Chiplet Underfills Market

Chiplet underfill sales will strengthen through 2036, anchored by direct supply to OSAT and IDM customers at 78.0% share in 2026. Epoxy-based chemistry holds 62.0% of demand. The market is sized at USD 690.6 million in 2026 and is set to reach USD 3,263.3 million by 2036 as advanced packaging scales.