Semiconductor Assembly And Testing Services Market By Services (Assembly & Packaging Services, Testing Services), Applications (Communications, Computing & Networking, Consumer Electronics, Industrial, Automotive Electronics) & Region - Forecast to 2017 - 2027
Semiconductor Assembly And Testing Services Market - Analysis, Outlook, Growth, Trends, Forecasts
- January 2020
- 261 pages
Consumer Electronics segment to cement its dominance in the global semiconductor assembly and testing services (SATS) market in the coming years
On the basis of application, the global semiconductor assembly and testing services (SATS) market is segmented into communication, computing & networking, consumer electronics, industrial and automotive electronics. The consumer electronics segment is projected to grow at a value CAGR of 6.2% throughout the period of forecast.
The consumer electronics segment is expected to lead the global market with a high market valuation during the forecast period, due to several factors such as growing penetration of smartphones and solid-state drives (SSDs), and increasing adoption of semiconductor assembly & testing services to meet customer expectations.
Semiconductor industry is highly volatile in nature. Major value market participants in this industry are fabless companies that focus on leveraging their resources in designing and utilizing their expertise in enhancing performance of the chipsets or ICs. Therefore, most of the semiconductor assembly, testing, and packaging related services are outsourced by fabless companies to third party providers known as ‘Outsourced Semiconductor Assembly and Test Service Providers’.
Asia Pacific Region to Offer Lucrative Growth Opportunities
The semiconductor assembly and testing services market is witnessing rapid growth in the Asia Pacific region due to increasing adoption of tablets and wearable devices. Semiconductor assembly and testing services market providers strive to expand their operations in China, South Korea, and India to unlock new growth avenues, attributable to growing demand for consumer electronics and vast expansion of electronic industries in these countries.
Additional Features Offered by Semiconductor Assembly and Testing Services Providers Over in-house Testing and Packaging Capabilities to Propel Sales
Semiconductor assembly and testing services offers different features such as flexibility for varying performance requirements utilizing multilayer organic build-up substrates, well-established process equipment expertise, proven construction, and lower stress on active area. Flip chip facilitates a higher number of interconnects as compared to packaging solutions employing wire bonding technology, as it uses the entire surface area of the die, and sometimes the perimeter as well. The reliability of such features drive growth of the semiconductor assembly and testing services market.
Market Research Methodology - Perfected through Years of Diligence
A key factor for our unrivaled market research accuracy is our expert- and data-driven research methodologies. We combine an eclectic mix of experience, analytics, machine learning, and data science to develop research methodologies that result in a multi-dimensional, yet realistic analysis of a market.
Frequently Asked Questions about Semiconductor Assembly and Testing Services Market
What are the future prospects of semiconductor assembly and testing services market?
The development of new semiconductor assembly and testing technologies such as wafer-level packaging (WLP) interconnecting technology and organic-substrate-interposer technology, etc. These technologies find application in various 3D packages, 3D integrated circuits, and image sensors due to their attributes such as low cost, improved test times, and scalability.
What are the major challenges for semiconductor assembly and testing services market?
A high capital requirement for high-end packaging solutions and market instability, which is a major challenge for the Semiconductor Assembly and Testing Services market.
Which industry will have significant revenue growth in the next five years?
The communications industry has been considered as largest revenue growth in the next five years due to semiconductor assembly and testing service providers have wider capability of offering additional features such as miniaturization, additional functionality, low power consumption, and improved thermal and electrical performance for communication industry. This is projected to offer significant growth opportunities for market players during the forecast period.
What are the major opportunities for semiconductor assembly and testing services market?
Increasing demand for mobility and connectivity in consumer electronic products and increasing use of safety systems in automobile industry, which is a major opportunities for the semiconductor assembly and testing services market
Which region is expected to be at forefront in the semiconductor assembly and testing services market?
Owing to significant demand for 3D packaging solutions environments from testing and packaging sectors, Asia Pacific excluding Japan is expected to remain at forefront of high growth opportunities. The demand for efficient technology for advanced packaging is expected to increase in the region, thereby providing lucrative opportunities for leading market players.
Who are the major companies leading semiconductor assembly and testing services market?
Prominent companies in the semiconductor assembly and testing services market includes ASE Group, Inc., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd, Powertech Technology, Inc., United Test and Assembly Center Ltd., JCET Group Co Ltd, Chipbond Technology Corporation., Global Foundries Inc., CORWIL Technology Corp., and among others.
Semiconductor Assembly and Testing Services Market: Segmentation
The global semiconductor assembly and testing services market is segmented in detail to cover every aspect of the market and present a complete market intelligence approach to readers.
- Assembly & Packaging Services
- Copper Wire & Gold Wire Bonding
- Flip Chip
- Wafer Level Packaging
- Testing Services
- Computing & Networking
- Consumer Electronics
- Automotive Electronics
- North America
- Latin America
- Western Europe
- Eastern Europe
- Asia Pacific excluding Japan
- Middle East & Africa