. Product Portfolio

            16.1.4.3. Profitability by Market Segments

            16.1.4.4. Sales Footprint

            16.1.4.5. Strategy Overview

                16.1.4.5.1. Marketing Strategy

                16.1.4.5.2. Product Strategy

                16.1.4.5.3. Channel Strategy

        16.1.5. Achilles Corporation

            16.1.5.1. Overview

            16.1.5.2. Product Portfolio

            16.1.5.3. Profitability by Market Segments

            16.1.5.4. Sales Footprint

            16.1.5.5. Strategy Overview

                16.1.5.5.1. Marketing Strategy

                16.1.5.5.2. Product Strategy

                16.1.5.5.3. Channel Strategy

        16.1.6. Desco Industries Inc.

            16.1.6.1. Overview

            16.1.6.2. Product Portfolio

            16.1.6.3. Profitability by Market Segments

            16.1.6.4. Sales Footprint

            16.1.6.5. Strategy Overview

                16.1.6.5.1. Marketing Strategy

                16.1.6.5.2. Product Strategy

                16.1.6.5.3. Channel Strategy

        16.1.7. Botron Company Inc.

            16.1.7.1. Overview

            16.1.7.2. Product Portfolio

            16.1.7.3. Profitability by Market Segments

            16.1.7.4. Sales Footprint

            16.1.7.5. Strategy Overview

                16.1.7.5.1. Marketing Strategy

                16.1.7.5.2. Product Strategy

                16.1.7.5.3. Channel Strategy

        16.1.8. Kiva Container Corporation

            16.1.8.1. Overview

            16.1.8.2. Product Portfolio

            16.1.8.3. Profitability by Market Segments

            16.1.8.4. Sales Footprint

            16.1.8.5. Strategy Overview

                16.1.8.5.1. Marketing Strategy

                16.1.8.5.2. Product Strategy

                16.1.8.5.3. Channel Strategy

        16.1.9. Orlando Products Inc.

            16.1.9.1. Overview

            16.1.9.2. Product Portfolio

            16.1.9.3. Profitability by Market Segments

            16.1.9.4. Sales Footprint

            16.1.9.5. Strategy Overview

                16.1.9.5.1. Marketing Strategy

                16.1.9.5.2. Product Strategy

                16.1.9.5.3. Channel Strategy

        16.1.10. Delphon Industries LLC

            16.1.10.1. Overview

            16.1.10.2. Product Portfolio

            16.1.10.3. Profitability by Market Segments

            16.1.10.4. Sales Footprint

            16.1.10.5. Strategy Overview

                16.1.10.5.1. Marketing Strategy

                16.1.10.5.2. Product Strategy

                16.1.10.5.3. Channel Strategy

17. Assumptions & Acronyms Used

18. Research Methodology

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