Key Players
Competitive Landscape
As per the analysis from FMI, suppliers of thermal gap compounds will continue to compete on dispensable range, conductivity options and process fit. Automotive-qualified dispensing platforms, silicone and putty formulation specialists, and diversified electronics thermal portfolios are each winning different buyer groups. OEMs are judging suppliers on results from line trials and reliability testing rather than on datasheet conductivity alone.
Product activity since mid-2025 has split in two directions. Qnity, Dow and Parker are pushing dispensable grades to 9 W/mK and above for AI hardware and telecom modules, and Henkel has added a 6.5 W/mK low-volatile silicone for vehicle electronics, whilst Henkel’s silicone-free battery grade and Wacker’s room-temperature-curing power-electronics grade target line speed and contamination control. Suppliers will continue to win programs by proving repeatable dispensing and cure, along with documentation that shortens customer approval.
Company developments mapped to drivers, trends and opportunities (2026-2036)
| Development | Driver | Trend | Opportunity |
|---|---|---|---|
| Henkel | July 2026: Bergquist Gap Filler TGF 6500LVO, 6.5 W/mK low-volatile silicone | Compact vehicle electronics are carrying higher heat loads. | Low-volatile silicones are moving into higher conductivity bands. | Siloxane-sensitive ADAS and ECU designs can adopt dispensed compounds. |
| Henkel | May 2026: Bergquist TGF 2030APS silicone-free battery gap filler | Battery lines need fast, room-temperature processing. | Silicone-free chemistries are entering cell-to-plate interfaces. | Contamination-sensitive pack designs can be served at high throughput. |
| Qnity | July 2026: Laird Tflex CR910 two-part liquid gap filler, 9.2 W/mK | AI and high-power electronics are raising heat flux. | Dispensable liquids are reaching near-10 W/mK. | Large or uneven gaps in AI hardware can move from pads to dispensed material. |
| Dow | May 2026: DOWSIL TC-3120 Thermal Gel, about 12 W/mK | Optical and telecom modules are generating more heat. | Ultra-high-conductivity gels are staying dispensable. | Telecom equipment and automotive controllers can adopt higher-K compounds. |
| Parker Chomerics | July 2025: THERM-A-GAP CIP 35E cure-in-place, 3.5 W/mK | Multi-height boards need low-force gap filling. | Cure-in-place formats are replacing cut pads. | Energy storage and power electronics lines can automate placement. |
| Wacker Chemie | June 2025: SEMICOSIL 9649 TC, about 4 W/mK | EV power electronics need stable heat paths to cooling systems. | Room-temperature-curing silicones are simplifying line integration. | Bead-dispensed grades can shorten cycle time on inverter lines. |
Source: FMI, Thermal Gap Compounds Market Report, 2026-2036.
Representative Company Overview
| Company | Positioning | Verified Development |
|---|---|---|
| Henkel | German adhesives group supplying Bergquist two-component silicone and silicone-free gap fillers, along with Loctite thermally conductive adhesives, for EV batteries and automotive electronics. | In July 2026, Henkel launched Bergquist Gap Filler TGF 6500LVO (6.5 W/mK); in May 2026, it introduced the silicone-free Bergquist TGF 2030APS for EV battery modules. |
| Dow | US materials group supplying DOWSIL silicone gap fillers and gels, along with VORATRON gap fillers, for battery packs and electronics. | In May 2026, Dow launched DOWSIL TC-3120 Thermal Gel, its highest-conductivity silicone gel at about 12 W/mK. |
| Parker Hannifin | US motion-and-control group offering CoolTherm gap fillers through Parker LORD and THERM-A-GAP dispensable gels and cure-in-place materials through Chomerics. | In February 2026, Parker Chomerics introduced THERM-A-GAP GEL 120 (12.0 W/mK); in July 2025, it launched THERM-A-GAP CIP 35E. |
| Wacker Chemie | German silicone producer supplying room-temperature-curing SEMICOSIL gap fillers for EV power electronics and battery systems. | In June 2025, Wacker presented SEMICOSIL 9649 TC, a gap filler of about 4 W/mK, at The Battery Show Europe. |
| Shin-Etsu Chemical | Japanese silicone maker offering the SDP Series of two-component gap fillers from 5.1 to 9.5 W/mK, along with thermal sheets and greases. | In November 2025, Shin-Etsu exhibited its SDP Series thermal interface gap fillers at the 14th Plastic Japan. |
| Momentive Performance Materials | Silicone producer marketing SilCool two-part gap fillers and gap-filler gels for automotive, server and mobile electronics. | No dated development since May 2025 in public sources. |
| T-Global Technology | Taiwan-based thermal-material maker offering silicone and non-silicone thermal putties up to 8.0 W/mK, with offices serving Europe and the USA. | No dated development since May 2025 in public sources. |
| Qnity Electronics (Laird) | Electronics-materials company, separated from DuPont in November 2025, that sells Laird Tflex dispensable and non-silicone gap fillers. | In July 2026, Qnity launched Laird Tflex CR910 (9.2 W/mK); in March 2026, it added Laird Tflex SF16 (16 W/mK). |
| 3M | Diversified materials group supplying thermal interface materials, conductive fillers and adjacent EV battery materials, with limited public documentation of dispensable gap compounds. | In September 2025, 3M outlined EV battery materials including thermal runaway barriers, cell expansion foam and a two-part cure-in-place foam sealant. |
Company Selection and Benchmark Notes
Companies are included when public evidence connects their products or sales roles to this market. Brands are counted once under their current owner, so Bergquist sits within Henkel and Laird within Qnity Electronics. The FMI benchmark uses documented criteria and scores limited public documentation as Low. Company developments are mapped to demand drivers and product trends through their stated applications.
