Digitalization for All-weather Packaging – Big Picture Rendering Future of the Market
An upsurge in demand for fragile and sensitive industrial electronic products in various end-user industries will continue to prevail, giving rise to the need for all-weather protective packaging. Manufacturers will leverage increasing growth of the Internet of Things (IoT) market to stay ahead of the curve with the advent of fourth industrial revolution. The ongoing trend of digitalization will continue to transform the packaging industry, expanding the scope for implementing the IoT technology for offering sophisticated industrial electronics packaging solutions.
Industrial Electronics Packaging Market - Key Research Findings
Global industrial electronics packaging market size in 2018 – Over US$ 1.5 Bn
The global industrial electronics packaging market is expected to witness a CAGR of 4.1% during the forecast period, 2019-2029.
The growth of the industrial electronics packaging market in a region is observed to be closely related to the production of industrial electronics in that particular region.
Rigid packaging formats are most preferred when it comes to packaging of industrial electronics, and currently account for more than 90% of industrial electronics packaging consumption.
Among the various rigid packaging formats, corrugated boxes led the charts, followed by containers & shippers, in the year 2018.
Corrugated boxes will demonstrate highly promising growth potential in the global industrial electronics packaging market
These boxes are used to accommodate products of different shapes and sizes.
Moreover, they protect against potential damages during transit and have high-impact resistance.
North America is expected to remain the most prominent regional market for industrial electronics packaging.
North American market is expected to hold significant growth opportunities for the industrial electronics packaging market during the forecast period.
Established electronics industry, growth rate of electronics production, and growing demand for durable, impact-resistant, yet cost-effective packaging solutions are expected to bolster the demand for industrial electronics packaging during the period of forecast.
The US is expected to maintain dominance in terms of market share, while Canada is projected to register a steady CAGR during the forecast period.
South Asia represents remunerative growth potential for the industrial electronics packaging market. The flourishing consumer electronics industry in emerging countries has been constantly boosting the demand for reliable industrial electronics packaging solutions.
India’s industrial electronics packaging market is expected to expand 1.7X over 2019-2029.
Malaysia is expected to be a prominent market in the South Asian industrial electronics packaging market in terms of market share and incremental $ opportunity.
Top 3 Factors Shaping the Industrial Electronics Packaging Market
Evolving Electronics Industry to Bolster the Demand for Efficient Packaging
The burgeoning demand for high-performance, flexible circuits has resulted in hike in the demand for PCBs, ICs, and other electronic components. Tier 1 manufacturers operating in the industrial electronics industry have observed a sharp increase in the demand from both, developed and developing countries.
Moreover, research underlines that nearly 33% of electronic components get damaged due to lack of suitable packaging solutions, which signals the need for efficient packaging solutions that have been specifically designed for electronic devices and components. This factor will foster adoption of industrial electronics packaging solutions.
Use of Advanced Packaging Material for Industrial Electronics Packaging
When electronic components are packed together, static electricity is generated between them due to electrostatic induction, which can cause potential damage to packaged components. Therefore, ESD packaging solutions are used to protect ESD-prone electrical and electronic components during storage and transit. ESD packaging is the ideal protective packaging solution for the packaging of industrial electronics, as it eliminates the possibility of damage due to the generation of static charge in them.
However, manufacturers of industrial electronics packaging are using innovative materials, such as new static dissipative thermoplastics, to achieve superior packaging solutions for the industrial electronics industry. This material contains polymeric materials and carbon black that produce a constant and multiphase thermoplastics composite with highly consistent electrical and mechanical properties.
Device Miniaturization to Accelerate Demand for Individual Pack Sizes
Manufacturers of industrial electronics are leveraging their expertise across a wide range of manufacturing technologies to be competitive, which has pushed the demand for cutting-edge, lighter, and faster devices. With each new generation of electronic devices, consumers expect to receive more and more features in the smaller package than the one they already possess.
Manufacturers are focusing more on the research & development of new manufacturing technologies for micro-scale components. The overall scenario will benefit industrial electronics packaging manufacturers, as the miniature devices will need more individual pack sizes for storage and transport.
Industrial Electronics Packaging Market Structure Analysis
The global industrial electronics packaging market is classified on the basis of three-tier analysis, where tier-1 companies hold a prominent market share, and hold strong presence across the globe.
A few of the leading companies operating in the industrial electronics packaging market include DS Smith Plc., Smurfit Kappa Group Plc., and Sealed Air Corporation.
Most of the key players in the global industrial electronics packaging landscape are based out of the US or Europe, as electronics production is high in these regions.
Moreover, it has been observed that, a majority of the organized players operating in the global industrial electronics packaging market are focusing on strategic M&A activities to broaden their product portfolios, to eventually strengthen the global foothold in industrial electronics packaging market.
Replacing Plastic as a Packaging Material—Not-so-low Hanging Fruits
The world is developing intolerance to plastic with growing awareness about the negative environmental impacts of plastic pollution. With plastic being banned in most countries, market players are aiming to shift from plastic to paper-based packaging materials in industrial electronics packaging solutions. However, the performance characteristics of plastic are unmatched by any other alternatives, which is likely to translate into the steadily increasing adoption of plastic in the industrial electronics packaging market.
North America will Maintain the Lead with South Asia Creating New Growth Opportunities
North America is expected to hold nearly one-third revenue share of the industrial electronics packaging market with the United States registering remunerative growth in consumption of packaging products. Ever-growing demand for next-generation electronic products in North America’s industrial landscape will continue to enhance sales potential of industrial electronics packaging in the region. Meanwhile, South Asia’s electronics industry and increasing growth of the industrial sector in India and ASEAN countries will generate new sales opportunities for manufacturers in the region.
* This data is only a representation. Actual data may vary and will be available in report.
The Broader Perspective
The growing popularity of the miniaturization trend in the electronics industry will greatly influence the future trends of the market. Manufacturers are investing heavily in research & development to sync with the changing requirements of end-users and offer micro-scale and efficient industrial electronics packaging solutions in the coming years. With the increasing needs for high-quality solutions to miniaturized industrial electronic products, the adoption of cutting-edge manufacturing techniques will surge in the industrial electronics packaging market in the upcoming years.
Rigid industrial electronics packaging solutions account for a whopping 93% revenue share of the market.
The demand for flexible industrial electronics packaging solution will grow at a relatively faster rate in the coming future.
Industrial electronics packaging solutions for industrial controls will account for the largest revenue share of the market.
Demand for industrial electronics packaging solutions for process control equipment will increase at a rapid pace in the foreseeable future.
Plastic will remain the most sought-after packaging material in the market. Polyethylene will witness high demand among end-users.
The adoption of paper & board as a packaging material will remain significantly lower than plastic in the market.
How Growth will Unfold
Rigid packaging solutions will continue to remain high in demand in the industrial electronics packaging market with the high suitability of corrugated boxes, containers, and shippers as a packaging types of industrial electronic products. Innovations in flexible packaging materials is expected to emerge as an important trend in the market as bags & pouches are steadily increasing in popularity among end-users. Albeit small, the revenue share of flexible industrial electronics packaging solutions will increase steadily in the upcoming years.
Rigid | Flexible
* This data is only a representation. Actual data may vary and will be available in report.Click Here To Know How The Growth Will Unfold
Custom Market Research Services
FMI offers custom market research services that help clients to get information on their business scenario required where syndicated solutions are not enough.
Industrial Electronics Packaging Market: Global Industry Analysis 2014-2018 & Opportunity Assessment 2019-2029
A recent market study published by FMI, “Industrial Electronics Packaging Market: Global Industry Analysis 2014-2018 & Forecast 2019-2029” offers a comprehensive assessment of the most important market dynamics. After conducting thorough research on the historical, as well as current growth parameters of the industrial electronics packaging market, the growth prospects of the market are obtained with maximum precision.
Industrial Electronics Packaging Market Taxonomy
The global industrial electronics packaging market is segmented in detail to cover every aspect of the market and present complete market intelligence to the reader.
By Product Type
- Testing & Measuring Equipment
- Process Control Equipment
- Industrial Controls
- Power Electronics
- Industrial Automation Equipment
- Polyethylene (PE)
- Polyethylene Terephthalate (PET)
- Polypropylene (PP)
- Polystyrene (PS)
- Poly Vinyl chloride (PVC)
- Paper & Paperboard
By Packaging Type
- Corrugated boxes
- containers & shippers
- Protective packaging
- Bins & totes
- Bags & Pouches
- Tapes & Labels
- Films & Others
- North America
- Latin America
- South Asia
- East Asia
- Middle East & Africa
The report commences with the executive summary of the industrial electronics packaging market, which includes a summary of the key findings and statistics of the market. It also includes dominating segments in the global industrial electronics packaging market, along-with key facts about industrial electronics packaging. It also includes graphical representation of the segments according to market size and growth rate.
Readers can find detailed taxonomy and definition of the industrial electronics packaging market in this chapter, which will help them understand the basic information about industrial electronics packaging present in the market. This section also highlights the inclusions and exclusions, which help the reader understand the scope of the industrial electronics packaging market report.
The report provides key market trends that are expected to impact market growth significantly in the upcoming years. Detailed industry trends are provided in this section, along with key market developments or product innovations, which is likely to have a significant impact on industrial electronics packaging market.
This section explains the global market value & volume analysis and forecast for the industrial electronics packaging market between the forecast period of 2019-2029. It includes the detailed analysis of the historical industrial electronics packaging market, along with an opportunity analysis of the future. Readers can also find the absolute opportunity for the current year (2019 – 2020), and an incremental opportunity for the forecast period (2019 – 2029).
This section highlights the average pricing analysis of various packaging types of industrial electronics packaging, in different regions across the globe. The weighted average pricing at the manufacturer-level is analyzed in this section.
This chapter explains the key macro-economic factors that are expected to influence the growth of the industrial electronics packaging market over the forecast period. Along with macroeconomic factors, this section also highlights the opportunity analysis for the industrial electronics packaging market. This chapter also highlights the key market dynamics of the industrial electronics packaging market, which include the drivers and restraints. Moreover, readers will understand the key trends followed by the leading manufacturers in the industrial electronics packaging market. This section also covers Porter’s analysis, as well as the PESTLE analysis for the global industrial electronics packaging market.
Based on product type, the industrial electronics packaging market is segmented into testing & measuring equipment, process control equipment, industrial controls, power electronics, industrial automation equipment, and others. In this chapter, readers can find information about key attractive segments during the forecast period.
Based on applications, the industrial electronics packaging market is segmented into plastic and paper & paperboard. Plastic is further sub-segmented as polyethylene terephthalate (PET), polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP), and polystyrene (PS). In this chapter, readers can find information about key segments during the forecast period.
This chapter provides details about the industrial electronics packaging market on the basis of packaging type, and has been classified into rigid and flexible. The rigid segment is further sub-segmented as corrugated boxes, containers & shippers, protective packaging, trays, clamshells, bins & totes, and others while the flexible segment is sub-segmented as bags & pouches, tapes & labels, and films & others.
This chapter explains how the industrial electronics packaging market is expected to grow across various geographical regions, such as North America, Latin America, Europe, South Asia, East Asia, Oceania, and Middle East & Africa (MEA).
This chapter includes a detailed analysis of the growth of the North American industrial electronics packaging market, along with a country-wise assessment that includes the U.S. and Canada. Readers will also find some of key points on the basis of estimated market size and consumption of industrial electronics packaging.
Readers can find detailed information about several factors, such as the pricing analysis and the regional trends, which are impacting the growth of the Latin America Industrial Electronics Packaging market. This chapter also includes the growth prospects of the industrial electronics packaging market in leading LATAM countries such as Brazil, Mexico, Argentina, and the Rest of Latin America.
Important growth prospects of the industrial electronics packaging market based on the product and the end-user industry in several countries, such as Germany, the UK, France, Spain, Italy, Russia, BENELUX and the Rest of Europe, are included in this chapter.
India, Indonesia, Thailand, and Malaysia are the leading countries in the South Asia region that are the prime subjects of assessment to obtain the growth prospects of the South Asia industrial electronics packaging market in this chapter. Readers can find detailed information about the growth parameters of the South Asia industrial electronics packaging market during the period 2019-2029.
This chapter highlights the growth of the industrial electronics packaging market in East Asia by focusing on China, Japan, and South Korea. The section also highlights data points regarding the growth of the industrial electronics packaging market in the East Asian region.
In this chapter, Australia and New Zealand are among the leading countries in the Oceania region, which are the prime subjects of assessment to obtain the growth prospects of the Oceania industrial electronics packaging market.
This chapter provides information about how the industrial electronics packaging market will grow in major countries in the MEA region such as GCC Countries, South Africa, Turkey, Northern Africa, and the rest of MEA, during the forecast period 2019 - 2029.
This section provides the market forecasts and analysis for emerging countries, including India and China, based on key market segments considered. It also covers market attractiveness analysis by key segments, along with impact of the market dynamics and a brief overview of key players active in the region.
In this chapter, readers can find detailed information about the tier analysis and market concentration of key players in the industrial electronics packaging market along with their market presence analysis by region and product portfolio.
In this chapter, readers will find a comprehensive list of all leading manufacturers in the industrial electronics packaging market, along with detailed information about each company, including company overview, revenue shares, strategic overview, and recent company developments. Some of the market players featured in the report are DS Smith Plc., Smurfit Kappa Group Plc., UFP Technologies, Inc., Sealed Air Corporation, Achilles Corporation, Desco Industries Inc., Kiva Container Corporation, Orlando Products Inc., Delphon Industries, LLC, Summit Container Corporation, Protective Packaging Corporation, GWP Group Limited, Pure-Stat Engineered Technologies, Inc., AUER Packaging GmbH, Dou Yee Enterprises (S) Pte Ltd., Botron Company Inc. Emballages Cre-O-Pack International Inc., Dordan Manufacturing Company, Inc., and Universal Protective Packaging, Inc., among others.
This chapter includes a list of acronyms and assumptions that provide a base to the information and statistics included in the industrial electronics packaging report.
This chapter helps readers understand the research methodology followed to obtain various conclusions, as well as important qualitative and quantitative information about the industrial electronics packaging market.
How the research was conducted?
Primary research interviews with key opinion leaders and other participants were conducted for data collection and validation of the below information:
- Key Segments in the Industrial Electronics Packaging Market
- Market Share Analysis
- Average Selling Price (US$) and Market Growth
- Comparative Analysis of Several Oriented Packaging Films Present in the Market
- Market Size
- Key Trends & Developments
- Competition & Key Vendor Strategies
- Flexible Packaging Association
- Industry Journals
- Plastics Europe
- Electronics Industry Growth
- ESD Packaging Growth Analysis
- Annual Reports/SEC filings/Investor Presentations
Primary Interview Splits