The Global Cloud Electronic Design Automation (EDA) market is projected to grow significantly, from USD 3,321.9 million in 2025 to USD 6,943.2 million by 2035 an it is reflecting a strong CAGR of 9.6%.
Organizations are more dependent than ever on external vendors and cloud-based platforms for Electronic Design Automation (EDA) solutions. With this reliance comes the need for third-party risk management, ensuring that any cloud-based collaboration does not open up security holes.
The data up to October 2023 in training Industries like automotive, healthcare and telecommunications have more to worry about because they need secure, high performance computing environment for semiconductor design and verification.
Organizations need compliance for cloud-based EDA as many stringent regulatory frameworks (ITAR (USA), GDPR (Europe), etc.) exist mandating security on data and intellectual property protections. Before moving to cloud service providers, organizations must perform enhanced risk assessments to comply with industry regulations. Automated risk management and security solutions are being integrated into Cloud EDA platforms due to compliance needs.
Global Cloud Electronic Design Automation (EDA)Market Assessment
Attributes | Description |
---|---|
Industry Size (2025E) | USD 3,321.9 million |
Industry Size (2035F) | USD 6,943.2 million |
CAGR (2025 to 2035) | 9.6% CAGR |
Companies are increasingly adopting Cloud EDA as a dynamic and collaborative platform for product design and development. As a result, you have the benefit of avoiding infrastructure expenses as well as accessing your data remotely, as well as more computational power in the cloud. This brings with it the need for strong third-party security measures to mitigate unauthorized access, data leaks, and breach of compliance.
As cyber threats and theft of intellectual property increase, real-time risk monitoring and compliance is becoming a key part of the Cloud EDA user experience. Cloud platforms are integrating continuous monitoring and AI-based risk assessments, enabling detection and mitigation of potential security vulnerabilities. These measures serve to protect sensitive semiconductor designs from foreign hands, and to prevent attempts by foreign interests to assert coercive control over such designs.
North America dominates the Cloud EDA market, driven by stringent cybersecurity regulations, high R&D investments accompany, and presence of top cloud-based EDA vendors. In fact, higher adoption is being driven by fast-growing semiconductor and electronics industries in Asia-Pacific countries such as India and China. With businesses all over the world adopting Cloud computing, demand for secure and compliant Cloud EDA solutions will escalate rapidly.
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Company | Synopsys, Inc. |
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Contract/Development Details | Secured a contract with a leading semiconductor company to provide cloud-based EDA tools, aiming to enhance chip design efficiency and reduce time-to-market. |
Date | February 2024 |
Contract Value (USD Million) | Approximately USD 50 |
Renewal Period | 3 years |
Company | Cadence Design Systems |
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Contract/Development Details | Partnered with a consumer electronics giant to deploy cloud EDA solutions for next-generation product development, focusing on scalability and collaboration. |
Date | August 2024 |
Contract Value (USD Million) | Approximately USD 45 |
Renewal Period | 4 years |
Rising complexity in semiconductor design is fueling demand for advanced Cloud EDA tools
The complexity of designing semiconductors is at an all-time high, with demands for chips to be smaller, more powerful, and more energy-efficient than ever. Cloud EDA (Electronic Design Automation) tools are emerging as the new heroes in an industry where traditional on premise EDA solutions are finding it increasingly difficult to meet the massive compute requirements of contemporary chip designs.
Especially with the advent of 3nm, 2nm process nodes, multi-die architectures, and AI-driven chips-- GEC's must deliver simulation, verification, and testing capabilities on a scale never before seen. Cloud EDA offers high-performance, scalable compute resources for designers to address the required trillion-transistor counts for next-gen chips.
Governments around the world now recognize this challenge and they continue to invest heavily in semiconductor R&D. For instance, one government program made USD 10 billion available for domestic semiconductor research, providing for the availability of state-of-the-art design tools.
Moreover, the trend toward heterogeneous integration and advanced packaging approaches also drives cloud EDA demand. As semiconductor designs become increasingly complex, multiple industries including automotive, telecommunications, and aerospace need to adopt cloud-based solutions to drive faster innovations while ensuring design fidelity. Cloud EDA enhances workflows and collaboration across global teams, so it is a critical enabler in modern chip development.
Shift to cloud-based workflows reduces infrastructure costs and accelerates time-to-market
The shift from on-premise EDA to cloud workflows are cutting infrastructure costs dramatically and improving design efficiency. Traditional semiconductor mRNA design typically utilizes high-performance servers, specialized cooling hardware, and more hardware with regular updates-bringing expensive cork and bottle breath into the design.
Cloud EDA On-demand compute without capital expenditure - Now you do not need to own and maintain the hardware. Switch-over to Cloud EDA The change is a focus for semiconductor companies that want to make the most of their production cycles. Another recent example of a government-supported semiconductor acceleration program is the USD 5 billion investment into cloud computing infrastructure specifically to help enable EDA development, so companies can use much faster, cost-effective design methodologies.
Cloud EDA also supports parallel processing and distributed computing, reducing chip design time by 30-50%, compared to conventional methods. Furthermore, the provision of real-time collaboration across teams in the world significantly improves productivity by eliminating any design process bottlenecks.
With automotive, AI, and 5G silicon production needing quick iterations, cloud-based workflows offer the flexibility to match advance deadlines for rolls off. Cloud EDA is enabling organizations to save on their infrastructure spending whilst also accelerating innovation across the board resulting in shorter design cycles and faster time to market.
Adoption of pay-per-use models is making Cloud EDA more cost-effective
Conventional EDA licensing models come with hefty upfront costs putting access to them out of reach for startups and mid-sized companies. Cloud-based subscription and usage-based pricing models enable businesses to pay only for the resources they consume, leading to a decrease in costs. A model particularly useful for companies involved with the design of AI-based chips, automotive semiconductors, and IoT devices, where the computing requirements change within the design life cycle.
There’s clearly a sense of urgency, as a government technology initiative recently unveiled a USD 2 billion fund to help semiconductor upstarts adopt Cloud EDA. Making hardware design easier and incentivizing innovation in chip design.
Also, major cloud providers are implementing hourly and consumption-based pricing models, reducing operational costs for semiconductor firms by 20-40%. Because Cloud EDA tends to scale with the design, companies can ramp up resources during peak design phases and scale down when they aren't needed, allowing them to maximize cost efficiency.
This pay-per-use model offers companies of all sizes the ability to leverage state-of-the-art EDA tools for chip design projects that continue to grow more complex, removing barriers to innovation and competitiveness in the semiconductor ecosystem-of the utmost importance as competition intensifies and systems drive growth in our increasingly connected world.
High data security concerns hinder adoption due to risks of intellectual property theft
Cloud EDA raises serious security concerns, especially relating to protecting intellectual property (IP) in chip design. The semiconductor industry is dependent on proprietary chip architectures, custom layouts, sensitive design blueprints that must be kept secret.
Transferring these assets to the cloud creates a greater risk of unauthorized access, data breaches and cyber espionage Targeted attacks pose particular risk to companies working on next-generation processors and AI chips, and defense-grade semiconductors, the designs of which can be extremely commercially and strategically valuable.
There is the multi-tenancy in cloud environments where more than one company utilizes cloud infrastructure. In the absence of hardcore isolation frameworks, tenant data leakage or cross-territory access may occur. Outside threats to cybersecurity like ransomware, phishing attacks, and insider breaches are another major hurdle. Cloud systems remain a magnet for hackers looking for a way in to access very valuable semiconductor design data, which they make repeated attempts to do exploiting vulnerabilities in such systems.
Market Shift | 2020 to 2024 |
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Regulatory Landscape | IP protection and data security regulations influenced cloud EDA adoption. |
Shift from On-Premise to Cloud | Transition from traditional EDA tools to SaaS-based solutions. |
AI Integration in Design Tools | AI-assisted layout and logic synthesis improved productivity. |
Collaboration & Accessibility | Cloud platforms enabled real-time collaboration across global teams. |
Market Growth Drivers | Increasing chip complexity and time-to-market pressure. |
Market Shift | 2025 to 2035 |
---|---|
Regulatory Landscape | AI-driven cloud security ensures dynamic compliance for semiconductor IP. |
Shift from On-Premise to Cloud | Quantum computing accelerates real-time design verification in the cloud. |
AI Integration in Design Tools | Fully autonomous AI-powered chip design and simulation platforms emerge. |
Collaboration & Accessibility | AI-driven digital twin environments allow interactive design iterations. |
Market Growth Drivers | AI-native design environment |
The section highlights the CAGRs of countries experiencing growth in the Cloud Electronic Design Automation (EDA) market, along with the latest advancements contributing to overall market development. Based on current estimates China, India and USA are expected to see steady growth during the forecast period.
Countries | CAGR from 2025 to 2035 |
---|---|
India | 12.9% |
China | 11.7% |
Germany | 7.3% |
Japan | 9.2% |
United States | 8.5% |
China's semiconductor sector has been growing at a breakneck pace, fueled by state-backed efforts to lessen dependence on foreign chipmakers. The Made in China 2025 policy and the National Integrated Circuit Industry Investment Fund have pumped billions of dollars into semiconductor R&D, creating a scenario in which Cloud EDA will be critical for speedily growing chip design bursts.
China's push for tech independence is prompting its domestic chip-makers to leverage cloud-based design processes to accelerate semiconductor development.
The government that underlined the need to bolster up semiconductor supply chains that has set aside over USD 50 billion to the research and development of chips. This resulted in a huge uptick in local EDA tools and cloud-based design platforms to accommodate the expanding fabless semiconductor market. In fact, Cloud EDA is being actively adopted by Chinese AI and 5G chip startups to shorten time-to-market and enhance design efficiency.
The Indian Semiconductor Industry has witnessed transformational changes with government support and digitalization reforms. The USD 10 billion Semicon India Program is focusing on enabling semiconductor design and manufacturing right within the country. That is why, under this movement, some fabless start-ups are being increasingly established, which is making cloud-based EDA solutions vital to lower infrastructure costs and increase design collaboration.
The Cloud EDA will help global chipmakers partner with the Indian government to establish semiconductor design hubs that facilitate remote collaboration between industries and AI-driven chip development. Moreover, the Production Linked Incentive (PLI) scheme for electronics manufacturing is spurring up large scale chip design investments, which is driving up adoption of pay-per-use cloud-based EDA tools.
Cloud-based semiconductor collaboration is on the rise in the United States, a shift spurred by growing complexities in chip design and a distributed workforce. The USA is home to leading chipmakers and EDA software providers, and the industry is quickly transitioning from on-premise design tools to cloud-hosted solutions that support real-time collaboration across global teams.
The CHIPS and Science Act, which includes USD 52 billion to support semiconductor research and production, has also driven Cloud EDA adoption thanks to government support. This month, the USA Department of Commerce announced USD 39 billion in chips incentives for semiconductor companies that will be accompanied by the use of advanced digital design tools as America hopes to sustain its chip innovation leadership.
The section provides detailed insights into key segments of the Cloud Electronic Design Automation (EDA) market. InProduct Type category,Semiconductor Intellectual Property segment is growing quickly. The Telecommunicationhold largest market share in Cloud Electronic Design Automation (EDA).
The relentless acceleration of semiconductor technologies to design functionality is raising demand for Semiconductor Intellectual Property (IP) designs while Cloud EDA solutions can help to substantially accelerate chips throughputs. Reusable pre-designed IP blocks are critical for reducing design cycles and costs, which is why as companies are trying to build next-gen AI, 5G, and IoT chips.
Cloud EDA platforms empower fabless semiconductor companies, IP vendors, and foundries to collaborate in real-time under a single platform, enabling expedited integration and validation of processor cores, memory controllers, and RF components.
This growth is further being fueled by the government initiatives as well. 000) in China was allocated 1.9 billion in government funding to promote domestic IP development to reduce dependence on foreign chip technologies. Likewise, in the USA there is the CHIPS and Science Act, which includes USD13.2 billion for semiconductor R&D, including IP innovation for next gen processors.
Such investments are driving rapid adoption of Cloud EDA, with companies seeking scalable, AI-driven verification tools to accommodate increased integration of complex IP.
Segment | Semiconductor Intellectual Property (Product Type) |
---|---|
CAGR (2025 to 2035) | 11.5% |
The telecommunication sector has the most significant market share and profitable growth due to rapid development in 5G, satellite communication, and high-speed networking technologies. Given the relative complexity found in next-generation processors, network-on-chip (NoC) architectures, and RF front-end modules, Cloud EDA tools are a necessity for processing multi-layered, fortification and high-recurrence plans. In base stations, data centers, and mobile devices, this demand for low-power, high-performance semiconductors is driving the move to cloud-based chip design workflows.
Worldwide governments are pouring investments into telecom infrastructure, which increases Cloud EDA adoption. Last month, the USA Federal Communications Commission (FCC) announced its largest six-year investment yet, USD 42 billion, to roll out 5G networks, creating ever-greater demand for custom RF chipsets and AI-powered telecom processors.
Likewise, China’s 14th Five-Year Plan includes a USD 200 billion commitment toward 6G research and advanced semiconductor development, which is accelerating the use of Cloud EDA for telecom chip innovation.
Segment | Telecommunication (Vertical) |
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Value Share (2025) | 24.8% |
The Cloud Electronic Design Automation (EDA) industry is experiencing a swift transformation, driven by the complexity of semiconductor devices, demands for faster time-to-market and growing adoption of AI and machine learning in chip design.
Cloud-based EDA platforms are critical for collaborative, scalable, and cost-effective design environments. Instead, major industry players are leveraging cloud infrastructure to provide sophisticated, flexible and integrated design environments. A mix of established EDA titans and innovative upstarts are reshaping the competitive landscape, working to reimagine the market through cloud-first approaches.
Company Name | Estimated Market Share (%) |
---|---|
Synopsys, Inc. | 30-35% |
Cadence Design Systems, Inc. | 25-30% |
Siemens EDA (Mentor Graphics) | 15-20% |
ANSYS, Inc. | 7-10% |
Keysight Technologies | 5-8% |
Other Companies (combined) | 12-18% |
Company Name | Key Offerings/Activities |
---|---|
Synopsys, Inc. | Offers cloud-optimized EDA tools for chip design, verification, and testing. Leverages AI for faster design cycles. Invests in digital twin technologies and collaborative workflows. |
Cadence Design Systems, Inc. | Provides integrated cloud EDA solutions including design, IP, verification, and system analysis. Focuses on multi-cloud deployment and machine learning integration. |
Siemens EDA (Mentor Graphics) | Delivers cloud-enabled solutions for PCB design, verification, and manufacturing. Enhances digital threads with cloud-based model-driven engineering. |
ANSYS, Inc. | Specializes in simulation-driven design for semiconductor and 3D IC packaging. Expands cloud deployment and integration with EDA workflows. |
Keysight Technologies | Offers cloud-enabled signal integrity, power integrity, and RF design tools. Invests in scalable simulation platforms and 5G/6G-ready EDA environments. |
Strategic Outlook
Synopsys, Inc. (30-35%)
Synopsys is the cloud EDA market leader with a comprehensive portfolio of tools that spans digital design, verification, IP, and secure silicon lifecycle solutions. It is continuing to develop AI techniques for PPA improvements, with a potential orders of magnitude speed-up for design iterations.
Synopsys, meanwhile, maintains partnerships with major cloud providers to facilitate expansion and remote access to EDA workflows. Because of its investment in digital twin technologies and secure design ecosystems, it is the most dominant force in the market.
Cadence Design Systems, Inc. (25-30%)
Cadence comes a close second with offerings like Cadence Cloud portfolio and Cadence Cerebrus for AI-enhanced design optimization that runs on cloud-native platforms. The designed solution enables easy deployment on public or private clouds. Cadence focuses heavily on bringing together design and verification in a unified manner that is an end-to-end cloud EDA experience. Multi-cloud and intelligent data orchestration approach is strategic, thus giving competitive advantage.
Siemens EDA (Mentor Graphics) (15-20%)
Siemens EDA (formerly Mentor Graphics) is a linchpin of PCB and system design. This technology helps the company round out its EDA tooling (which is embedded in the industrial cloud and digital twin ecosystem of Siemens). Siemenses emphasizes cloud-based model driven engineering and embedded software development in keeping with the broader Industry 4.0 initiative. Its capability to provide end-to-end hardware/software co-design and cloud collaboration puts it in a unique position in the market.
ANSYS, Inc. (7-10%)
ANSYS is boosting its simulation offering in the services EDA space, focused on 3d ICS and chip-package-system (CPS) co-design. Its physics-based simulation tools are integrated with EDA environments to enable end-to-end design validation in the cloud. ANSYS is bolstering partnerships with chip designers and cloud platforms to enable more highly scalable simulations. Its cloud-first approach seeks to democratize high-fidelity simulation for components critical to complex semiconductor applications.
Keysight Technologies (5-8%)
Keysight's cloud EDA offerings include signal integrity, power analysis, and RF simulation tools. It provides cloud-ready solutions to meet increasing demands in high-speed digital, 5G/6G and quantum computing. Keysight emphasizes flexible licensing models, scalable infrastructure, and real-time collaboration features that assist teams in speeding up their time-to-insight.
Other Key Players (12-18% Combined)
Companies like include Altium Limited, Zuken Inc., Silvaco Inc., Empyrean Technology. Altium and Zuken target the PCB design market with their cloud-enabled collaboration, as well as library management platforms. Silvaco: TCAD and analog/mixed-signal simulation with a growing cloud footprint.
Empyrean Technology is focused on the Chinese semiconductor market and encourages investing in domestic EDA and to also switch to the cloud. Together, these players encourage innovation and competitive stress on the international stage.
The Global Cloud Electronic Design Automation (EDA) industry is projected to witness CAGR of 9.6% between 2025 and 2035.
The Global Cloud Electronic Design Automation (EDA) industry stood at USD 3,321.9 million in 2025.
The Global Cloud Electronic Design Automation (EDA) industry is anticipated to reach USD 6,943.2 million by 2035 end.
South Asia & Pacific is set to record the highest CAGR of 11.2% in the assessment period.
The key players operating in the Global Cloud Electronic Design Automation (EDA) Industry Synopsys, Inc., Cadence Design Systems, Inc., Siemens EDA (Mentor Graphics), ANSYS, Inc., Keysight Technologies, Altium Limited, Zuken Inc., Silvaco Inc., Empyrean Technology, Xpeedic Technology.
In terms of Product Type, the segment is divided into Computer Aided Engineering, Semiconductor Intellectual Property, IC Physical Design & Verification and Printed Circuit Board & Multi-Chip Module.
In terms of Vertical, the segment is segregated into Automotive, Aerospace & Defense, Industrial, Healthcare, Telecommunication and Others.
A regional analysis has been carried out in key countries of North America, Latin America, East Asia, South Asia & Pacific, Western Europe, Eastern Europe and Middle East and Africa (MEA), and Europe.
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