Photonic Integrated Circuits (PIC) Market Snapshot (2022 to 2032)

[250 Pages Report] Newly released Photonic Integrated Circuits (PIC) Market analysis report by Future Market Insights shows that global sales of the Photonic Integrated Circuits (PIC) Market in 2021 was held at US$ 1.1 Billion. With 21.5% projected growth, the market from 2022 to 2032 is expected to reach a valuation of US$ 9.4 Billion. Optical Communications is expected to be the highest revenue-generating category, projected to register a projected CAGR of 21.5% from 2022 to 2032.

Attributes Details
Global Photonic Integrated Circuit Market Size (2022) US$ 1.3 Billion
Global Photonic Integrated Circuit Market Size (2032) US$ 9.4 Billion
Global Photonic Integrated Circuit Market CAGR (2022 to 2032) 21.5%
USA Photonic Integrated Circuit Market Size (2032) US$ 2.8 Billion
Key Companies Covered Agilent Technologies; Broadcom; Ciena Corporation; Enablence; II-VI Inc.; Hewlett Packard; Huawei Technologies Co., Ltd.; Infinera Corporation; Intel Corporation; Broadex Technologies Co., Ltd.; Cisco Systems, Inc.; MACOM; Mellanox Technologies; NeoPhotonics Corporation; Oclaro, Inc.; TE Connectivity; Uniphase Inc.; VLC Photonics S.L.; POET Technologies

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Revenue of Photonic Integrated Circuits (PIC) Market from 2017 to 2021 Compared to Demand Outlook for 2022 to 2032

As per the Photonic Integrated Circuits (PIC) Market research by Future Market Insights - a market research and competitive intelligence provider, historically, from 2017 to 2021, the market value of the Photonic Integrated Circuits (PIC) Market increased at around 25.5% CAGR.

The factors driving the growth of the photonic integrated circuit market are the downsizing of gadgets and the increase in the level of integration. This circuit supports high-speed data transfer, making it suitable for a wide range of applications in the industrial, aerospace, communications, utilities, and energy sectors, all of which are the key drivers of the photonic IC industry.

Photonic integrated circuits are in high demand for quantum computing and optical fiber sensing applications. Photonic integrated circuit corporations provide advantages such as simple photonic integrated circuit design with reduced energy consumption, smaller and faster goods, and efficient and eco-friendly products. When compared to traditional ICs, photonic integrated circuits have lower costs due to downsizing, a smaller size due to merging a large number of components and functions on a single chip, and enhanced power efficiency.

Photonics and fiber optics market growth is being accelerated by sophisticated breakthroughs and innovations. The growing need for high-speed and efficient data transmission in data centers presents growth prospects to the market. The rising demand for enhanced communication and processing needs, as well as flexible, downsized, and power-efficient circuits, are factors that will drive the growth of the photonic IC industry.

Communication between the photonic integration industry and potential end consumers might be challenging at times. While telecom has traditionally been the largest market for PICs, and the background for such applications is well understood, this is not always the case when dealing with other photonic integration solutions, such as quantum, sensing, or medical optics, where the technical background and language of customers can vary largely.

What Factors are Propelling the Demand for PIC?

The demand for Photonic Integrated Circuits is propelling due to a variety of factors like minimal cost, compact size, increased power optimization, and increased level of integration and functionality.

Photonic integrated circuits (ICs) make equipment design easier. The minimization of difficult production procedures aids in expanding manufacturing capacity and reduction in cost, making it attractive to users. Photonic integrated circuits allow a vast number of components and functionalities to be combined on a single chip. As a consequence, the number of components utilized is reduced, and the component's size is reduced as well.

When compared to photonic ICs, the number of functionalities packed into a single chip in electronic ICs is comparatively minimal. PICs acquire various advantages due to their high degree of integration, including size reduction, easy design, low cost, minimum heat dissipation, and power optimization. When compared to electrical ICs, photonic ICs have greater power efficiency. PICs generate significantly low heat during operation, thus resulting in increased power efficiency.

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Which Application Have Led to the Staggering Demand for Photonic Integrated Circuits (PIC)?

The use of Photonic Integrated Circuits (PIC) in optical communications is becoming more common, with a predicted CAGR of 21.5%. A rise in data traffic owing to increasing internet usage, an increase in the number of data centers, and an increase in the adoption of cloud-based and virtualization services are all driving the industry forward. The COVID-19 pandemic boosted demand for advanced networking equipment, propelling the market ahead during the forecast period.

Modern data center networks employ optical communication and networking equipment to meet their high bandwidth and extensible needs. Only optical communication technology has demonstrated capabilities of 40 GB/s, and greater across long distances. As a result, an increasing number of data centers throughout the world use interconnects to offer crucial communications connections between several servers, computing, and memory resources.

As more devices are being linked and new apps are developed, the volume of information going across the internet continues to expand. In 2021, IP data traffic is projected to witness 278,108 PB per month. Furthermore, with the growth in the number of smartphone users, internet usage will also grow, consequently leading to demand build-up for the PIC market.

Region-wise Analysis

Which Region is projected to Offer the Largest Opportunity for Photonic Integrated Circuits (PIC) Market?

North America is the most lucrative region with double-digit projected growth. In North America, demand for photonic integrated circuits (PIC)-based devices is being driven by data centers and internet applications of fiber optic communication. The growing demand for high-speed data transmission has raised cloud computing data traffic, and the increasing adoption of IoT has resulted in a potential boom in the photonic integrated circuit market in the region.

Mobile, video and cloud-based apps are increasing bandwidth usage, placing strain on service providers. Companies are expected to construct their optical networks around the PIC, propelling the sector ahead.

The requirement for high data transmission has raised cloud computing, and data traffic, and the increasing adoption of the Internet of Things has resulted in a potential boom in the photonic integrated circuit market in the region.

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Country-wise Analysis

Which Country Lies at the CenterStage for Photonic Integrated Circuits (PIC) Market Revenue?

The United States is expected to have the highest market share of US$ 2.8 Billion by the end of 2032 and account for approximately 30% of the global revenue. Increased demand for smart device integration and a favorable regulatory environment for the development of medium and small enterprises are expected to boost the US market.

Mobile, video and cloud-based applications are driving up bandwidth consumption, which is putting pressure on service providers. According to industry estimates, the number of Amazon Prime subscribers in the United States will exceed 153 Mn in 2022, up from 142.5 Mn in 2020. While this is a small proportion of the end–use market in the U.S., the overall market in the U.S. is significantly larger.

Category-wise Insights

Which Photonic Integrated Circuits (PIC) Segment is projected to Witness the Fastest Growth among Photonic Integrated Circuits (PIC) Type?

The Hybrid Integration segment is forecasted to grow at the highest CAGR of over 21.5% from 2022 to 2032. Hybrid integration provides a lot of revenue for companies in the photonic integrated circuits (PIC) industry. Most quantum applications require monolithic photonic systems to fulfill rigorous criteria. To circumvent the limitations of monolithic photonic circuits, companies are developing hybrid platforms that incorporate many photonic technologies into a single functional unit.

For product developers, hybrid integration provides yet another benefit. A complicated microsystem can be divided into several separate parts. After that, each unit is allocated to a different process engineer or group. Before integration, each unit may be designed and completely defined individually. To reduce fabrication costs, units of the same kind can be manufactured at the maximum spatial density on a single substrate.

Monolithic manufacturing provides advantages for devices with basic architectures, such as compact layouts and facile encapsulation. However, since several manufacturing procedures and materials are incompatible, microdevices with complicated functions or structures must be built using the hybrid integration of several components from various fabrication processes.

Competitive Analysis

The leading PIC Market players are Agilent Technologies, Broadcom, Ciena Corporation, Enablence, II-VI Inc., Hewlett Packard, Huawei Technologies Co., Ltd., Infinera Corporation, Intel Corporation, Broadex Technologies Co., Ltd., Cisco Systems, Inc., MACOM, Mellanox Technologies, NeoPhotonics Corporation, Oclaro, Inc., TE Connectivity, Uniphase Inc., VLC Photonics S.L. and POET Technologies. To gain a competitive advantage in the industry, these players are investing in product launches, partnerships, mergers and acquisitions, and expansions.

Some of the key recent developments in the Global PIC Market are as follows:

  • In February 2022, Ayar Labs, a photonic chip provider with circuits that carry data between processors significantly faster than typical metal interconnects, announced a "multi-year strategic agreement" with Hewlett Packard Enterprise.
  • In October 2020, Sanan IC, the world's largest LED manufacturer announced that it has inked a US$ 50 Mn Joint Venture Agreement with POET Technologies. Super Photonics Xiamen Co., Ltd, the company's subsidiary, has also applied for registration. This is expected to offer transceiver module makers, systems vendors, data center operators, and network providers throughout the world a new generation of cost-effective, high-performance optical engines.
  • In May 2022, to increase reliability and performance across all operating scenarios, Cisco announced that it has combined new predictive technologies with its comprehensive portfolio of observability, visibility, and intelligence capabilities.

Similarly, recent developments related to companies in Photonic Integrated Circuits (PIC) services have been tracked by the team at Future Market Insights, which are available in the full report.

Market Segments Covered in Photonic Integrated Circuits (PIC) Market Analysis

By Integration Type:

  • Monolithic Integration PIC
  • Hybrid Integration PIC
  • Module Integration PIC

By Application:

  • Optical Communications
  • Sensing
  • Bio-photonics
  • Optical Signal Processing

By Raw Materials:

  • Indium Phosphide
  • Gallium Arsenide
  • Lithium Niobate
  • Silicon
  • Silica-on-Insulator
  • Others

By Components:

  • Lasers
  • Modulators
  • Detectors
  • Attenuators
  • MUX/DEMUX
  • Optical Amplifiers

By Region:

  • North America
  • Europe
  • Asia Pacific
  • RoW

Frequently Asked Questions

How much is the current worth of the Photonic Integrated Circuits (PIC) Market?

The global Photonic Integrated Circuits (PIC) Market is worth more than US$ 1.1 Bn at present.

What is the sales forecast for Photonic Integrated Circuits (PIC) Market?

Value of Photonic Integrated Circuits (PIC) Market are projected to increase at a CAGR of around 21.5% during 2022 – 2032.

What was the last 5 year’s market CAGR?

Value of Photonic Integrated Circuits (PIC) Market increased at a CAGR of around 25.5% during 2017 – 2021.

What is a key trend shaping the growth of Photonic Integrated Circuits (PIC) Market?

The Internet of Things (IoT), cloud, streaming video, 5G, and several other innovations are causing the Photonic Integrated Circuit Market to grow enormously in order to meet market demand.

At what percentage is sales of Photonic Integrated Circuits (PIC) Market going to register growth in US?

The market for Photonic Integrated Circuits (PIC) Market in US is projected to expand at a CAGR of around 21.1% during 2022 – 2032.

Table of Content
1. Executive Summary
    1.1. Global Market Outlook
    1.2. Demand-side Trends
    1.3. Supply-side Trends
    1.4. Technology Roadmap Analysis
    1.5. Analysis and Recommendations
2. Market Overview
    2.1. Market Coverage / Taxonomy
    2.2. Market Definition / Scope / Limitations
3. Market Background
    3.1. Market Dynamics
        3.1.1. Drivers
        3.1.2. Restraints
        3.1.3. Opportunity
        3.1.4. Trends
    3.2. Scenario Forecast
        3.2.1. Demand in Optimistic Scenario
        3.2.2. Demand in Likely Scenario
        3.2.3. Demand in Conservative Scenario
    3.3. Opportunity Map Analysis
    3.4. Investment Feasibility Matrix
    3.5. PESTLE and Porter’s Analysis
    3.6. Regulatory Landscape
        3.6.1. By Key Regions
        3.6.2. By Key Countries
4. Global Market Analysis 2017-2021 and Forecast, 2022-2032
    4.1. Historical Market Size Value (US$ Mn) Analysis, 2017-2021
    4.2. Current and Future Market Size Value (US$ Mn) Projections, 2022-2032
        4.2.1. Y-o-Y Growth Trend Analysis
        4.2.2. Absolute $ Opportunity Analysis
5. Global Market Analysis 2017-2021 and Forecast 2022-2032, By Integration Type
    5.1. Introduction / Key Findings
    5.2. Historical Market Size Value (US$ Mn) Analysis By Integration Type, 2017-2021
    5.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By Integration Type, 2022-2032
        5.3.1. Monolithic Integration
        5.3.2. Hybrid Integration
        5.3.3. Module Integration
    5.4. Y-o-Y Growth Trend Analysis By Integration Type, 2017-2021
    5.5. Absolute $ Opportunity Analysis By Integration Type, 2022-2032
6. Global Market Analysis 2017-2021 and Forecast 2022-2032, By Application
    6.1. Introduction / Key Findings
    6.2. Historical Market Size Value (US$ Mn) Analysis By Application, 2017-2021
    6.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By Application, 2022-2032
        6.3.1. Optical Communications
        6.3.2. Sensing
        6.3.3. Bio-photonics
        6.3.4. Optical Signal Processing
    6.4. Y-o-Y Growth Trend Analysis By Application, 2017-2021
    6.5. Absolute $ Opportunity Analysis By Application, 2022-2032
7. Global Market Analysis 2017-2021 and Forecast 2022-2032, By Raw Material
    7.1. Introduction / Key Findings
    7.2. Historical Market Size Value (US$ Mn) Analysis By Raw Material, 2017-2021
    7.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By Raw Material, 2022-2032
        7.3.1. Indium Phosphide
        7.3.2. Galium Arsenide
        7.3.3. Lithium Niobate
        7.3.4. Silicone
        7.3.5. Silica-on-Insulator
        7.3.6. Others
    7.4. Y-o-Y Growth Trend Analysis By Raw Material, 2017-2021
    7.5. Absolute $ Opportunity Analysis By Raw Material, 2022-2032
8. Global Market Analysis 2017-2021 and Forecast 2022-2032, By Component
    8.1. Introduction / Key Findings
    8.2. Historical Market Size Value (US$ Mn) Analysis By Component, 2017-2021
    8.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By Component, 2022-2032
        8.3.1. Lasers
        8.3.2. Modulators
        8.3.3. Detectors
        8.3.4. Attenuators
        8.3.5. MUX/ DEMUX
        8.3.6. Optical Amplifiers
    8.4. Y-o-Y Growth Trend Analysis By Component, 2017-2021
    8.5. Absolute $ Opportunity Analysis By Component, 2022-2032
9. Global Market Analysis 2017-2021 and Forecast 2022-2032, By Region
    9.1. Introduction
    9.2. Historical Market Size Value (US$ Mn) Analysis By Region, 2017-2021
    9.3. Current Market Size Value (US$ Mn) Analysis and Forecast By Region, 2022-2032
        9.3.1. North America
        9.3.2. Latin America
        9.3.3. Europe
        9.3.4. Asia Pacific
        9.3.5. MEA
    9.4. Market Attractiveness Analysis By Region
10. North America Market Analysis 2017-2021 and Forecast 2022-2032, By Country
    10.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
    10.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
        10.2.1. By Country
            10.2.1.1. U.S.
            10.2.1.2. Canada
        10.2.2. By Integration Type
        10.2.3. By Application
        10.2.4. By Raw Material
        10.2.5. By Component
    10.3. Market Attractiveness Analysis
        10.3.1. By Country
        10.3.2. By Integration Type
        10.3.3. By Application
        10.3.4. By Raw Material
        10.3.5. By Component
    10.4. Key Takeaways
11. Latin America Market Analysis 2017-2021 and Forecast 2022-2032, By Country
    11.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
    11.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
        11.2.1. By Country
            11.2.1.1. Brazil
            11.2.1.2. Mexico
            11.2.1.3. Rest of Latin America
        11.2.2. By Integration Type
        11.2.3. By Application
        11.2.4. By Raw Material
        11.2.5. By Component
    11.3. Market Attractiveness Analysis
        11.3.1. By Country
        11.3.2. By Integration Type
        11.3.3. By Application
        11.3.4. By Raw Material
        11.3.5. By Component
    11.4. Key Takeaways
12. Europe Market Analysis 2017-2021 and Forecast 2022-2032, By Country
    12.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
    12.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
        12.2.1. By Country
            12.2.1.1. Germany
            12.2.1.2. Italy
            12.2.1.3. France
            12.2.1.4. U.K.
            12.2.1.5. Spain
            12.2.1.6. Russia
            12.2.1.7. BENELUX
            12.2.1.8. Rest of Europe
        12.2.2. By Integration Type
        12.2.3. By Application
        12.2.4. By Raw Material
        12.2.5. By Component
    12.3. Market Attractiveness Analysis
        12.3.1. By Country
        12.3.2. By Integration Type
        12.3.3. By Application
        12.3.4. By Raw Material
        12.3.5. By Component
    12.4. Key Takeaways
13. Asia Pacific Market Analysis 2017-2021 and Forecast 2022-2032, By Country
    13.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
    13.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
        13.2.1. By Country
            13.2.1.1. China
            13.2.1.2. Japan
            13.2.1.3. South Korea
            13.2.1.4. India
            13.2.1.5. Rest of Asia Pacific
        13.2.2. By Integration Type
        13.2.3. By Application
        13.2.4. By Raw Material
        13.2.5. By Component
    13.3. Market Attractiveness Analysis
        13.3.1. By Country
        13.3.2. By Integration Type
        13.3.3. By Application
        13.3.4. By Raw Material
        13.3.5. By Component
    13.4. Key Takeaways
14. MEA Market Analysis 2017-2021 and Forecast 2022-2032, By Country
    14.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021
    14.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032
        14.2.1. By Country
            14.2.1.1. GCC
            14.2.1.2. Rest of MEA
        14.2.2. By Integration Type
        14.2.3. By Application
        14.2.4. By Raw Material
        14.2.5. By Component
    14.3. Market Attractiveness Analysis
        14.3.1. By Country
        14.3.2. By Integration Type
        14.3.3. By Application
        14.3.4. By Raw Material
        14.3.5. By Component
    14.4. Key Takeaways
15. Key Countries Market Analysis
    15.1. U.S.
        15.1.1. Pricing Analysis
        15.1.2. Market Share Analysis, 2021
            15.1.2.1. By Integration Type
            15.1.2.2. By Application
            15.1.2.3. By Raw Material
            15.1.2.4. By Component
    15.2. Canada
        15.2.1. Pricing Analysis
        15.2.2. Market Share Analysis, 2021
            15.2.2.1. By Integration Type
            15.2.2.2. By Application
            15.2.2.3. By Raw Material
            15.2.2.4. By Component
    15.3. Brazil
        15.3.1. Pricing Analysis
        15.3.2. Market Share Analysis, 2021
            15.3.2.1. By Integration Type
            15.3.2.2. By Application
            15.3.2.3. By Raw Material
            15.3.2.4. By Component
    15.4. Mexico
        15.4.1. Pricing Analysis
        15.4.2. Market Share Analysis, 2021
            15.4.2.1. By Integration Type
            15.4.2.2. By Application
            15.4.2.3. By Raw Material
            15.4.2.4. By Component
    15.5. Argentina
        15.5.1. Pricing Analysis
        15.5.2. Market Share Analysis, 2021
            15.5.2.1. By Integration Type
            15.5.2.2. By Application
            15.5.2.3. By Raw Material
            15.5.2.4. By Component
    15.6. Germany
        15.6.1. Pricing Analysis
        15.6.2. Market Share Analysis, 2021
            15.6.2.1. By Integration Type
            15.6.2.2. By Application
            15.6.2.3. By Raw Material
            15.6.2.4. By Component
    15.7. Italy
        15.7.1. Pricing Analysis
        15.7.2. Market Share Analysis, 2021
            15.7.2.1. By Integration Type
            15.7.2.2. By Application
            15.7.2.3. By Raw Material
            15.7.2.4. By Component
    15.8. France
        15.8.1. Pricing Analysis
        15.8.2. Market Share Analysis, 2021
            15.8.2.1. By Integration Type
            15.8.2.2. By Application
            15.8.2.3. By Raw Material
            15.8.2.4. By Component
    15.9. U.K.
        15.9.1. Pricing Analysis
        15.9.2. Market Share Analysis, 2021
            15.9.2.1. By Integration Type
            15.9.2.2. By Application
            15.9.2.3. By Raw Material
            15.9.2.4. By Component
    15.10. Spain
        15.10.1. Pricing Analysis
        15.10.2. Market Share Analysis, 2021
            15.10.2.1. By Integration Type
            15.10.2.2. By Application
            15.10.2.3. By Raw Material
            15.10.2.4. By Component
    15.11. Russia
        15.11.1. Pricing Analysis
        15.11.2. Market Share Analysis, 2021
            15.11.2.1. By Integration Type
            15.11.2.2. By Application
            15.11.2.3. By Raw Material
            15.11.2.4. By Component
    15.12. BENELUX
        15.12.1. Pricing Analysis
        15.12.2. Market Share Analysis, 2021
            15.12.2.1. By Integration Type
            15.12.2.2. By Application
            15.12.2.3. By Raw Material
            15.12.2.4. By Component
    15.13. China
        15.13.1. Pricing Analysis
        15.13.2. Market Share Analysis, 2021
            15.13.2.1. By Integration Type
            15.13.2.2. By Application
            15.13.2.3. By Raw Material
            15.13.2.4. By Component
    15.14. Japan
        15.14.1. Pricing Analysis
        15.14.2. Market Share Analysis, 2021
            15.14.2.1. By Integration Type
            15.14.2.2. By Application
            15.14.2.3. By Raw Material
            15.14.2.4. By Component
    15.15. South Korea
        15.15.1. Pricing Analysis
        15.15.2. Market Share Analysis, 2021
            15.15.2.1. By Integration Type
            15.15.2.2. By Application
            15.15.2.3. By Raw Material
            15.15.2.4. By Component
    15.16. India
        15.16.1. Pricing Analysis
        15.16.2. Market Share Analysis, 2021
            15.16.2.1. By Integration Type
            15.16.2.2. By Application
            15.16.2.3. By Raw Material
            15.16.2.4. By Component
    15.17. GCC Countries
        15.17.1. Pricing Analysis
        15.17.2. Market Share Analysis, 2021
            15.17.2.1. By Integration Type
            15.17.2.2. By Application
            15.17.2.3. By Raw Material
            15.17.2.4. By Component
16. Market Structure Analysis
    16.1. Competition Dashboard
    16.2. Competition Benchmarking
    16.3. Market Share Analysis of Top Players
        16.3.1. By Regional
        16.3.2. By Integration Type
        16.3.3. By Application
        16.3.4. By Raw Material
        16.3.5. By Component
17. Competition Analysis
    17.1. Competition Deep Dive
        17.1.1. Agilent Technologies
            17.1.1.1. Overview
            17.1.1.2. Product Portfolio
            17.1.1.3. Profitability by Market Segment
            17.1.1.4. Sales Footprint
            17.1.1.5. Strategy Overview
                17.1.1.5.1. Marketing Strategy
                17.1.1.5.2. Product Strategy
        17.1.2. Broadcom
            17.1.2.1. Overview
            17.1.2.2. Product Portfolio
            17.1.2.3. Profitability by Market Segment
            17.1.2.4. Sales Footprint
            17.1.2.5. Strategy Overview
                17.1.2.5.1. Marketing Strategy
                17.1.2.5.2. Product Strategy
        17.1.3. Ciena Corporation
            17.1.3.1. Overview
            17.1.3.2. Product Portfolio
            17.1.3.3. Profitability by Market Segment
            17.1.3.4. Sales Footprint
            17.1.3.5. Strategy Overview
                17.1.3.5.1. Marketing Strategy
                17.1.3.5.2. Product Strategy
        17.1.4. Enablence
            17.1.4.1. Overview
            17.1.4.2. Product Portfolio
            17.1.4.3. Profitability by Market Segment
            17.1.4.4. Sales Footprint
            17.1.4.5. Strategy Overview
                17.1.4.5.1. Marketing Strategy
                17.1.4.5.2. Product Strategy
        17.1.5. II-VI Inc.
            17.1.5.1. Overview
            17.1.5.2. Product Portfolio
            17.1.5.3. Profitability by Market Segment
            17.1.5.4. Sales Footprint
            17.1.5.5. Strategy Overview
                17.1.5.5.1. Marketing Strategy
                17.1.5.5.2. Product Strategy
        17.1.6. Hewlett Packard
            17.1.6.1. Overview
            17.1.6.2. Product Portfolio
            17.1.6.3. Profitability by Market Segment
            17.1.6.4. Sales Footprint
            17.1.6.5. Strategy Overview
                17.1.6.5.1. Marketing Strategy
                17.1.6.5.2. Product Strategy
        17.1.7. Huawei Technologies Co. Ltd.
            17.1.7.1. Overview
            17.1.7.2. Product Portfolio
            17.1.7.3. Profitability by Market Segment
            17.1.7.4. Sales Footprint
            17.1.7.5. Strategy Overview
                17.1.7.5.1. Marketing Strategy
                17.1.7.5.2. Product Strategy
        17.1.8. Infinera Corporation
            17.1.8.1. Overview
            17.1.8.2. Product Portfolio
            17.1.8.3. Profitability by Market Segment
            17.1.8.4. Sales Footprint
            17.1.8.5. Strategy Overview
                17.1.8.5.1. Marketing Strategy
                17.1.8.5.2. Product Strategy
        17.1.9. Intel Corporation
            17.1.9.1. Overview
            17.1.9.2. Product Portfolio
            17.1.9.3. Profitability by Market Segment
            17.1.9.4. Sales Footprint
            17.1.9.5. Strategy Overview
                17.1.9.5.1. Marketing Strategy
                17.1.9.5.2. Product Strategy
        17.1.10. Broadex Technologies Co. Ltd.
            17.1.10.1. Overview
            17.1.10.2. Product Portfolio
            17.1.10.3. Profitability by Market Segment
            17.1.10.4. Sales Footprint
            17.1.10.5. Strategy Overview
                17.1.10.5.1. Marketing Strategy
                17.1.10.5.2. Product Strategy
        17.1.11. Cisco Systems, Inc.
            17.1.11.1. Overview
            17.1.11.2. Product Portfolio
            17.1.11.3. Profitability by Market Segment
            17.1.11.4. Sales Footprint
            17.1.11.5. Strategy Overview
                17.1.11.5.1. Marketing Strategy
                17.1.11.5.2. Product Strategy
        17.1.12. MACOM
            17.1.12.1. Overview
            17.1.12.2. Product Portfolio
            17.1.12.3. Profitability by Market Segment
            17.1.12.4. Sales Footprint
            17.1.12.5. Strategy Overview
                17.1.12.5.1. Marketing Strategy
                17.1.12.5.2. Product Strategy
        17.1.13. Mellanox Technologies
            17.1.13.1. Overview
            17.1.13.2. Product Portfolio
            17.1.13.3. Profitability by Market Segment
            17.1.13.4. Sales Footprint
            17.1.13.5. Strategy Overview
                17.1.13.5.1. Marketing Strategy
                17.1.13.5.2. Product Strategy
        17.1.14. Neophotonics Corporation
            17.1.14.1. Overview
            17.1.14.2. Product Portfolio
            17.1.14.3. Profitability by Market Segment
            17.1.14.4. Sales Footprint
            17.1.14.5. Strategy Overview
                17.1.14.5.1. Marketing Strategy
                17.1.14.5.2. Product Strategy
        17.1.15. Oclaro, Inc.
            17.1.15.1. Overview
            17.1.15.2. Product Portfolio
            17.1.15.3. Profitability by Market Segment
            17.1.15.4. Sales Footprint
            17.1.15.5. Strategy Overview
                17.1.15.5.1. Marketing Strategy
                17.1.15.5.2. Product Strategy
        17.1.16. TE Connectivity
            17.1.16.1. Overview
            17.1.16.2. Product Portfolio
            17.1.16.3. Profitability by Market Segment
            17.1.16.4. Sales Footprint
            17.1.16.5. Strategy Overview
                17.1.16.5.1. Marketing Strategy
                17.1.16.5.2. Product Strategy
        17.1.17. VLC Photonics S.L.
            17.1.17.1. Overview
            17.1.17.2. Product Portfolio
            17.1.17.3. Profitability by Market Segment
            17.1.17.4. Sales Footprint
            17.1.17.5. Strategy Overview
                17.1.17.5.1. Marketing Strategy
                17.1.17.5.2. Product Strategy
        17.1.18. POET Technologies
            17.1.18.1. Overview
            17.1.18.2. Product Portfolio
            17.1.18.3. Profitability by Market Segment
            17.1.18.4. Sales Footprint
            17.1.18.5. Strategy Overview
                17.1.18.5.1. Marketing Strategy
                17.1.18.5.2. Product Strategy
18. Assumptions & Acronyms Used
19. Research Methodology
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