Explore the Global High-Temperature Adhesives for SiC/GaN Power Module Packaging Market— analysis of key trends, regional growth, top players, and a 10-year forecast from 2026 to 2036.

Future Market Insights

High-Temperature Adhesives for SiC/GaN Power Module Packaging Market

Key Insight

FMI suggests high-temperature adhesives for SiC/GaN power module packaging market was valued at USD 55.1 million in 2025. Demand is expected to reach USD 63.8 million in 2026 and USD 276.6 million by 2036. Silver sinter paste is poised to lead by adhesive chemistry with 46.0% share in 2026, and die attach is projected to lead by packaging function with 51% share in 2036.

March 20, 2026

Nikhil Kaitwade

250 Pages

Cite this Report

High-Temperature Adhesives for SiC/GaN Power Module Packaging Market

https://www.futuremarketinsights.com/reports/high-temperature-adhesives-for-sic-gan-power-module-packaging-market

License

Starting at US$ 5000

Buy Now

Summary ToC Infographics Companies

Key Players

Dupont
Henkel
Heraeus Electronics
Indium Corporation
MacDermid Alpha Electronics Solutions
Namics Corporation
Shin-Etsu Chemical Co. Ltd

Methodology

Member of

Greater New York Chamber of Commerce

Recognized by

Awarded by

SILVER STEVIE® WINNER

Asia Pacific Stevie Awards - 2023

BRONZE STEVIE® Award

20th annual IBAs

Quick Contact

Chat on Whatsapp + 44 20 3769 9709 + 1 347 918 3531 Contact By Email

Get Free Sample PDF

High-Temperature Adhesives for SiC/GaN Power Module Packaging Market

Key Players

Similar Industry Reports