Thin wafers market is likely to surge at a steady 8.6% CAGR over the forecast period 2022 to 2032, Future Market Insights (FMI) reveals. The market revenue is projected to skyrocket from US$ 11.4 billion in 2022 to US$ 26.0 billion by 2032. It is poised to enjoy an absolute growth opportunity of about US$ 14.6 billion through 2032.
The continuous advancements in semiconductor technology, such as the miniaturization of electronic devices have greatly aided sales in this market. Increasing demand for small, fast, and more efficient chips have led to the need for thin wafers. Thin wafers enable the production of compact and high-performance semiconductor devices.
Growing popularity of wearable devices, flexible displays, and internet of things (IoT) applications is a key trend taking the market by storm. There is a rising demand for thin and flexible electronic components. Thin wafers play a crucial role in enabling effecient production of lightweight and flexible electronic devices.
Thin wafers offer cost and material efficiency advantages over traditional thick wafers. Thin wafers require less material, resulting in reduced production costs. Thin wafers enable higher yields during the manufacturing process, leading to improved cost-effectiveness for businesses.
Microelectromechanical systems (MEMS) and sensors are key components in several sectors, including automotive, consumer electronics, healthcare, and industrial applications. Thin wafers are essential for the production of MEMS devices and sensors due to their precise control over thickness and flexibility.
The adoption of emerging technologies, such as 5G, artificial intelligence (AI), augmented reality (AR), virtual reality (VR), and autonomous vehicles is boosting demand for thin wafers. These technologies require high-performance and compact semiconductor devices, which can be achieved using these kinds of wafers.
The focus on energy efficiency and renewable energy sources has led to increased demand for thin wafers in solar cells and photovoltaic applications. Thin wafers enable the production of lightweight and flexible solar panels, which are more efficient and cost-effective for users.
The trend towards miniaturization of electronic devices, such as smartphones, tablets, and wearables, requires thinner wafers to accommodate the shrinking form factors. Thin wafers enable the production of small and light electronic devices while maintaining high performance.
The overall growth of the semiconductor sector is a prominent driver for thin wafers sales. These factors are anticipated to help drive demand for thin wafers during the projected period.
What are Some Key Trends in the Thin Wafers Market?
| Attribute | Key Insights |
|---|---|
| Thin Wafers Market Size (2022E) | US$ 11.4 billion |
| Projected Market Size (2032F) | US$ 26.0 billion |
| Value-based CAGR (2022 to 2032) | 8.6% CAGR |
| Historical CAGR (2017 to 2021) | 12.1% CAGR |
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Thin wafer market is anticipated to register an 8.6% CAGR from 2022 to 2032. During the historical period 2017 to 2021, the market expanded at 12.1% CAGR.
The renewable energy sector, particularly photovoltaic solutions, has witnessed a huge surge in demand. Thin wafers, such as thin crystalline silicon wafers, are being used in solar cell production due to their improved light absorption and cost-efficiency.
Thin wafers find applications in medical devices, including biosensors, implantable devices, and medical imaging equipment. The trend towards miniaturization and increased functionality in the medical field is driving the adoption of thin wafers for these applications.
Flexible electronics, such as flexible displays, flexible sensors, and wearable devices, have gained popularity. Thin wafers with flexible substrates, such as plastic or metal foils, are being used to create bendable and lightweight electronic components.
The emergence of new materials, such as gallium nitride (GaN) and silicon carbide (SiC), is also driving the demand for thin wafers. These materials are becoming increasingly popular for use in high-performance electronics due to their unique properties. They are more difficult to manufacture and require thinner wafers to achieve the desired performance.
In terms of key players in the thin wafer industry, companies such as Siltronic, Shin-Etsu Chemical, and SUMCO Corporation are some of the leading suppliers of thin wafers. These companies are investing heavily in research and development to stay ahead of the competition and meet the growing demand for these products.
Despite the growing demand for thin wafers, the market faces several challenges. One of the main challenges is the high cost of manufacturing these wafers. The fragile nature of thin wafers can make them difficult to handle during production and transportation, leading to yield loss.
The demand for small and light electronic devices has been driving the need for thin wafers. Thin wafers enable the production of compact and lightweight components, such as smartphones, tablets, wearables, and automotive electronics.
The semiconductor sector has been rapidly advancing, with increased demand for advanced chips in several applications. Thin wafers play a crucial role in semiconductor manufacturing, allowing for the production of high-density integrated circuits.
Technological advancements in wafer thinning processes have enabled the production of ultra-thin wafers with improved mechanical strength and electrical performance. Advanced wafer thinning techniques include mechanical grinding, chemical etching, and laser ablation.
3D packaging, such as through silicon vials (TSVs) and wafer-level packaging (WLP), has gained significant traction in the semiconductor industry. Thin wafers are essential for these packaging techniques, as they enable the stacking of multiple integrated circuits, improving performance and reducing the overall form factor.
Principal Consultant
The thin wafers market is anticipated to be dominated by Asia-Pacific, as a whole, throughout the projected period. Smart electronic gadgets have been widely adopted throughout Asia-Pacific. This has prompted consumer electronics makers to develop more expensive goods in this segment of the market.
The embrace of the current technological advances by a lot of manufacturers of consumer electronics has increased the requirement for thin wafers in the region.
Recent years have seen growing investments in semiconductor manufacturing. The amount of integrated circuit production plants and IC manufacturing companies in countries such as China and Taiwan has increased dramatically due to this reason. These factors are paving the way for the growth of the Asia-Pacific thin wafers market.
It was valued at US$ 2.80 billion in 2022, and is expected to reach US$ 6.39 billion by the end of the forecast period. It is expected to maintain ~19% CAGR through 2032.
High Adoption of Advanced Technologies in Consumer Electronics Boosting Sales in the United States
The United States thin wafers industry is projected to exceed a valuation of around US$ 8.2 billion by 2032. It is also expected to create an absolute dollar opportunity of US$ 4.2 billion through 2032.
Thin wafers industry in the United States exhibited a 10.5 % CAGR from 2017 to 2021. It is poised to expand at 7.4% CAGR from 2022 to 2032.
One of the primary reasons why the United States holds a significant valuation in the global thin wafers market is its expansive consumer electronics sector. Other important sectors like healthcare and automotive also contribute greatly to the local demand for thin wafers.
The presence of leading thin wafer manufacturers in the country, coupled with robust research and development initiatives, has further propelled the growth of the market in the region. The demand for high-performance electronics and the need for miniaturization are other driving factors contributing to the dominance of the United States in the thin wafers industry.
Demand for High-performance Computing (HPC) Solutions to Fuel Growth in the United Kingdom
As per the FMI report, the United Kingdom is anticipated to witness a 7.8% CAGR from 2022 to 2032. The revenue is expected to cross US$ 1.2 billion by 2032.
This can be attributed to the country's robust manufacturing sector, focus on technological advancements, and favorable government policies. The United Kingdom's emphasis on innovation, and research and development has led to the growth of the thin wafers industry in the country.
Several key players in the thin wafer industry have set up their operations in the United Kingdom, contributing to its significant valuation in the global market. One of these trends is the growing demand for high-performance computing (HPC) and consumer electronics.
Thin wafers are an essential component of these sectors, as they enable the creation of small, fast, and more efficient electronic devices.
Demand from Electronics Sector, and Favorable Government Policies Pushing Market Expansion in China
Thin wafers market in China is set to surpass US$ 2.2 billion by 2032-end. It is likely to create an absolute growth opportunity of US$ 1.3 billion through 2032. The thin wafers industry in China propelled at 13.6% CAGR from 2017 to 2021. It is likely to witness a 9.5 % CAGR from 2022 to 2032.
China has emerged as a leading player in the global thin wafers market, accounting for a significant share of the overall valuation. The country's rapidly growing electronics sector, coupled with favorable regulatory environment and investments in semiconductor technology, have contributed to the increasing sales of thin wafers.
The presence of key manufacturers in the region has further boosted market growth. With the country's continued focus on developing advanced technology and expanding its manufacturing capabilities, it is expected to remain a significant contributor to the global thin wafers industry over the forecast period.
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High Usage in Solar Cells to Help CIS Segment Capture the Lion’s Share by 2032
Based on application, CIS division is likely to dominate thin wafers market during the forecast period. Sales expanded at 12.0 % CAGR from 2017 to 2021, and are further projected to witness an 8.5% CAGR from 2022 to 2032.
Thin wafer technology is increasingly being utilized in the manufacture of solar cells, which has driven the demand for thin wafer in CIS applications.
Growing adoption of renewable energy sources worldwide has further boosted the demand for thin wafers in this process. As a result, the CIS application segment is expected to hold sizeable shares in the global thin wafers industry over the forecast period.
Ability to Produce High-quality and Precise Wafers to aid Demand for Dicing Technology
In terms of technology, dicing segment is likely to garner lucrative revenues in the thin wafers industry. Sales grew at 11.9% CAGR between 2017 and 2021, and are expected to rise at 8.4% CAGR between 2022 and 2032.
Dicing is a critical technology in the production of thin wafers as it allows for precise separation of individual dies from a wafer. This technology is essential for manufacturing high-quality, thin wafers used in a wide range of industries, including consumer electronics, automotive, and medical devices.
With the increasing demand for thin wafers, dicing technology is expected to hold a significant valuation in the global thin wafers market. Advancements in dicing technology have enabled the production of ultra-thin wafers with high accuracy and yield, further driving its market value.
Key manufacturers are investing in research and development to develop advanced manufacturing processes for producing thin wafers. This involves improving wafer thinning techniques, such as grinding, etching, or laser processing, to achieve precise thickness and maintain high wafer quality.
They aim to optimize production costs to offer competitive pricing. They seek ways to reduce material consumption, increase process efficiency, and minimize waste during the wafer manufacturing process.
Manufacturers focus on improving yield rates by minimizing defects, enhancing wafer flatness, and ensuring uniformity throughout the wafer surface. By maximizing yields, manufacturers could reduce costs and deliver reliable products to customers.
Recent developments:
| Attribute | Details |
|---|---|
| Market Size Value in 2022 | US$ 11.4 billion |
| Market Forecast Value in 2032 | US$ 26.0 billion |
| Anticipated Growth Rate (2022 to 2032) | 8.6% CAGR |
| Forecast Period | 2022 to 2032 |
| Historical Data Available for | 2017 to 2021 |
| Market Analysis | Volume (MT) and Value (US$ million) |
| Key Regions Covered | North America; Latin America; Europe; South Asia; East Asia; Oceania; and Middle East & Africa |
| Key Countries Covered | United States, Canada, Brazil, Mexico, Argentina, Germany, United Kingdom, France, Italy, Spain, BENELUX, Nordic, Russia, Poland China, Japan, South Korea, India, Thailand, Malaysia, Indonesia, Australia, New Zealand, GCC Countries, Turkey, Egypt, South Africa |
| Key Market Segments Covered | Wafer Size, Process, Technology, Application, and Regions |
| Key Companies Profiled | Shin-Etsu Chemical Co., Ltd; SUMCO Corporation; GlobalWafers Co., Ltd.; Siltronic; SK Siltron |
The market is predicted to register a CAGR of 8.6% between 2022 and 2032.
Surging demand for grinding technology across multiple sectors is the top trend in the market.
The United States held a 7.8% CAGR of the global market share from 2022 to 2032.
The significantly growing electronics sector is growing the demand in China.
The market is projected to be worth US$ 26.0 billion by 2032.
1. Executive Summary 1.1. Global Market Outlook 1.2. Demand-side Trends 1.3. Supply-side Trends 1.4. Technology Roadmap Analysis 1.5. Analysis and Recommendations 2. Market Overview 2.1. Market Coverage / Taxonomy 2.2. Market Definition / Scope / Limitations 3. Market Background 3.1. Market Dynamics 3.1.1. Drivers 3.1.2. Restraints 3.1.3. Opportunity 3.1.4. Trends 3.2. Scenario Forecast 3.2.1. Demand in Optimistic Scenario 3.2.2. Demand in Likely Scenario 3.2.3. Demand in Conservative Scenario 3.3. Opportunity Map Analysis 3.4. Product Life Cycle Analysis 3.5. Supply Chain Analysis 3.5.1. Supply Side Participants and their Roles 3.5.1.1. Producers 3.5.1.2. Mid-Level Participants (Traders/ Agents/ Brokers) 3.5.1.3. Wholesalers and Distributors 3.5.2. Value Added and Value Created at Node in the Supply Chain 3.5.3. List of Raw Material Suppliers 3.5.4. List of Existing and Potential Buyer’s 3.6. Investment Feasibility Matrix 3.7. Value Chain Analysis 3.7.1. Profit Margin Analysis 3.7.2. Wholesalers and Distributors 3.7.3. Retailers 3.8. PESTLE and Porter’s Analysis 3.9. Regulatory Landscape 3.9.1. By Key Regions 3.9.2. By Key Countries 3.10. Regional Parent Market Outlook 3.11. Production and Consumption Statistics 3.12. Import and Export Statistics 4. Global Market Analysis 2017 to 2021 and Forecast, 2022 to 2032 4.1. Historical Market Size Value (US$ Million) & Volume (Unit) Analysis, 2017 to 2021 4.2. Current and Future Market Size Value (US$ Million) & Volume (Unit) Projections, 2022 to 2032 4.2.1. Y-o-Y Growth Trend Analysis 4.2.2. Absolute $ Opportunity Analysis 5. Global Market Analysis 2017 to 2021 and Forecast 2022 to 2032 , By Wafer Size 5.1. Introduction / Key Findings 5.2. Historical Market Size Value (US$ Million) & Volume (Unit) Analysis By Wafer Size, 2017 to 2021 5.3. Current and Future Market Size Value (US$ Million) & Volume (Unit) Analysis and Forecast By Wafer Size, 2022 to 2032 5.3.1. 125 mm 5.3.2. 200 mm 5.3.3. 300 mm 5.4. Y-o-Y Growth Trend Analysis By Wafer Size, 2017 to 2021 5.5. Absolute $ Opportunity Analysis By Wafer Size, 2022 to 2032 6. Global Market Analysis 2017 to 2021 and Forecast 2022 to 2032 , By Process 6.1. Introduction/ Key Findings 6.2. Historical Market Size Value (US$ Million) & Volume (Unit) Analysis By Process, 2017 to 2021 6.3. Current and Future Market Size Value (US$ Million) & Volume (Unit) Analysis and Forecast By Process, 2022 to 2032 6.3.1. Temporary Bonding & Debonding 6.3.2. Carrier-less/Taiko Process 6.4. Y-o-Y Growth Trend Analysis By Process, 2017 to 2021 6.5. Absolute $ Opportunity Analysis By Process, 2022 to 2032 7. Global Market Analysis 2017 to 2021 and Forecast 2022 to 2032 , By Technology 7.1. Introduction / Key Findings 7.2. Historical Market Size Value (US$ Million) & Volume (Unit) Analysis By Technology, 2017 to 2021 7.3. Current and Future Market Size Value (US$ Million) & Volume (Unit) Analysis and Forecast By Technology, 2022 to 2032 7.3.1. Grinding 7.3.2. Polishing 7.3.3. Dicing 7.4. Y-o-Y Growth Trend Analysis By Technology, 2017 to 2021 7.5. Absolute $ Opportunity Analysis By Technology, 2022 to 2032 8. Global Market Analysis 2017 to 2021 and Forecast 2022 to 2032 , By Application 8.1. Introduction / Key Findings 8.2. Historical Market Size Value (US$ Million) & Volume (Unit) Analysis By Application, 2017 to 2021 8.3. Current and Future Market Size Value (US$ Million) & Volume (Unit) Analysis and Forecast By Application, 2022 to 2032 8.3.1. MEMS 8.3.2. CIS 8.3.3. Memory 8.3.4. RF Devices 8.3.5. LED 8.3.6. Interposer 8.3.7. Logic 8.3.8. Others 8.4. Y-o-Y Growth Trend Analysis By Application, 2017 to 2021 8.5. Absolute $ Opportunity Analysis By Application, 2022 to 2032 9. Global Market Analysis 2017 to 2021 and Forecast 2022 to 2032 , By Region 9.1. Introduction 9.2. Historical Market Size Value (US$ Million) & Volume (Unit) Analysis By Region, 2017 to 2021 9.3. Current Market Size Value (US$ Million) & Volume (Unit) Analysis and Forecast By Region, 2022 to 2032 9.3.1. North America 9.3.2. Latin America 9.3.3. Europe 9.3.4. Asia Pacific 9.3.5. Middle East & Africa 9.4. Market Attractiveness Analysis By Region 10. North America Market Analysis 2017 to 2021 and Forecast 2022 to 2032 , By Country 10.1. Historical Market Size Value (US$ Million) & Volume (Unit) Trend Analysis By Market Taxonomy, 2017 to 2021 10.2. Market Size Value (US$ Million) & Volume (Unit) Forecast By Market Taxonomy, 2022 to 2032 10.2.1. By Country 10.2.1.1. United States 10.2.1.2. Canada 10.2.2. By Wafer Size 10.2.3. By Process 10.2.4. By Technology 10.2.5. By Application 10.3. Market Attractiveness Analysis 10.3.1. By Country 10.3.2. By Wafer Size 10.3.3. By Process 10.3.4. By Technology 10.3.5. By Application 10.4. Key Takeaways 11. Latin America Market Analysis 2017 to 2021 and Forecast 2022 to 2032 , By Country 11.1. Historical Market Size Value (US$ Million) & Volume (Unit) Trend Analysis By Market Taxonomy, 2017 to 2021 11.2. Market Size Value (US$ Million) & Volume (Unit) Forecast By Market Taxonomy, 2022 to 2032 11.2.1. By Country 11.2.1.1. Brazil 11.2.1.2. Mexico 11.2.1.3. Rest of Latin America 11.2.2. By Wafer Size 11.2.3. By Process 11.2.4. By Technology 11.2.5. By Application 11.3. Market Attractiveness Analysis 11.3.1. By Country 11.3.2. By Wafer Size 11.3.3. By Process 11.3.4. By Technology 11.3.5. By Application 11.4. Key Takeaways 12. Europe Market Analysis 2017 to 2021 and Forecast 2022 to 2032 , By Country 12.1. Historical Market Size Value (US$ Million) & Volume (Unit) Trend Analysis By Market Taxonomy, 2017 to 2021 12.2. Market Size Value (US$ Million) & Volume (Unit) Forecast By Market Taxonomy, 2022 to 2032 12.2.1. By Country 12.2.1.1. Germany 12.2.1.2. United Kingdom 12.2.1.3. France 12.2.1.4. Spain 12.2.1.5. Italy 12.2.1.6. Rest of Europe 12.2.2. By Wafer Size 12.2.3. By Process 12.2.4. By Technology 12.2.5. By Application 12.3. Market Attractiveness Analysis 12.3.1. By Country 12.3.2. By Wafer Size 12.3.3. By Process 12.3.4. By Technology 12.3.5. By Application 12.4. Key Takeaways 13. Asia Pacific Market Analysis 2017 to 2021 and Forecast 2022 to 2032 , By Country 13.1. Historical Market Size Value (US$ Million) & Volume (Unit) Trend Analysis By Market Taxonomy, 2017 to 2021 13.2. Market Size Value (US$ Million) & Volume (Unit) Forecast By Market Taxonomy, 2022 to 2032 13.2.1. By Country 13.2.1.1. China 13.2.1.2. Japan 13.2.1.3. South Korea 13.2.1.4. Malaysia 13.2.1.5. Singapore 13.2.1.6. Australia 13.2.1.7. New Zealand 13.2.1.8. Rest of APAC 13.2.2. By Wafer Size 13.2.3. By Process 13.2.4. By Technology 13.2.5. By Application 13.3. Market Attractiveness Analysis 13.3.1. By Country 13.3.2. By Wafer Size 13.3.3. By Process 13.3.4. By Technology 13.3.5. By Application 13.4. Key Takeaways 14. Middle East & Africa Market Analysis 2017 to 2021 and Forecast 2022 to 2032, By Country 14.1. Historical Market Size Value (US$ Million) & Volume (Unit) Trend Analysis By Market Taxonomy, 2017 to 2021 14.2. Market Size Value (US$ Million) & Volume (Unit) Forecast By Market Taxonomy, 2022 to 2032 14.2.1. By Country 14.2.1.1. GCC Countries 14.2.1.2. South Africa 14.2.1.3. Israel 14.2.1.4. Rest of Middle East & Africa 14.2.2. By Wafer Size 14.2.3. By Process 14.2.4. By Technology 14.2.5. By Application 14.3. Market Attractiveness Analysis 14.3.1. By Country 14.3.2. By Wafer Size 14.3.3. By Process 14.3.4. By Technology 14.3.5. By Application 14.4. Key Takeaways 15. Key Countries Market Analysis 15.1. United States 15.1.1. Pricing Analysis 15.1.2. Market Share Analysis, 2021 15.1.2.1. By Wafer Size 15.1.2.2. By Process 15.1.2.3. By Technology 15.1.2.4. By Application 15.2. Canada 15.2.1. Pricing Analysis 15.2.2. Market Share Analysis, 2021 15.2.2.1. By Wafer Size 15.2.2.2. By Process 15.2.2.3. By Technology 15.2.2.4. By Application 15.3. Brazil 15.3.1. Pricing Analysis 15.3.2. Market Share Analysis, 2021 15.3.2.1. By Wafer Size 15.3.2.2. By Process 15.3.2.3. By Technology 15.3.2.4. By Application 15.4. Mexico 15.4.1. Pricing Analysis 15.4.2. Market Share Analysis, 2021 15.4.2.1. By Wafer Size 15.4.2.2. By Process 15.4.2.3. By Technology 15.4.2.4. By Application 15.5. Germany 15.5.1. Pricing Analysis 15.5.2. Market Share Analysis, 2021 15.5.2.1. By Wafer Size 15.5.2.2. By Process 15.5.2.3. By Technology 15.5.2.4. By Application 15.6. United Kingdom 15.6.1. Pricing Analysis 15.6.2. Market Share Analysis, 2021 15.6.2.1. By Wafer Size 15.6.2.2. By Process 15.6.2.3. By Technology 15.6.2.4. By Application 15.7. France 15.7.1. Pricing Analysis 15.7.2. Market Share Analysis, 2021 15.7.2.1. By Wafer Size 15.7.2.2. By Process 15.7.2.3. By Technology 15.7.2.4. By Application 15.8. Spain 15.8.1. Pricing Analysis 15.8.2. Market Share Analysis, 2021 15.8.2.1. By Wafer Size 15.8.2.2. By Process 15.8.2.3. By Technology 15.8.2.4. By Application 15.9. Italy 15.9.1. Pricing Analysis 15.9.2. Market Share Analysis, 2021 15.9.2.1. By Wafer Size 15.9.2.2. By Process 15.9.2.3. By Technology 15.9.2.4. By Application 15.10. China 15.10.1. Pricing Analysis 15.10.2. Market Share Analysis, 2021 15.10.2.1. By Wafer Size 15.10.2.2. By Process 15.10.2.3. By Technology 15.10.2.4. By Application 15.11. Japan 15.11.1. Pricing Analysis 15.11.2. Market Share Analysis, 2021 15.11.2.1. By Wafer Size 15.11.2.2. By Process 15.11.2.3. By Technology 15.11.2.4. By Application 15.12. South Korea 15.12.1. Pricing Analysis 15.12.2. Market Share Analysis, 2021 15.12.2.1. By Wafer Size 15.12.2.2. By Process 15.12.2.3. By Technology 15.12.2.4. By Application 15.13. Malaysia 15.13.1. Pricing Analysis 15.13.2. Market Share Analysis, 2021 15.13.2.1. By Wafer Size 15.13.2.2. By Process 15.13.2.3. By Technology 15.13.2.4. By Application 15.14. Singapore 15.14.1. Pricing Analysis 15.14.2. Market Share Analysis, 2021 15.14.2.1. By Wafer Size 15.14.2.2. By Process 15.14.2.3. By Technology 15.14.2.4. By Application 15.15. Australia 15.15.1. Pricing Analysis 15.15.2. Market Share Analysis, 2021 15.15.2.1. By Wafer Size 15.15.2.2. By Process 15.15.2.3. By Technology 15.15.2.4. By Application 15.16. New Zealand 15.16.1. Pricing Analysis 15.16.2. Market Share Analysis, 2021 15.16.2.1. By Wafer Size 15.16.2.2. By Process 15.16.2.3. By Technology 15.16.2.4. By Application 15.17. GCC Countries 15.17.1. Pricing Analysis 15.17.2. Market Share Analysis, 2021 15.17.2.1. By Wafer Size 15.17.2.2. By Process 15.17.2.3. By Technology 15.17.2.4. By Application 15.18. South Africa 15.18.1. Pricing Analysis 15.18.2. Market Share Analysis, 2021 15.18.2.1. By Wafer Size 15.18.2.2. By Process 15.18.2.3. By Technology 15.18.2.4. By Application 15.19. Israel 15.19.1. Pricing Analysis 15.19.2. Market Share Analysis, 2021 15.19.2.1. By Wafer Size 15.19.2.2. By Process 15.19.2.3. By Technology 15.19.2.4. By Application 16. Market Structure Analysis 16.1. Competition Dashboard 16.2. Competition Benchmarking 16.3. Market Share Analysis of Top Players 16.3.1. By Regional 16.3.2. By Wafer Size 16.3.3. By Process 16.3.4. By Technology 16.3.5. By Application 17. Competition Analysis 17.1. Competition Deep Dive 17.1.1. Shin-Etsu Chemical Co., Ltd. 17.1.1.1. Overview 17.1.1.2. Product Portfolio 17.1.1.3. Profitability by Market Segments 17.1.1.4. Sales Footprint 17.1.1.5. Strategy Overview 17.1.1.5.1. Marketing Strategy 17.1.1.5.2. Product Strategy 17.1.1.5.3. Channel Strategy 17.1.2. SUMCO Corporation 17.1.2.1. Overview 17.1.2.2. Product Portfolio 17.1.2.3. Profitability by Market Segments 17.1.2.4. Sales Footprint 17.1.2.5. Strategy Overview 17.1.2.5.1. Marketing Strategy 17.1.2.5.2. Product Strategy 17.1.2.5.3. Channel Strategy 17.1.3. GlobalWafers Co., Ltd 17.1.3.1. Overview 17.1.3.2. Product Portfolio 17.1.3.3. Profitability by Market Segments 17.1.3.4. Sales Footprint 17.1.3.5. Strategy Overview 17.1.3.5.1. Marketing Strategy 17.1.3.5.2. Product Strategy 17.1.3.5.3. Channel Strategy 17.1.4. Siltronic 17.1.4.1. Overview 17.1.4.2. Product Portfolio 17.1.4.3. Profitability by Market Segments 17.1.4.4. Sales Footprint 17.1.4.5. Strategy Overview 17.1.4.5.1. Marketing Strategy 17.1.4.5.2. Product Strategy 17.1.4.5.3. Channel Strategy 17.1.5. SK Siltron 17.1.5.1. Overview 17.1.5.2. Product Portfolio 17.1.5.3. Profitability by Market Segments 17.1.5.4. Sales Footprint 17.1.5.5. Strategy Overview 17.1.5.5.1. Marketing Strategy 17.1.5.5.2. Product Strategy 17.1.5.5.3. Channel Strategy 17.1.6. SUSS MicroTec 17.1.6.1. Overview 17.1.6.2. Product Portfolio 17.1.6.3. Profitability by Market Segments 17.1.6.4. Sales Footprint 17.1.6.5. Strategy Overview 17.1.6.5.1. Marketing Strategy 17.1.6.5.2. Product Strategy 17.1.6.5.3. Channel Strategy 17.1.7. Soitec 17.1.7.1. Overview 17.1.7.2. Product Portfolio 17.1.7.3. Profitability by Market Segments 17.1.7.4. Sales Footprint 17.1.7.5. Strategy Overview 17.1.7.5.1. Marketing Strategy 17.1.7.5.2. Product Strategy 17.1.7.5.3. Channel Strategy 17.1.8. DISCO Corporation 17.1.8.1. Overview 17.1.8.2. Product Portfolio 17.1.8.3. Profitability by Market Segments 17.1.8.4. Sales Footprint 17.1.8.5. Strategy Overview 17.1.8.5.1. Marketing Strategy 17.1.8.5.2. Product Strategy 17.1.8.5.3. Channel Strategy 17.1.9. 3M 17.1.9.1. Overview 17.1.9.2. Product Portfolio 17.1.9.3. Profitability by Market Segments 17.1.9.4. Sales Footprint 17.1.9.5. Strategy Overview 17.1.9.5.1. Marketing Strategy 17.1.9.5.2. Product Strategy 17.1.9.5.3. Channel Strategy 17.1.10. Applied Materials 17.1.10.1. Overview 17.1.10.2. Product Portfolio 17.1.10.3. Profitability by Market Segments 17.1.10.4. Sales Footprint 17.1.10.5. Strategy Overview 17.1.10.5.1. Marketing Strategy 17.1.10.5.2. Product Strategy 17.1.10.5.3. Channel Strategy 17.1.11. Mechatronic Systemtechnik 17.1.11.1. Overview 17.1.11.2. Product Portfolio 17.1.11.3. Profitability by Market Segments 17.1.11.4. Sales Footprint 17.1.11.5. Strategy Overview 17.1.11.5.1. Marketing Strategy 17.1.11.5.2. Product Strategy 17.1.11.5.3. Channel Strategy 17.1.12. Synova 17.1.12.1. Overview 17.1.12.2. Product Portfolio 17.1.12.3. Profitability by Market Segments 17.1.12.4. Sales Footprint 17.1.12.5. Strategy Overview 17.1.12.5.1. Marketing Strategy 17.1.12.5.2. Product Strategy 17.1.12.5.3. Channel Strategy 18. Assumptions & Acronyms Used 19. Research Methodology
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Thin Wafers Market
