Molded Interconnect Devices (MID) Market

Molded Interconnect Devices Market: - An Overview

Molded interconnect device is an injection molded plastic which incorporates a conductive pattern and integrates both mechanical and electrical functions. It’s the fusion between a plastic part and a copper traces which etched onto the surface of the plastic part, creating tracks and pads which can then house electrical components.

MIDs can be find across many industries and products, from medical to automotive industries and also in cell phones and tablets. MIDs make sense for these types of industries and products because of the need to have sleeker designs.

IoT technology is also impacting the molded interconnect device market, with sensors being placed in everyday objects like thermostats, light bulbs, and washing machines, it just makes sense to embed the circuitry directly inside the product.

Impact of COVID-19 Pandemic Outbreak

As there is worldwide lockdown situation due to COVID-19 pandemic the production of semiconductors is impacted as the raw material supply chain is disrupted. Historically, the market for semiconductor market has grown by almost 12.5% globally in the past 5 years.

But due to the COVID-19 outbreak, production of semiconductor products is projected to decline by nearly 6% in Q1-Q2 2020, due to low production across China’s factories, as they are one of the world’s major semiconductor product manufacturers and suppliers.

The semiconductor market’s downturn is also because of the outbreak’s impact on the entire industry. Lockdowns enforced by the spread of covid-19 worldwide have not only affected manufacturing of devices, but also dragged consumer demand.

Hence, as the production of such devices are impacted due to supply chain disruptions, the market for molded interconnect devices is estimated to decline in 2020 and would recover by Q3, 2021.

Nikhil Kaitwade

Principal Consultant

Talk to Analyst

Find your sweet spots for generating winning opportunities in this market.

Talk to Analyst

Molded Interconnect Devices Market: - Market Dynamics

Miniaturization of Molded Interconnect Devices is Rising the Market Demand

The use of molded interconnect devices is growing as a way to increase miniaturization of the final assembly while increasing device functionality. MID production processes enable direct integration of IC chips and small surface-mount devices (SMDs) into the molded housing.

These processes also allow the creation of recesses, channels, and openings for sensors, contact elements, etc. This geometrical flexibility enables interfacing features that facilitate the next level of packaging steps. Thus, MID technology enables highly cost effective production.

Demand is increasing for Molded Interconnect Devices in Healthcare

Molded Interconnect Device/Laser Direct Structuring capabilities combine the two-shot molding process for MID with the speed and precision associated with LDS to create medical-grade electronic devices for integration into blood glucose monitors, drug delivery systems, pulse oximeters, disposable catheter interfaces, CPAP devices, and neurostimulation controllers.

The MID/LDS capability allows medical device manufacturers to integrate complex electrical and mechanical features into compact devices. This capability ultimately addresses the miniaturization and convergence trends in the medical device industry.

Incompatibility with Electronic Packages Is Hindering the Growth of Molded Interconnect Devices Market

3D-MID technologies and further miniaturization is the incompatibility with modern area-array based electronic packages. Due to the lack of 3D-MID multilayer structures, the routing of such high count I/O devices becomes impossible. To overcome this limitation a 3D-MID multilayer process is necessary.

Then, the integration of complex semiconductors becomes possible and further miniaturization is feasible.  Thus, the incompatibility of molded interconnect device with electronic packages imposes a challenge in the molded interconnect device market growth.

Molded Interconnect Devices Market: - Key Players

Key players in the molded interconnect devices market are focusing on product merger and acquisitions with the technology vendors to offer two-shot molding and design software solutions for sustained business growth. The major players offering Molded Interconnect Devices solutions include

• Molex
• LPKF Laser & Electronics
• TE Connectivity
• HARTING
• Arlington Plating Company
• JOHNAN
• MID Solutions
• 2E Mechatronic
• Multiple Dimensions

The report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain of the global molded interconnect devices market. The report provides an in-depth analysis of parent market trends, macroeconomic indicators and governing factors along with molded interconnect devices market attractiveness as per segments.

The report on molded interconnect devices market also maps the qualitative impact of various factors on molded interconnect devices market segments and geographies.

Become a MarketNgage Insider

An unified Market Research Subscription Platform, built for today’s disparate research needs.

Sign-Up

Molded Interconnect Devices Market: - Segmentation

By Product Type, Molded Interconnect Devices Market is segmented into-

• Antennae and Connectivity Modules
• Sensors
• Connectors and Switches
• Lighting
• Others

By Industry, Molded Interconnect Devices Market is segmented into-

• Telecommunications
• Consumer Electronics
• Automotive
• Medical
• Industrial