Semiconductor Assembly And Testing Services Market

Semiconductor Assembly and Testing Services (SATS) Market: Revenue Contribution from the Consumer Electronics Segment Anticipated to Expand at 6.3% CAGR During the Forecast Period: Global Industry Analysis (2012-2016) and Opportunity Assessment (2017-2027)

  • 2020-01-23
  • REP-GB-2561
  • 261 pages
  • PDF PPT EXCEL
 Semiconductor Assembly And Testing Services Market

An Incisive, In-depth Analysis on the Semiconductor Assembly And Testing Services Market

This study offers a comprehensive, 360 degree analysis on the Semiconductor Assembly And Testing Services market, bringing to fore insights that can help stakeholders identify the opportunities as well as challenges. It tracks the global Semiconductor Assembly And Testing Services market across key regions, and offers in-depth commentary and accurate quantitative insights. The study also includes incisive competitive landscape analysis, and provides key recommendations to market players on winning imperatives and successful strategies.

Consumer Electronics segment to cement its dominance in the global semiconductor assembly and testing services (SATS) market in the coming years

On the basis of application, the global semiconductor assembly and testing services (SATS) market is segmented into communication, computing & networking, consumer electronics, industrial and automotive electronics. The consumer electronics segment is projected to grow at a value CAGR of 6.2% throughout the period of forecast. The consumer electronics segment is expected to lead the global market with a high market valuation during the forecast period, due to several factors such as growing penetration of smartphones and solid-state drives (SSDs), and increasing adoption of semiconductor assembly & testing services to meet customer expectations.

Semiconductor industry is highly volatile in nature. Major value market participants in this industry are fabless companies that focus on leveraging their resources in designing and utilizing their expertise in enhancing performance of the chipsets or ICs. Therefore, most of the semiconductor assembly, testing, and packaging related services are outsourced by fabless companies to third party providers known as ‘Outsourced Semiconductor Assembly and Test Service Providers’.

Asia Pacific Region to Offer Lucrative Growth Opportunities

The semiconductor assembly and testing services market is witnessing rapid growth in the Asia Pacific region due to increasing adoption of tablets and wearable devices. Semiconductor assembly and testing services market providers strive to expand their operations in China, South Korea, and India to unlock new growth avenues, attributable to growing demand for consumer electronics and vast expansion of electronic industries in these countries.

Additional Features Offered by Semiconductor Assembly and Testing Services Providers Over in-house Testing and Packaging Capabilities to Propel Sales

Semiconductor assembly and testing services offers different features such as flexibility for varying performance requirements utilizing multilayer organic build-up substrates, well-established process equipment expertise, proven construction, and lower stress on active area. Flip chip facilitates a higher number of interconnects as compared to packaging solutions employing wire bonding technology, as it uses the entire surface area of the die, and sometimes the perimeter as well. The reliability of such features drive growth of the semiconductor assembly and testing services market.

Frequently Asked Questions about Semiconductor Assembly and Testing Services Market

What are the future prospects of semiconductor assembly and testing services market?

The development of new semiconductor assembly and testing technologies such as wafer-level packaging (WLP) interconnecting technology and organic-substrate-interposer technology, etc. These technologies find application in various 3D packages, 3D integrated circuits, and image sensors due to their attributes such as low cost, improved test times, and scalability.

What are the major challenges for semiconductor assembly and testing services market?

A high capital requirement for high-end packaging solutions and market instability, which is a major challenge for the Semiconductor Assembly and Testing Services market.

Which industry will have significant revenue growth in the next five years?

The communications industry has been considered as largest revenue growth in the next five years due to semiconductor assembly and testing service providers have wider capability of offering additional features such as miniaturization, additional functionality, low power consumption, and improved thermal and electrical performance for communication industry. This is projected to offer significant growth opportunities for market players during the forecast period.

What are the major opportunities for semiconductor assembly and testing services market?

Increasing demand for mobility and connectivity in consumer electronic products and increasing use of safety systems in automobile industry, which is a major opportunities for the semiconductor assembly and testing services market

Which region is expected to be at forefront in the semiconductor assembly and testing services market?

Owing to significant demand for 3D packaging solutions environments from testing and packaging sectors, Asia Pacific excluding Japan is expected to remain at forefront of high growth opportunities. The demand for efficient technology for advanced packaging is expected to increase in the region, thereby providing lucrative opportunities for leading market players.

Who are the major companies leading semiconductor assembly and testing services market?

Prominent companies in the semiconductor assembly and testing services market includes ASE Group, Inc., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd, Powertech Technology, Inc., United Test and Assembly Center Ltd., JCET Group Co Ltd, Chipbond Technology Corporation., Global Foundries Inc., CORWIL Technology Corp., and among others.

Semiconductor Assembly and Testing Services Market: Global End-user Analysis 2014-2018 and Opportunity Assessment 2019-2029

A recent market study published by FMI on the semiconductor assembly and testing services market includes a global end-user analysis for 2014-2018 and opportunity assessment for 2019-2029, and delivers a comprehensive assessment of the most important market dynamics. After conducting a thorough research on the historical as well as current growth parameters, growth prospects of the market are obtained with maximum precision.

Semiconductor Assembly and Testing Services Market: Segmentation

The global semiconductor assembly and testing services market is segmented in detail to cover every aspect of the market and present a complete market intelligence approach to readers.

By Services

Applications  

Region

  • Assembly & Packaging Services
    • Copper Wire & Gold Wire Bonding
    • Flip Chip
    • Wafer Level Packaging
    • TSV
    • Others
  • Testing Services
  • Communications
  • Computing & Networking
  • Consumer Electronics
  • Industrial
  • Automotive Electronics
  • North America
  • Latin America
  • Western Europe
  • Eastern Europe
  • Asia Pacific excluding Japan
  • Japan
  • Middle East & Africa

Report Chapters

Chapter 01 – Executive Summary

The report begins with the executive summary of the semiconductor assembly and testing services market, which includes a summary of key findings and statistics of the market. It also includes the demand and supply-side trends pertaining to the market.

Chapter 02 – Market Overview

Readers can find the definition and detailed taxonomy of the semiconductor assembly and testing services market in this chapter, which will help them understand the basic information about the market. Along with this, comprehensive information pertaining to semiconductor assembly and testing services and its properties are provided in this section. This section also highlights the inclusions and exclusions, which help readers understand the scope of the semiconductor assembly and testing services market report.

Chapter 03 – Key Market Trends

The semiconductor assembly and testing services market report provides key market trends that are expected to significantly impact market growth during the forecast period. Detailed end-user trends are also provided in this section.

Chapter 04 – Key Success Factors

This section includes several factors that have emerged as key successful factors, and strategies adopted by key market participants.

Chapter 05 – Global Semiconductor Assembly and Testing Services Market Demand Analysis 2014-2018 and Opportunity Assessment 2019-2029

This section explains the global market value analysis and forecast for the semiconductor assembly and testing services market during the forecast period of 2019-2029. It includes a detailed analysis of the historical semiconductor assembly and testing services market, along with an opportunity analysis of the future. Readers can also find the absolute $ opportunity for the current year (2019), and an incremental $ opportunity for the forecast period (2019–2029). Along with this, the pricing analysis of the semiconductor assembly and testing services market at the regional level has also been provided in this section.

Chapter 06 – Market Background

This chapter explains the key macroeconomic factors that are expected to influence the growth of the semiconductor assembly and testing services market over the forecast period. Along with macroeconomic factors, this section also highlights the supply chain, forecast factors, and value chain analysis of the semiconductor assembly and testing services market. Moreover, in-depth information about the market dynamics and their impact analysis on the market have been provided in the successive section.

Chapter 07 – Global Semiconductor Assembly and Testing Services Market Analysis 2014-2018 and Opportunity Assessment 2019-2029 By Services

Based on services, the semiconductor assembly and testing services market is segmented into assembly & packaging services (copper wire & gold wire bonding, flip chip, wafer level packaging, TSV, and others, and testing services. In this chapter, readers can find information about key trends and developments in the semiconductor assembly and testing services market and market attractiveness analysis based on services.

Chapter 08 – Global Semiconductor Assembly and Testing Services Market Analysis 2014-2018 and Opportunity Assessment 2019-2029 by Applications

Based on applications, the semiconductor assembly and testing services market is segmented into communications, computing & networking, consumer electronics, industrial and automotive electronics. In this chapter, readers can find information about key trends and developments in the semiconductor assembly and testing services market and market attractiveness analysis based on Applications.

Chapter 09 – Global Semiconductor Assembly and Testing Services Market Analysis 2014-2018 and Opportunity Assessment 2019-2029 by Region

This chapter explains how the semiconductor assembly and testing services market is anticipated to grow across various geographic regions such as North America, Latin America, Western Europe, Eastern Europe, APEJ (Asia-Pacific excluding Japan), Japan, and the Middle East & Africa.

Chapter 10 – North America Semiconductor Assembly and Testing Services Market Analysis 2014-2018 and Opportunity Assessment 2019-2029

This chapter includes a detailed analysis on the growth of the North America semiconductor assembly and testing services market, along with a country-wise assessment that includes the U.S. and Canada. Readers can also find the pricing analysis, regional trends, and market growth based on services, applications, and countries in North America.

Chapter 11 – Latin America Semiconductor Assembly and Testing Services Market Analysis 2014-2018 and Opportunity Assessment 2019-2029

This chapter provides the growth scenario of the semiconductor assembly and testing services market in Latin American countries such as Brazil, Mexico, and the rest of Latin America. Along with this, assessment of the market across target segments has also been provided.

Chapter 12 – Western Europe Semiconductor Assembly and Testing Services Market Analysis 2014-2018 and Opportunity Assessment 2019-2029

Important growth prospects of the semiconductor assembly and testing services market in several countries such as Germany, UK, France, Spain, Italy, BENELUX, and the rest of Western Europe are included in this chapter.

Chapter 13 – Eastern Europe Semiconductor Assembly and Testing Services Market Analysis 2014-2018 and Opportunity Assessment 2019-2029

This chapter provides the growth scenario of the semiconductor assembly and testing services market in Eastern Europe countries such as Russia, Poland, and the rest of Eastern Europe.

Chapter 14 – Asia Pacific Excluding Japan Semiconductor Assembly and Testing Services Market Analysis 2014-2018 and Opportunity Assessment 2019-2029

This chapter highlights the growth of the semiconductor assembly and testing services market in the APEJ region by focusing on China, India, ASEAN, Australia, New Zealand, and the rest of APEJ. This section also help readers understand key factors that are responsible for the growth of the semiconductor assembly and testing services market in the APEJ region.

Chapter 15 – Japan Semiconductor Assembly and Testing Services Market Analysis 2014-2018 and Opportunity Assessment 2019-2029

This section also help readers understand key factors that are responsible for the growth of the semiconductor assembly and testing services market in Japan.

Chapter 16 – MEA Semiconductor Assembly and Testing Services Market Analysis 2014-2018 and Opportunity Assessment 2019-2029

This chapter provides information about how the semiconductor assembly and testing services market is anticipated to grow in major countries in the MEA region, such as GCC countries, South Africa, North Africa, Turkey, and the rest of MEA, during the forecast period of 2019-2029.

Chapter 17 – Market Structure Analysis

In this chapter, readers can find detailed information about the tier analysis and market concentration of key players in the semiconductor assembly and testing services market, along with their market presence analysis by region and product portfolio.

Chapter 18 – Competition Analysis

In this chapter, readers can find a comprehensive list of all the prominent stakeholders in the semiconductor assembly and testing services market, along with the detailed information about each company. This includes the company overview, revenue shares, strategic overview, and recent company developments. Some of the market players featured in the report are ASE Group, Inc., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd., Powertech Technology, Inc., United Test and Assembly Center Ltd., JCET Group Co Ltd, Chipbond Technology Corporation, and others.

Chapter 19 – Assumptions and Acronyms

This chapter includes a list of acronyms and assumptions that provides a base to the information and statistics included in the semiconductor assembly and testing services market report.

Chapter 20 – Research Methodology

This chapter help readers understand the research methodology followed to obtain various conclusions as well as important qualitative and quantitative information about the semiconductor assembly and testing services market.

Sources and Primary Research Splits (%):-

End-user Interactions:-

  • C - Level Executives
  • Marketing Directors
  • Sales Heads
  • Sales Executives
  • Technical Advisors
  • Semiconductor Assembly and Testing Services Providers
  • Distributors 
  • End-user Experts
  • End Users
  • Current Market Dynamics and Challenges
  • Market Characteristics
  • Market Performance and Growth Quadrants
  • Competition Structure and Market Structure
  • Strategic Growth Initiatives
  • Near Term and Long Term Market Growth Prospects
  • Market Segment Splits and Authenticity
  • Opinions on Market Projections and Validity of Assumptions

References Catalogue:-

  • Company White Papers
  • Annual Reports and Investor Presentations
  • Research Papers
  • Company Press Release 
  • Government Websites and Publications

Semiconductor Assembly And Testing Services Market Reports - Table of Contents

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Akshay Godge

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