Printed Circuit Boards (PCB) Market Outlook from 2025 to 2035

The printed circuit boards (PCB) market is set to witness significant growth between 2025 and 2035, driven by increasing demand from the consumer electronics, automotive, healthcare, and telecommunications industries. The market was valued at USD 70,800 million in 2025 and is projected to reach USD 117,500 million by 2035, expanding at a compound annual growth rate (CAGR) of 5.1% over the forecast period.

The increasing integration of miniaturized and energy-efficient electronic devices and the expansion of 5G technology, IoT-enabled devices, and autonomous vehicles are driving the demand for advanced PCBs. Multilayer, flexible, and high-density interconnect (HDI) PCBs are becoming more popular because of their superior performance in compact and high-speed applications.

Additionally, innovations in PCB fabrication technology, green manufacturing approaches, and biodegradable PCB creation are transforming the field. Market growth is further fuelled through a continuous emphasis on electrification in the automobile domain (for both EV battery management systems and ADAS technologies).

Metric Overview

Metric Value
Market Size (2025E) USD 70,800 million
Market Value (2035F) USD 117,500 million
CAGR (2025 to 2035) 5.1%

The growth is channelled to continuous growth of the printed circuit boards (PCB) market due to the high technological innovation, increasing penetration of consumer electronics segment, high requirements of PCBs in AI-based computing systems and others. The Industry will also see the improvement of flexible, 3D-planned, and half-and-half PCBs.

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Regional Market Analysis

North America

As for the PCB market, North America is the second-largest region, as a result of the dominance of the electronics, automotive, aerospace and defence sectors in North America. The United States and Canada are high adopters of advanced PCB Technologies such as rigid, flexible, and high-density interconnect (HDI) PCBs. The growing installations of 5G infrastructure, the rising use of IoT devices, and the shift toward electric vehicles (EVs) are accelerating its growth in the market.

Cross-strait fabricators ship their products to the region in order to take advantage of strong government support for domestic semiconductor and PCB manufacturing while increasing their exports from Japan and Korea and reducing their imports Search: IMDFs, and Showa Denko in Japan, which takes advantage of the domestic polymer industry.

Investing in PCB recycling and sustainable materials is an emerging trend as companies pursue compliance with environmental regulations. Nonetheless, high production costs, supply chain disruptions, and dependence on the Asian markets for raw materials will enable hindrances in market expansion.

Europe

Germany, the UK, France, and Italy continue to dominate its PCB market, driven by demand from multiple sectors, including automotive, healthcare, telecommunications and industrial automation, attesting that Europe is still a key player in PCB world. Increased investments in advanced PCBs due to growing emphasis on renewable energy solutions, smart manufacturing and industry 4.0 in the region. Electric and autonomous vehicles have also increased demand for multilayer and HDI PCBs.

The European regulations for environmental sustainability has prompted manufacturers to produce eco-friendly production processes and lead-free and halogen-free PCBs. Despite the market growing, high labour costs, stringent regulations, and dependence on imports for raw materials and functional semiconductor components hinder growth.

Asia-Pacific

The Asia-Pacific region leads the worldwide PCB market, with China, Japan, South Korea, and Taiwan as major manufacturing nations. With large-scale production facilities, low-cost manufacturing, and strong demand from the consumer electronics, automotive, and telecommunications sectors, the region is a benchmark of technology effectiveness and density.

As for PCB production, China is a leader, while high-end PCB technologies are concentrated in Japan and South Korea to care for 5G networks, AI and automotive electronics applications. The current growth of India in the PCB market is primarily due to government initiatives like make in India that aims to manufacture everything locally, thus minimizing import dependency.

Rising smartphone penetration and the growing adoption of IoT devices along with the expansion of data centers are driving the market growth. Supply chain challenges, geopolitical tensions, and rising raw material costs could threaten the regional manufacturing sector, however.

Challenges and Opportunities

Challenges - Supply Chain Disruptions and Raw Material Shortages

Challenges facing the printed circuit boards (PCB) market include supply chain disruptions and raw material shortages dependence on key materials for example, copper, laminates and rare earth elements has resulted in price volatility and production delays, including in countries that rely on imports.

With geopolitical tensions, trade restrictions, and semiconductor shortages only compounding the PCB crisis, manufacturers set between a rock and a hard place have struggled to fulfil increasing requirements across sectors such as consumer electronics, automotive and telecommunications.

Opportunities - Advancements in Flexible and High-Density Interconnect (HDI) PCBs

The growing demand for compact, lightweight, and high-performance electronic devices is driving innovation in flexible and high-density interconnect (HDI) PCBs. These advanced PCB technologies offer improved signal integrity, miniaturization, and enhanced durability, making them ideal for applications in 5G infrastructure, IoT devices, wearables, and autonomous vehicles.

As industries prioritize efficiency and high-speed connectivity, investments in next-generation PCB designs are expected to create significant market opportunities.

Shifts in the Market from 2020 to 2024 and Future Trends 2025 to 2035

Between 2020 and 2024, the PCB market experienced significant growth due to increased demand from sectors such as telecommunications, automotive electronics, and medical devices. However, global supply chain disruptions, fluctuating raw material costs, and manufacturing bottlenecks posed challenges for PCB producers. Manufacturers focused on optimizing production capabilities, increasing automation, and sourcing alternative materials to mitigate these issues.

Looking ahead to 2025 to 2035, the PCB market will witness a transformation driven by technological advancements in AI, IoT, and 6G communication networks. The rise of smart manufacturing, 3D printing, and sustainable PCB materials, including biodegradable and lead-free alternatives, will further revolutionize the industry. Additionally, regionalization strategies will emerge as companies seek to establish localized production hubs to reduce supply chain risks and enhance sustainability.

Market Shifts: A Comparative Analysis (2020 to 2024 vs. 2025 to 2035)

Market Shift 2020 to 2024 Trends
Regulatory Landscape Compliance with RoHS and lead-free standards
Technological Advancements Increased adoption of HDI and flexible PCBs
Industry Adoption Strong demand from 5G and automotive sectors
Supply Chain and Sourcing Dependence on Asian manufacturers
Market Competition Dominance of large-scale manufacturers
Market Growth Drivers Increased demand for miniaturized electronics
Sustainability and Energy Efficiency Shift toward lead-free and RoHS-compliant materials
Consumer Preferences Demand for high-speed, lightweight PCBs
Market Shift 2025 to 2035 Projections
Regulatory Landscape Stricter environmental mandates for sustainable PCB production
Technological Advancements Expansion of AI-driven PCB design and 3D-printed circuits
Industry Adoption Widespread use in 6G, IoT, and quantum computing applications
Supply Chain and Sourcing Growth of localized PCB production in North America & Europe
Market Competition Rise of niche players specializing in eco-friendly and AI-integrated PCBs
Market Growth Drivers Expansion of smart devices and autonomous technology
Sustainability and Energy Efficiency Development of fully recyclable and biodegradable PCBs
Consumer Preferences Preference for energy-efficient and sustainable circuit boards

Country-wise Outlook

United States

The United States holds a significant place in the printed circuit boards (PCB) market, due to the growing demand from aerospace, defence, consumer electronics, and automotive sectors. Some pursue with great investment in high-density interconnect (HDI) and flexible PCBs, while the country already has a strong electronics manufacturing history.

The growing demand for advanced PCB designs is driven by the rapid expansion of 5G infrastructure, IoT devices, and AI-driven technologies. As such, the USA government is currently working to encourage domestic semiconductor & PCB production, to lessen foreign dependence and help create opportunities for domestic players. Accelerated adoption of electric vehicles (EV) is also driving the need for high-performance PCBs.

Country CAGR (2025 to 2035)
United States 4.8%

United Kingdom

The PCB market in the UK is steadily growing due to the growing investments in advanced manufacturing technologies. There is growing demand for miniaturized, high-performance PCBs across telecommunications, healthcare and renewable energy applications in the country’s electronics sector.

Market expansion is also aided via the development of self-sufficient vehicles and the development of smart cities. In addition, government initiatives for domestic electronics manufacturing and supply chain resilience should help support PCB production and innovation over the long term.

Country CAGR (2025 to 2035)
United Kingdom 4.5%

European Union

Germany, France, and Italy are the top three electronics manufacturers in the European Union, which is a critical market for PCBs. High-performance PCB solutions and the region's robust automotive sector including the growing manufacturing of electric vehicles (EVs) are stimulating consumption.

Moreover, manufacturers in Europe are also prioritising sustainable PCB production, utilising green materials and energy-optimised manufacturing processes. The proliferation of 5G networks, IoT applications, and industrial automation is also driving the market growth. New EU regulations aimed at encouraging localized production and limiting dependence on Asia-based suppliers are predicted to provide new opportunities for European PCB producers.

Region CAGR (2025 to 2035)
European Union 4.6%

Japan

Japan continues to lead the world in PCB manufacturing, specializing in precise and high-quality boards. The consumer electronics, automotive, and semiconductor sectors are the biggest drivers of demand for PCBs in the country.

The new trends of high-frequency PCBs or miniaturized PCBs for applications including 5G devices and AI-powered systems is shaping the market. Japanese companies are also working on next-gen materials such as flex and rigid-flex PCBs, as the need for compact and lightweight electronic devices grows.

Country CAGR (2025 to 2035)
Japan 4.7%

South Korea

South Korea: With a robust semiconductor and electronics manufacturing base, the PCB market is growing at a rapid pace in South Korea. Major technology giants with demand for top notch PCBs for cell phones, tablets, smart appliances, and automotive applications are located in the country.

The implementation of 6G research and ongoing proliferation of AI-driven devices are anticipated to create added demand for advanced PCB designs. Additionally, Korea’s drive for localized PCB manufacturing and supply chain diversification are fuelling innovation and enhancing market competitiveness.

Country CAGR (2025 to 2035)
South Korea 4.9%

Segmentation Outlook

Multi-Layer and Double-Sided PCBs Lead the Market Due to Their Versatility and Performance

Multi-layer and double-sided types of PCB hold the major share owing to their huge applications in consumer electronics, automotive, telecommunications and industrial equipment.

Owing to their superior circuit density, enhanced electrical performance, and compact design, Multi-Layer PCBs are extensively used. Multi-layer PCBs and its advantages: Multi-layer PCBs are made up of several layers of conductive material that are pressed together, allowing for more complex circuit designs and improved signal integrity.

They are best known for their use in performance-heavy applications such as mobile phones, data centers, medical devices and aerospace electronics. The trend of multi-layer PCBs is on the rise significantly, driven by demand for miniaturized, high-speed electronic devices-accelerated by the evolution of 5G technology, AI and automotive electronics.

Double-Sided PCB(printed circuit board) after the multi-layered PCBs they are the most important segment, due to both cost effectiveness and functionality. These boards have conductive layers on both sides, allowing for more complex circuit designs and lower prices compared to single-sided PCBs.

Although they are more costly than single-sided boards, their reliability is why double-sided PCBs are commonly used in items such as automotive control systems, industrial equipment, power supplies, and LED lighting as the circuit complexity is moderate. With the necessary combination of different components at reasonable cost, they are likely to be used as state of the art in many industries.

HDI and IC Substrate PCBs Gain Traction in the Substrate Segment

In terms of substrate type, High-Density Interconnect (HDI) and IC Substrate PCBs are gaining traction, owing to the rising complexity of modern electronics.

The compact design, high circuit density, and superior electrical performance are some of the factors fuelling the rapid growth of High-Density Interconnect (HDI) PCBs. These PCBs employ laser-drilled microvias and fine-line routing, providing faster signal transmission, reduced power consumption, and improved reliability desirable attributes for high-performance electronics.

HDI PCBs are commonly found in smartphones, wearables, medical implants, and high-speed computing applications where space constraints as well as performance requirements are stringent. The increasing penetration of 5G devices, IoT technologies, and ADAS is anticipated to explode the demand for HDI PCBs in the coming years.

The key component of semiconductor packaging, IC substrate PCBs is material that connects integrated circuits (ICs) and entire PCB assemblies. These are the substrates that supply electrical connections, heat dissipation, and mechanical support no modern chip is made without them.

As the semiconductor industry is pivoting to advance packaging solutions, including System-in-Package (SiP) and 3D ICs, IC Substrate PCBs should have significant growth. Their power in processors, memory modules, graphics cards, and high-performance computing (HPC) systems proves their growing significance in the PCB market.

As technology progresses, it will demand more advanced PCBs that may be much smaller and enhanced in performance. Tube & pipe processors and builders will be able to gain greater efficiency through the use of cutting-edge technology and capabilities such as flexible PCBs, sustainable materials and AI-based PCB design tools.

Competitive Outlook

Demand for printed circuit boards (PCB) continues to expand owing to the increasing adoption of consumer electronics, automotive, telecommunications, and industrial automation sectors. Miniaturization, high-density interconnect (HDI) technology, and flexible PCBs advances drive the market. To cater to the changing needs of the industry, manufacturers are emphasizing on cost-effective manufacturing, better thermal control, and superior signal integrity.

Market Share Analysis by Key Players & Manufacturers

Company/Organization Name Estimated Market Share (%)
Zhen Ding Technology Holding Ltd. 12-17%
Nippon Mektron, Ltd. 10-15%
TTM Technologies 9-13%
Unimicron Technology Corp. 8-12%
Other Companies (Combined) 43-55%

Key Company & Product Offerings

Company/Organization Name Key Offerings/Activities
Zhen Ding Technology Holding Ltd. Leading manufacturer of high-end flexible PCBs, HDI PCBs, and automotive PCBs.
Nippon Mektron, Ltd. Specializes in flexible printed circuit boards (FPCBs) for smartphones, wearables, and medical devices.
TTM Technologies Provides advanced rigid and flexible PCBs for aerospace, defence, and automotive industries.
Unimicron Technology Corp. Offers high-density interconnect (HDI) and IC substrate solutions for high-performance computing and 5G applications.

Key Market Insights

Zhen Ding Technology Holding Ltd. (12-17%)

Zhen Ding is the leader in PCB Market, with efforts primarily in support of next-generation flexible circuits along with automotive electronics and next-generation high-density interconnection PCB to hasten growing demand for miniaturized, high-performing devices.

Nippon Mektron, Ltd. (10-15%)

Nippon Mektron is a market leader in flexible PCB solutions, especially those designed for smart devices, medical applications, and next-gen consumer electronics. Its focus on lightweight and compact designs helps solidify its presence in the market.

TTM Technologies (9-13%)

It is a major producer of rigid, flexible, and RF/Microwave PCBs with customers in industries such as aerospace, telecommunications, and industrial automation. Its knowledge in defence and high-reliability electronics increases its market position.

Unimicron Technology Corp. (8-12%)

Unimicron mainly develops HDI PCBs,IC substrates, and high-speed connectivity solutions, with customers in data centers, 5G and AI computing markets.

Other Major Contenders (43-55% Combined)

Several companies grow the market by introducing low-cost, high-performance PCB helpers, like:

  • Samsung Electro-Mechanics - The company provides multilayer and HDI PCBs for consumer electronics.
  • Ibiden Co., Ltd. - Creates advanced semiconductor packaging substrates and printed wiring boards.
  • Shennan Circuits Co., Ltd. - PCB Manufacturer Specialized in Automotive and Industrial; Environmental Protection.
  • Tripod Technology Corporation - Offers rigid-flex PCBs and custom developed boards for various applications.

Frequently Asked Questions

What was the overall size of the printed circuit boards (PCB) market in 2025?

The overall market size for the printed circuit boards (PCB) market was USD 70,800 million in 2025.

How big is the printed circuit boards (PCB) market expected to be in 2035?

The printed circuit boards (PCB) market is expected to reach USD 117,500 million in 2035.

What will drive the demand for printed circuit boards (PCB) during the forecast period?

The demand for printed circuit boards (PCB) is expected to rise due to the increasing adoption of advanced electronics in consumer devices, automotive applications, healthcare equipment, and telecommunications infrastructure.

List the top five countries contributing to the printed circuit boards (PCB) market.

The top five countries driving the development of the printed circuit boards (PCB) market are China, the USA, Germany, Japan, and South Korea.

Which segment in board type is expected to lead in the printed circuit boards (PCB) market?

Multilayer PCBs are expected to dominate the market due to their enhanced functionality, compact design, and increasing usage in high-performance computing, automotive electronics, and communication systems.

Table of Content
  1. Executive Summary
  2. Industry Introduction, including Taxonomy and Market Definition
  3. Market Trends and Success Factors, including Macro-economic Factors, Market Dynamics, and Recent Industry Developments
  4. Global Market Demand Analysis 2020 to 2024 and Forecast 2025 to 2035, including Historical Analysis and Future Projections
  5. Pricing Analysis
  6. Global Market Analysis 2020 to 2024 and Forecast 2025 to 2035
    • Type
    • Substrate Type
    • End-Use
  7. Global Market Analysis 2020 to 2024 and Forecast 2025 to 2035, By Type
    • Multi-Layer
    • Double-Sided
    • Single-Sided
  8. Global Market Analysis 2020 to 2024 and Forecast 2025 to 2035, By Substrate Type
    • Standard Multilayer
    • HighDensity Interconnect (HDI)
    • IC Substrate
    • Regid 1-2 Sided
    • Regid Flex
    • Others
  9. Global Market Analysis 2020 to 2024 and Forecast 2025 to 2035, By End-Use
    • Computer & Peripherals
    • Communications
    • Consumer Electronic
    • Industrial Electronics
    • Automotive
    • Aerospace & Defence
    • Others
  10. Global Market Analysis 2020 to 2024 and Forecast 2025 to 2035, By Region
    • North America
    • Latin America
    • Western Europe
    • Eastern Europe
    • East Asia
    • South Asia Pacific
    • Middle East and Africa
  11. North America Sales Analysis 2020 to 2024 and Forecast 2025 to 2035, by Key Segments and Countries
  12. Latin America Sales Analysis 2020 to 2024 and Forecast 2025 to 2035, by Key Segments and Countries
  13. Western Europe Sales Analysis 2020 to 2024 and Forecast 2025 to 2035, by Key Segments and Countries
  14. Eastern Europe Sales Analysis 2020 to 2024 and Forecast 2025 to 2035, by Key Segments and Countries
  15. East Asia Sales Analysis 2020 to 2024 and Forecast 2025 to 2035, by Key Segments and Countries
  16. South Asia Pacific Sales Analysis 2020 to 2024 and Forecast 2025 to 2035, by Key Segments and Countries
  17. Middle East and Africa Sales Analysis 2020 to 2024 and Forecast 2025 to 2035, by Key Segments and Countries
  18. Sales Forecast 2025 to 2035 by Type, Substrate Type, and End-Use for 30 Countries
  19. Competition Outlook, including Market Structure Analysis, Company Share Analysis by Key Players, and Competition Dashboard
  20. Company Profile
    • Amphenol Corporation
    • Amperex Technology Ltd.
    • Apex Microelectronics Company Limited
    • Autosplice, Inc.
    • Auter Elektronics Ltd.
    • Advance Circuit Technology, Inc.
    • Altron, Inc.
    • Applied Magnetics Corporation
    • Atrenne Integrated Solutions, Inc.
    • Arbell Electronics Inc

Printed Circuit Boards (PCB) Market Segmentation

By Type:

  • Multi-Layer
  • Double-Sided
  • Single-Sided

By Substrate Type:

  • Standard Multilayer
  • HighDensity Interconnect (HDI)
  • IC Substrate
  • Regid 1-2 Sided
  • Regid Flex
  • Others

By End-Use:

  • Computer & Peripherals
  • Communications
  • Consumer Electronic
  • Industrial Electronics
  • Automotive
  • Aerospace & Defence
  • Others

By Region:

  • North America
  • Latin America
  • Western Europe
  • Eastern Europe
  • East Asia
  • South Asia Pacific
  • Middle East and Africa

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