Advanced Packaging Market Outlook 2023 to 2033

The global advanced packaging market is anticipated to exhibit considerable growth at a CAGR of 7.2% in the forecast period between 2023 and 2033. The market is set to be valued at US$ 30.5 billion in 2023. A valuation of US$ 61.3 billion is expected for the global market by 2033.

Due to high demand from a variety of industries within the semiconductor sector, integrated circuit packaging has undergone continual change in terms of product attributes, integration, and energy efficiency.

Flip-chip and wafer-level packaging technologies have seen steady expansion over the years. This growth is attributed to their widespread use, particularly in high-end smartphones and tablets that must adhere to strict space and power management specifications.

Main purpose of the redistribution method was to enable fan-in area array packaging when just a small number of chips were required for the array. Since then, various innovative packaging technologies such as through-silicon via (TSV)-based interposers, wafer-level packaging, chip stacks, and fan-out packaging have all benefited greatly from this methodology.

Fan-out wafer-level packaging (FOWLP), which aims to fulfill the escalating demand for consumer electronics devices, has become a promising technology. Specific features of this type of packaging such as substrate-less packaging and low thermal resistance have made it immensely popular worldwide.

Importantly, it enables incredible performance thanks to its thin-film metallization-based direct integrated circuit connection and short interconnects. It does not make use of standard wire bonding or flip-chip bumps. It also has mild parasitic effects.

Fan-out wafer-level packaging is one of the most prominent packaging innovations in the microelectronics sector. Large substrate formats are being addressed with multiple technological developments for heterogeneous integration with the aid of this packaging.

It incorporates multiple die packaging, package-on-package approaches, passive component integration in packages & redistribution layers. As a result, it is ideal for squeezing in a super capacitor for energy storage along with a piezo-based harvester and power control unit to create a highly miniaturized energy harvester system.

Attributes Key Insights
Advanced Packaging Market Estimated Size (2023E) US$ 30.5 billion
Projected Market Valuation (2033F) US$ 61.3 billion
Value-based CAGR (2023 to 2033) 7.2%
CAGR of the USA Market (2023 to 2033) 6.6%

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How Will the Sales of Advanced Packaging between 2018 and 2022 Outpace the Demand from 2023 to 2033?

As per Future Market Insights, a renowned market research firm, from 2018 to 2022, the advanced packaging market surged at around 8.1% CAGR. The market is likely to be valued at US$ 61.3 billion by 2033 and create an absolute dollar opportunity of US$ 30.8 billion.

In order to reduce associated costs and improve the overall throughput and performance of integrated circuits, advanced packaging technology has developed. Demand for sophisticated packaging has elevated significantly in recent years due to rising deployment of semiconductor integrated circuits in automobiles.

An improvement in the functional density of large system-on-chip solutions is tied to improvements in packaging technologies. The chip industry has hence created a new set of solutions called advanced packaging in response to the emphasis on heterogeneous integrations and wafer-level packages.

The market for advanced packaging is being significantly impacted by growth in silicon size from 100 mm to 300 mm. Extended diameter wafers have lowered manufacturing costs by 20% to 25%, which is anticipated to spur investment in innovative packaging technologies.

Attributes Key Insights
Historical CAGR 8.1%
Historical Market Value (2022) US$ 28.3 billion
Forecast CAGR 7.2%

Top Trends Pushing Sales of Advanced Packaging Worldwide

  • Miniaturization of Electronics Devices to Augur Well by 2033

As compared to traditional semiconductor packaging, advanced packaging is gaining immense popularity across the globe. Miniaturization of electronics devices is helping advanced packaging sales to escalate worldwide.

High adoption of micro-electromechanical systems (MEMS) is further set to push sales of embedded die packaging solutions. Although the technology is not new, it has been specialized for niche uses owing to its high cost and limited yield. But, it has enormous potential for growth in the forecast period. Investments in the technology may increase as a result of developments in Bluetooth and radio frequency modules, as well as emergence of WiFi-6.

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Ismail Sutaria

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Country-wise Insights

Why is the USA Showcasing Exponential Sales of Advanced Packaging Solutions?

Key Players in the USA to Expand their Advanced Packaging Solutions Manufacturing Capacities

The USA advanced packaging market is expected to reach a valuation of US$ 9.9 billion by 2033. It is anticipated to exhibit 6.6% CAGR from 2023 to 2033. Key players in the USA are setting up fabrication facilities in the country for research and development activities.

They are striving to come up with advanced packaging technologies such as flip chip scale package, flip chip ball grid array, and fan-out wafer-level packaging. For instance, in May 2021, Intel Corporation announced that it invested US$ 3.5 billion in New Mexico in order to work on advanced packaging technologies and advanced packaging.

Intel also developed Foveros, which is its breakthrough 3D technology. This technology will provide the company with increased computing performance. Such advancements in the USA are projected to create new growth opportunities for advanced packaging manufacturers.

How are the United Kingdom-based Advanced Packaging Companies Faring?

Demand for Advanced Box and Packaging Solutions to Boom in the United Kingdom with Presence of Key Companies

The United Kingdom advanced packaging market is expected to be valued at US$ 1.7 billion by 2033. Between 2023 and 2033, the country is set to showcase a CAGR of 5.6%, says Future Market Insights. It is likely to create an incremental opportunity of about US$ 712.8 million throughout the assessment period.

Key companies based in the United Kingdom are estimated to develop new technologies to attract a large client base. In June 2019, for instance, WHP Engineering was given the task of building cleanrooms in Oxfordshire (United Kingdom) by Satellite Applications Catapult. WHP will work on the contract to expand a top-notch satellite manufacturing facility that aids the country’s space sector.

WHP's solution entails the delivery of an ISO Class 7 compliant cleanroom. It was developed by using 3D Building Information Modeling (BIM) modeling techniques to help finalize DISC’s need for a wide range of facilities. It will be utilized to finalize process & key utilities systems, machinery components, and architecture.

Why are Sales of Advanced Packaging Solutions Skyrocketing in China?

Semiconductor Manufacturers in China to Look for Advanced Flexible Packaging

China advanced packaging industry is expected to be worth US$ 15.5 billion by 2033. It is estimated to witness a significant CAGR of around 8.7% between 2023 and 2033. As per Future Market Insights, the country exhibited a CAGR of 10.3% from 2018 to 2022.

Given the rising demand from data centers and artificial intelligence, manufacturers in China are concentrating on expanding their clientele across North America. Presence of various semiconductor manufacturers in the country is another crucial factor that would augment advanced packaging demand. To meet the high demand from fabless vendors, the country’s pure-play manufacturers are expanding their production capacity.

Will South Korea Exhibit Elevating Demand for Advanced Packaging Solutions?

High Demand for Fast-charging Integrated Circuits in South Korea to Push Sales of Electronic Chips

In 2033, South Korea advanced packaging market is expected to be worth US$ 3.7 billion. The country is set to create an incremental opportunity of around US$ 1.9 billion in the next ten years, finds Future Market Insights.

South Korea-based companies are expected to draw a large client base by developing new technologies. In February 2020, for instance, HANA Micron, a semiconductor company headquartered in South Korea, used the wafer-level packaging process to expand the thickness of wiring by four times in a chip. The company aims to use this process to make fast-charging integrated circuits.

Category-wise Insights

Who is the Leading End User of Advanced Packaging Globally?

Advanced Packaging Technologies to Gain Impetus amid High Demand for Consumer Electronics

Based on end user, the consumer electronics segment is anticipated to dominate the global advanced packaging market in the next ten years. As per Future Market Insights, the segment is anticipated to exhibit a CAGR of around 7.0% from 2023 to 2033. It had witnessed a considerable CAGR of 7.7% during the historical period between 2018 and 2022.

Surging trend for advanced connected homes is projected to boost sales of consumer electronics. Various appliances equipped with new features such as Wi-Fi connectivity, Bluetooth, and voice assistance are set to be highly popular among millennials. With rising level of income worldwide, need to equip one’s home with latest technology-based products is surging. These factors would positively influence sales of advanced packaging for consumer electronics.

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Competition Landscape

Ten to fifteen big firms presently controlling the global advanced packaging market include Intel Corporation, ASE Technology Holding Co. Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., Amkor Technology Inc., Nepes Corporation, ChipMOS Technologies, Inc., Powertech Technology Inc., China Wafer Level CSP Co., Ltd., King Yuan Electronics Corp., HANA Micron Inc., and FlipChip International LLC among others.

The market is predominantly driven by half way point revenue due to the requirement for cutting-edge technology and quick-responding devices. Given the increasing need for unique solutions for numerous applications, these companies have a persistent competitive edge in this market. The industry is expected to benefit from ongoing advancements in tablets, smartphones, wireless communications, and other technologies.

Few of the recent developments in the advanced packaging market are

  • In October 2022, Amkor Technology declared their dedication to supporting initiatives in the Europe automotive sector. They are predicted to engage in enhanced semiconductor manufacturing in order to speed up the creation of technologies such as advanced driver assistance systems and infotainment for the automobile industry. In August 2022, Intel Corporation, a USA-based maker of integrated circuits, announced that the Meteor Lake, Arrow Lake, and Lunar Lake processors were produced by utilizing Foveros technology. The latest high-end graphics processing units 9GPUs) were built using embedded multi-die interconnect bridge (EMIB) and cutting-edge Foveros technology.
  • In November 2021, Amkor Technology, a USA-based developer of innovative packaging, revealed plans to establish a cutting-edge facility in Bac Ninh, Vietnam. It is anticipated that the plant will offer unique methods for package assembly and testing facilities to other semiconductor and fabrication companies throughout the world.
  • In August 2021, Amkor Technology disclosed their efforts to create cellular advancements using innovative packaging methods. In order to encapsulate radio frequency front end modules for 5G solutions and smartphones, the company is developing a double-sided molded ball grid array.

Scope of the Report

Attribute Details
Estimated Market Size (2023) US$ 30.5 billion
Projected Market Valuation (2033) US$ 61.3 billion
Value-based CAGR (2023 to 2033) 7.2%
Forecast Period 2023 to 2033
Historical Data Available for 2018 to 2022
Market Analysis Value (US$ billion)
Key Regions Covered North America; Latin America; Europe; East Asia; South Asia; and the Middle East & Africa
Key Countries Covered USA, Canada, Brazil, Mexico, Germany, United Kingdom, France, Italy, Spain, Nordic, Russia, Poland, China, India, Thailand, Indonesia, Australia and New Zealand, Japan, Gulf Cooperation Council countries, North Africa, South Africa, others.
Key Segments Covered Type, End User, Region
Key Companies Profiled Amkor Technology Inc.; ASE Technology Holding Co. Ltd.; China Wafer Level CSP Co. Ltd.; ChipMOS Technologies Inc.; FlipChip International LLC; HANA Micron Inc.; Jiangsu Changjiang Electronics Technology Co. Ltd.; King Yuan Electronics Corp.; Nepes Corporation; Powertech Technology Inc.
Report Coverage Market Forecast, Company Share Analysis, Competitive Landscape, Market Dynamics and Challenges, and Strategic Growth Initiatives

Advanced Packaging Market Outlook by Category

By Type:

  • Flip Chip Scale Package
  • Flip Chip Ball Grid Array
  • Wafer Level Chip Scale Packaging
  • 5D/3D
  • Fan Out Wafer-level Packaging
  • Others

By End User:

  • Consumer Electronics
  • Healthcare
  • Industrial
  • Aerospace and Defense
  • Automotive
  • Other

By Region:

  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Middle East & Africa

Frequently Asked Questions

How Big is the Advanced Packaging Market?

The advanced packaging market is worth US$ 30.5 billion in 2023.

What is the Projected CAGR of the Advanced Packaging Market?

The advanced packaging market is expected to thrive at a 7.2% CAGR through 2033.

Who is the Leading End-user in the Advanced Packaging Market?

The consumer electronics segment is leading the market with a 7.0% CAGR through 2033.

What Will be South Korea’s Advanced Packaging Market Size by 2033?

South Korea’s advanced packaging market size is poised to reach US$ 3.7 billion by 2033.

What is the CAGR of Japan’s Advanced Packaging Market?

Japan’s advanced packaging market may rise at a 10.3% CAGR through 2033.

Table of Content

1. Executive Summary | Advanced Packaging Market

    1.1. Global Market Outlook

    1.2. Demand-side Trends

    1.3. Supply-side Trends

    1.4. Technology Roadmap Analysis

    1.5. Analysis and Recommendations

2. Market Overview

    2.1. Market Coverage / Taxonomy

    2.2. Market Definition / Scope / Limitations

3. Market Background

    3.1. Market Dynamics

        3.1.1. Drivers

        3.1.2. Restraints

        3.1.3. Opportunity

        3.1.4. Trends

    3.2. Scenario Forecast

        3.2.1. Demand in Optimistic Scenario

        3.2.2. Demand in Likely Scenario

        3.2.3. Demand in Conservative Scenario

    3.3. Opportunity Map Analysis

    3.4. Investment Feasibility Matrix

    3.5. PESTLE and Porter’s Analysis

    3.6. Regulatory Landscape

        3.6.1. By Key Regions

        3.6.2. By Key Countries

    3.7. Regional Parent Market Outlook

4. Global Market Analysis 2018 to 2022 and Forecast, 2023 to 2033

    4.1. Historical Market Size Value (US$ billion) Analysis, 2018 to 2022

    4.2. Current and Future Market Size Value (US$ billion) Projections, 2023 to 2033

        4.2.1. Y-o-Y Growth Trend Analysis

        4.2.2. Absolute $ Opportunity Analysis

5. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Type

    5.1. Introduction / Key Findings

    5.2. Historical Market Size Value (US$ billion) Analysis By Type, 2018 to 2022

    5.3. Current and Future Market Size Value (US$ billion) Analysis and Forecast By Type, 2023 to 2033

        5.3.1. Flip Chip Scale Package

        5.3.2. Flip-Chip Ball Grid Array

        5.3.3. Wafer Level Chip Scale Package

        5.3.4. 5D/3D

        5.3.5. Fan Out Wafer-level Packaging

        5.3.6. Others

    5.4. Y-o-Y Growth Trend Analysis By Type, 2018 to 2022

    5.5. Absolute $ Opportunity Analysis By Type, 2023 to 2033

6. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By End User

    6.1. Introduction / Key Findings

    6.2. Historical Market Size Value (US$ billion) Analysis By End User, 2018 to 2022

    6.3. Current and Future Market Size Value (US$ billion) Analysis and Forecast By End User, 2023 to 2033

        6.3.1. Consumer Electronics

        6.3.2. Automotive

        6.3.3. Industrial

        6.3.4. Healthcare

        6.3.5. Aerospace & Defense

        6.3.6. Others

    6.4. Y-o-Y Growth Trend Analysis By End User, 2018 to 2022

    6.5. Absolute $ Opportunity Analysis By End User, 2023 to 2033

7. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Region

    7.1. Introduction

    7.2. Historical Market Size Value (US$ billion) Analysis By Region, 2018 to 2022

    7.3. Current Market Size Value (US$ billion) Analysis and Forecast By Region, 2023 to 2033

        7.3.1. North America

        7.3.2. Latin America

        7.3.3. Europe

        7.3.4. Asia Pacific

        7.3.5. Middle East and Africa

    7.4. Market Attractiveness Analysis By Region

8. North America Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country

    8.1. Historical Market Size Value (US$ billion) Trend Analysis By Market Taxonomy, 2018 to 2022

    8.2. Market Size Value (US$ billion) Forecast By Market Taxonomy, 2023 to 2033

        8.2.1. By Country

            8.2.1.1. USA

            8.2.1.2. Canada

        8.2.2. By Type

        8.2.3. By End User

    8.3. Market Attractiveness Analysis

        8.3.1. By Country

        8.3.2. By Type

        8.3.3. By End User

    8.4. Key Takeaways

9. Latin America Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country

    9.1. Historical Market Size Value (US$ billion) Trend Analysis By Market Taxonomy, 2018 to 2022

    9.2. Market Size Value (US$ billion) Forecast By Market Taxonomy, 2023 to 2033

        9.2.1. By Country

            9.2.1.1. Brazil

            9.2.1.2. Mexico

            9.2.1.3. Rest of Latin America

        9.2.2. By Type

        9.2.3. By End User

    9.3. Market Attractiveness Analysis

        9.3.1. By Country

        9.3.2. By Type

        9.3.3. By End User

    9.4. Key Takeaways

10. Europe Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country

    10.1. Historical Market Size Value (US$ billion) Trend Analysis By Market Taxonomy, 2018 to 2022

    10.2. Market Size Value (US$ billion) Forecast By Market Taxonomy, 2023 to 2033

        10.2.1. By Country

            10.2.1.1. Germany

            10.2.1.2. United Kingdom

            10.2.1.3. France

            10.2.1.4. Spain

            10.2.1.5. Italy

            10.2.1.6. Rest of Europe

        10.2.2. By Type

        10.2.3. By End User

    10.3. Market Attractiveness Analysis

        10.3.1. By Country

        10.3.2. By Type

        10.3.3. By End User

    10.4. Key Takeaways

11. Asia Pacific Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country

    11.1. Historical Market Size Value (US$ billion) Trend Analysis By Market Taxonomy, 2018 to 2022

    11.2. Market Size Value (US$ billion) Forecast By Market Taxonomy, 2023 to 2033

        11.2.1. By Country

            11.2.1.1. China

            11.2.1.2. Japan

            11.2.1.3. South Korea

            11.2.1.4. Singapore

            11.2.1.5. Thailand

            11.2.1.6. Indonesia

            11.2.1.7. Australia

            11.2.1.8. New Zealand

            11.2.1.9. Rest of Asia Pacific

        11.2.2. By Type

        11.2.3. By End User

    11.3. Market Attractiveness Analysis

        11.3.1. By Country

        11.3.2. By Type

        11.3.3. By End User

    11.4. Key Takeaways

12. Middle East and Africa Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country

    12.1. Historical Market Size Value (US$ billion) Trend Analysis By Market Taxonomy, 2018 to 2022

    12.2. Market Size Value (US$ billion) Forecast By Market Taxonomy, 2023 to 2033

        12.2.1. By Country

            12.2.1.1. Gulf Cooperation Council Countries

            12.2.1.2. South Africa

            12.2.1.3. Israel

            12.2.1.4. Rest of Middle East and Africa

        12.2.2. By Type

        12.2.3. By End User

    12.3. Market Attractiveness Analysis

        12.3.1. By Country

        12.3.2. By Type

        12.3.3. By End User

    12.4. Key Takeaways

13. Key Countries Market Analysis

    13.1. USA

        13.1.1. Pricing Analysis

        13.1.2. Market Share Analysis, 2022

            13.1.2.1. By Type

            13.1.2.2. By End User

    13.2. Canada

        13.2.1. Pricing Analysis

        13.2.2. Market Share Analysis, 2022

            13.2.2.1. By Type

            13.2.2.2. By End User

    13.3. Brazil

        13.3.1. Pricing Analysis

        13.3.2. Market Share Analysis, 2022

            13.3.2.1. By Type

            13.3.2.2. By End User

    13.4. Mexico

        13.4.1. Pricing Analysis

        13.4.2. Market Share Analysis, 2022

            13.4.2.1. By Type

            13.4.2.2. By End User

    13.5. Germany

        13.5.1. Pricing Analysis

        13.5.2. Market Share Analysis, 2022

            13.5.2.1. By Type

            13.5.2.2. By End User

    13.6. United Kingdom

        13.6.1. Pricing Analysis

        13.6.2. Market Share Analysis, 2022

            13.6.2.1. By Type

            13.6.2.2. By End User

    13.7. France

        13.7.1. Pricing Analysis

        13.7.2. Market Share Analysis, 2022

            13.7.2.1. By Type

            13.7.2.2. By End User

    13.8. Spain

        13.8.1. Pricing Analysis

        13.8.2. Market Share Analysis, 2022

            13.8.2.1. By Type

            13.8.2.2. By End User

    13.9. Italy

        13.9.1. Pricing Analysis

        13.9.2. Market Share Analysis, 2022

            13.9.2.1. By Type

            13.9.2.2. By End User

    13.10. China

        13.10.1. Pricing Analysis

        13.10.2. Market Share Analysis, 2022

            13.10.2.1. By Type

            13.10.2.2. By End User

    13.11. Japan

        13.11.1. Pricing Analysis

        13.11.2. Market Share Analysis, 2022

            13.11.2.1. By Type

            13.11.2.2. By End User

    13.12. South Korea

        13.12.1. Pricing Analysis

        13.12.2. Market Share Analysis, 2022

            13.12.2.1. By Type

            13.12.2.2. By End User

    13.13. Singapore

        13.13.1. Pricing Analysis

        13.13.2. Market Share Analysis, 2022

            13.13.2.1. By Type

            13.13.2.2. By End User

    13.14. Thailand

        13.14.1. Pricing Analysis

        13.14.2. Market Share Analysis, 2022

            13.14.2.1. By Type

            13.14.2.2. By End User

    13.15. Indonesia

        13.15.1. Pricing Analysis

        13.15.2. Market Share Analysis, 2022

            13.15.2.1. By Type

            13.15.2.2. By End User

    13.16. Australia

        13.16.1. Pricing Analysis

        13.16.2. Market Share Analysis, 2022

            13.16.2.1. By Type

            13.16.2.2. By End User

    13.17. New Zealand

        13.17.1. Pricing Analysis

        13.17.2. Market Share Analysis, 2022

            13.17.2.1. By Type

            13.17.2.2. By End User

    13.18. Gulf Cooperation Council Countries

        13.18.1. Pricing Analysis

        13.18.2. Market Share Analysis, 2022

            13.18.2.1. By Type

            13.18.2.2. By End User

    13.19. South Africa

        13.19.1. Pricing Analysis

        13.19.2. Market Share Analysis, 2022

            13.19.2.1. By Type

            13.19.2.2. By End User

    13.20. Israel

        13.20.1. Pricing Analysis

        13.20.2. Market Share Analysis, 2022

            13.20.2.1. By Type

            13.20.2.2. By End User

14. Market Structure Analysis

    14.1. Competition Dashboard

    14.2. Competition Benchmarking

    14.3. Market Share Analysis of Top Players

        14.3.1. By Regional

        14.3.2. By Type

        14.3.3. By End User

15. Competition Analysis

    15.1. Competition Deep Dive

        15.1.1. Amkor Technology Inc.

            15.1.1.1. Overview

            15.1.1.2. Product Portfolio

            15.1.1.3. Profitability by Market Segments

            15.1.1.4. Sales Footprint

            15.1.1.5. Strategy Overview

                15.1.1.5.1. Marketing Strategy

        15.1.2. ASE Technology Holding Co. Ltd.

            15.1.2.1. Overview

            15.1.2.2. Product Portfolio

            15.1.2.3. Profitability by Market Segments

            15.1.2.4. Sales Footprint

            15.1.2.5. Strategy Overview

                15.1.2.5.1. Marketing Strategy

        15.1.3. China Wafer Level CSP Co., Ltd.

            15.1.3.1. Overview

            15.1.3.2. Product Portfolio

            15.1.3.3. Profitability by Market Segments

            15.1.3.4. Sales Footprint

            15.1.3.5. Strategy Overview

                15.1.3.5.1. Marketing Strategy

        15.1.4. ChipMOS Technologies, Inc.

            15.1.4.1. Overview

            15.1.4.2. Product Portfolio

            15.1.4.3. Profitability by Market Segments

            15.1.4.4. Sales Footprint

            15.1.4.5. Strategy Overview

                15.1.4.5.1. Marketing Strategy

        15.1.5. FlipChip International LLC

            15.1.5.1. Overview

            15.1.5.2. Product Portfolio

            15.1.5.3. Profitability by Market Segments

            15.1.5.4. Sales Footprint

            15.1.5.5. Strategy Overview

                15.1.5.5.1. Marketing Strategy

        15.1.6. HANA Micron Inc.

            15.1.6.1. Overview

            15.1.6.2. Product Portfolio

            15.1.6.3. Profitability by Market Segments

            15.1.6.4. Sales Footprint

            15.1.6.5. Strategy Overview

                15.1.6.5.1. Marketing Strategy

        15.1.7. Jiangsu Changjiang Electronics Technology Co., Ltd.

            15.1.7.1. Overview

            15.1.7.2. Product Portfolio

            15.1.7.3. Profitability by Market Segments

            15.1.7.4. Sales Footprint

            15.1.7.5. Strategy Overview

                15.1.7.5.1. Marketing Strategy

        15.1.8. King Yuan Electronics Corp.

            15.1.8.1. Overview

            15.1.8.2. Product Portfolio

            15.1.8.3. Profitability by Market Segments

            15.1.8.4. Sales Footprint

            15.1.8.5. Strategy Overview

                15.1.8.5.1. Marketing Strategy

        15.1.9. Nepes Corporation

            15.1.9.1. Overview

            15.1.9.2. Product Portfolio

            15.1.9.3. Profitability by Market Segments

            15.1.9.4. Sales Footprint

            15.1.9.5. Strategy Overview

                15.1.9.5.1. Marketing Strategy

        15.1.10. Powertech Technology, Inc.

            15.1.10.1. Overview

            15.1.10.2. Product Portfolio

            15.1.10.3. Profitability by Market Segments

            15.1.10.4. Sales Footprint

            15.1.10.5. Strategy Overview

                15.1.10.5.1. Marketing Strategy

16. Assumptions & Acronyms Used

17. Research Methodology

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