Semiconductor Assembly And Testing Services Market

Semiconductor Assembly and Testing Services (SATS) Market: Revenue Contribution from the Consumer Electronics Segment Anticipated to Expand at 6.3% CAGR During the Forecast Period: Global Industry Analysis (2012-2016) and Opportunity Assessment (2017-2027)

  • 2018-01-31
  • REP-GB-2561
  • 261 pages
  • PDF PPT EXCEL
 Semiconductor Assembly And Testing Services Market

An Incisive, In-depth Analysis on the Semiconductor Assembly And Testing Services Market

This study offers a comprehensive, 360 degree analysis on the Semiconductor Assembly And Testing Services market, bringing to fore insights that can help stakeholders identify the opportunities as well as challenges. It tracks the global Semiconductor Assembly And Testing Services market across key regions, and offers in-depth commentary and accurate quantitative insights. The study also includes incisive competitive landscape analysis, and provides key recommendations to market players on winning imperatives and successful strategies.

Semiconductor industry is highly volatile in nature. Major value market participants in this industry are fabless companies that focus on leveraging their resources in designing and utilizing their expertise in enhancing performance of the chipsets or ICs. Therefore, most of the semiconductor assembly, testing, and packaging related services are outsourced by fabless companies to third party providers known as ‘Outsourced Semiconductor Assembly and Test Service Providers’.

Growing demand of consumer electronics, increasing integration of electronics and connectivity in automotive are major factors driving growth of the global Semiconductor Assembly and Testing Services (SATS) Market. However, high capital requirement and volatility in semiconductor industry is restraining the market growth of Semiconductor Assembly and Testing Services (SATS) Market.

Increasing demand for mobile and connected devices such as smartphones and tablets has fostered the demand for higher packaging technologies. Also, demand for digital video content has driven growth of a range of higher performance home automotive electronics products and mobile Consumer Electronics products, including Wi-Fi chipsets and other semiconductor chips. In 2014, STATS chipPAC (JCET) developed encapsulated Wafer Level Chip Scale Package (eWLCSP) that delivers enhanced quality and a lower cost fan-in wafer level package for space constrained mobile devices.

SATS providers have wider capability of offering additional features such as miniaturization, additional functionality, low power consumption, and improved thermal and electrical performance. This helps OSATS providers to obtain competitive edge over Integrated Design Manufacturers (IDM) having in-house testing capabilities. An overall increase in the semiconductor content within electronic products is expected to result in the provision of greater functionality and higher levels of performance. An overall increase in the semiconductor content within electronic products mandates greater functionality and higher levels of performance, which in turn is driving the revenue growth for OSATS providers.

Packaging and test service providers have resources and expertise to timely develop their capabilities and implement new packaging technologies in volume. For this reason, semiconductor companies and OEMs are leveraging capabilities of packaging and test service providers to introduce new products in the market within a short period of time.

Communication segment to cement its dominance in the global market in the coming years

On the basis of application, the global Semiconductor Assembly and Testing Services (SATS) Market is segmented into communication, computing & networking, consumer electronics, industrial and automotive . The communication segment is expected to lead the global market with a high market valuation during the forecast period. The communication segment is projected to grow at a value CAGR of 5.7% throughout the period of forecast. The computing and networking

The industrial segment is expected to reach a value of more than US$ 4 Bn by the end of the year (2027). This segment is projected to grow at a value CAGR of 4.8% during the period of forecast. Also, the automotive segment is poised to register a value CAGR of 5.5% and is expected to reach a value of about US$ 3.6 Bn by 2025 end.

Future Market Insights offers 10-year forecast for global semiconductor assembly and testing services (SATS) market between 2017 and 2027. This study demonstrates the market dynamics and trends globally across regions North America, Latin America, Europe, APAC (excluding Taiwan), Taiwan and Middle East and Africa (MEA) which influence the current nature and future status of the global semiconductor assembly and testing services (SATS) market over the forecast period.

Report Description

This research report provides detailed analysis global semiconductor assembly and testing services (SATS) market and offers insights on the various factors such as application and services provided by semiconductor assembly and testing services (SATS). The market study provides comprehensive assessment of stakeholder strategies and imperatives for succeeding in the business. The report segregates the market based on services and applications across different regions globally.

The report starts with an overview of the global semiconductor assembly and testing services (SATS) market in terms of value. In addition, this section includes analysis of key trends, drivers and restraints which are influencing the semiconductor assembly and testing services (SATS) market. Impact analysis of key growth drivers and restraints are included in this report to facilitate clients with crystal clear decision-making insights.

Global semiconductor assembly and testing services (SATS) market is categorized on the basis of services, application and region. On the basis of services, the market is segmented as assembly & packaging and testing. On the basis of application, global market is segmented into communication, computing & networking, consumer electronics, industrial and automotive.

A detailed analysis has been provided for every segment in terms of market size analysis for semiconductor assembly and testing services (SATS) across different regions. It provides a market outlook for 2017–2027 and sets the forecast within the context of the Semiconductor assembly and testing services (SATS) including latest technological developments as well as service offerings in the market. This study discusses key trends within regions contributing to growth of the market, as well as analyses degree at which drivers are influencing this market in regions. Key regions and countries assessed in this report include North America, Latin America, Europe, Asia Pacific excluding Taiwan (China, Japan, Singapore, Thailand and others), Taiwan and MEA.

This report evaluates the present scenario and the growth prospects of the semiconductor assembly and testing services (SATS) market across various regions globally for the period 2017 –2027. We have considered 2016 as the base year and provide data for the trailing 12 months. The forecasts presented here assesses the total revenue by value across the market. In order to offer an accurate forecast, we started by sizing the current market, which forms the basis of how the semiconductor assembly and testing (SATS) market will develop in the future. Given the characteristics of the market, we triangulated the outcome of different services and component and analyses, based on the technology trends.

In addition, it is imperative to note that in an ever-fluctuating global economy, we not only conduct forecasts in terms of CAGR, but also analyse on the basis of key parameters such as year-on-year (Y-o-Y) growth to understand the predictability of the market and to identify the right opportunities across the market.

In the final section of the report, we include a competitive landscape to provide clients with a dashboard view, based on categories of providers in the value chain, presence in semiconductor assembly and testing services (SATS) portfolio and key differentiators. This section is primarily designed to provide clients with an objective and detailed comparative assessment of key providers specific to a market segment in the semiconductor assembly and testing services (SATS) value chain and the potential players for the same. Report audiences can gain segment-specific vendor insights to identify and evaluate key competitors based on in-depth assessment of capabilities and success in the marketplace. Detailed profiles of providers are also included in the scope of the report to evaluate their long-term and short-term strategies, key offerings and recent developments in semiconductor assembly and testing services (SATS) space.

Key Segments Covered

By Services

By Packaging Solutions

By Application

By Region

  • Assembly and Packaging

  • Testing

  • Copper wire and Gold wire bonding

  • Copper clip

  • FlipChip

  • Wafer level packaging

  • TSV

  • Communication

  • Computing & networking

  • Consumer electronics

  • Industrial

  • Automotive

  • North America

  • Latin America

  • Europe

  • Asia Pacific excluding Taiwan

  • Taiwan

  • MEA

Semiconductor Assembly And Testing Services Market Reports - Table of Contents

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