[250 Pages Report] The global Wi-Fi semiconductor chipset market is expected to reach US$ 20.1 Billion in 2022. It is projected to surpass US$ 26.3 Billion and exhibit growth at a CAGR of 5.2% from 2022 to 2032. The increasing penetration of the internet and the rising number of public Wi-Fi hotspots across the globe are likely to fuel the demand for Wi-Fi semiconductor chipset in the near future.
| Report Attributes | Details |
|---|---|
| Estimated Base Year Value (2021) | US$ 19.4 Billion |
| Expected Market Value (2022) | US$ 20.1 Billion |
| Anticipated Forecast Value (2032) | US$ 26.3 Billion |
| Projected Growth Rate (2022 to 2032) | 5.2% CAGR |
A Wi-Fi semiconductor chipset is an integral component within internal hardware that is specially designed to enable the device to efficiently communicate with another wireless technology-enabled device. It is often found in a wide range of wireless devices, such as laptops, personal computers, and smartphones.
The rising inclusion of these chipsets in home and industrial automation applications is another major factor that is anticipated to bode well for the market. The increasing demand for relatively low cost chipset configuration, especially 1X1 configuration owing to its usage in generic modems and tablets is likely to drive the Wi-Fi semiconductor chipset market share throughout the forthcoming years.
Besides, the high demand for wireless connectivity from both the private and public sectors is expected to compel manufacturers in focusing on making internet connectivity speedy and more accessible even in remote parts of the world. Governments of various countries are set to invest huge sums in the development of public Wi-Fi with the rising number of smart cities.
Wi-Fi semiconductor chipsets have proved to be beneficial for educational facilities as these help in providing free connections to those who otherwise cannot afford internet at home. Users can gain access to public services and professional educational databases through these connections.
The surging adoption of various wireless connectivity technologies, especially in the automotive sector is expected to propel the sales of Wi-Fi semiconductor chipsets in the upcoming years. The industry is persistently utilizing these chipsets in automotive lighting instrument clusters and audio systems.
The ability of these chipsets to deliver fast target wakeup time, enhanced security, high-speed data transmission, and smart interface handling is also anticipated to drive their demand in the automotive sector. Many chip manufacturers are projected to focus more on the rapid development of strategic collaborations and partnerships to provide automobile companies with application-specific chipsets.
The increasing usage of IEEE 802.11ax (Wi-Fi 6 & Wi-Fi 6E) standard backed by its several advantages, such as improved power efficiency, better data rates, and high capacity is likely to accelerate the market. These benefits are set to encourage consumer electronics OEMs to include chipsets in wearable devices, tablets, and smartphones.
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The rising number of cyber and security threats is a vital factor that may hamper the Wi-Fi semiconductor chipset market share in the evaluation period. The perpetual threat of security risks and data breaches still exist even though the market is currently making sustainable progress.
Advanced hacking systems present in the cyber network are capable of lowering the reliability of internet connectivity. The cases of hacking and data leaks are expected to be more prevalent in future even with the deployment of security measures, such as WPA and WEP.
The shipment of tablets and PCs, on the other hand, is anticipated to decline in the forecast period owing to the falling prices of smartphones and the enhanced performance of phablets, which may obstruct the growth in this market.
The presence of a large number of renowned manufacturers, such as Samsung Electronics Co. Ltd., ZTE Corporation, and Huawei Technologies Co. Ltd. in South Korea and China is expected to spur the demand for Wi-Fi semiconductor chipsets in Asia Pacific. The low-cost manufacturing of these chipsets and the huge pool of consumer electronics manufacturers in China are also projected to contribute to the regional growth.
Government bodies of various developing economies in this region are investing in the upgradation of frequency bands for supporting next generation Wi-Fi. They are partnering up with educational institutions to conduct exhaustive data-intensive research, which is likely to augur well for the market.
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The surging adoption of smartphones in the U.S. and Canada is expected to drive the North America Wi-Fi semiconductor chipset market share in the assessment period. This growth is attributable to the affordable price and increasing advancements in the field of smartphones.
The demand for wireless technology in smartphones is growing at a rapid pace in North America and the usage of chipsets in these phones provide high-speed Wi-Fi or 2G/3G connectivity.
The sales of tablets are also increasing backed by the ongoing expansion of the digital market in the U.S. These are expected to be used more in the country, as compared to laptops. The incorporation of innovative Wi-Fi chipsets in tablets stoked by the high demand from the IT sector is set to push the market.
Some of the key players operating in the global Wi-Fi semiconductor chipset market are Qualcomm Technologies, Inc., Broadcom Inc., MediaTek Inc., Intel Corporation, Texas Instruments Incorporated., Hewlett Packard Enterprise Co., STMicroelectronics N.V., Samsung Electronics Co., Ltd., NXP Semiconductors N.V., On Semiconductor Co., Inc., Skyworks Solutions, Inc., Cisco Systems Inc., Simcom Wireless Solutions Limited, Peraso Technologies, Inc., Cypress Semiconductor Corporation, Dell Technologies, CommScope Holding Co., Quectel, Extreme Networks, and ASUS.
Leading players are focusing on upgrading organizations’ data transfer and bandwidth rate over wireless communication with the ongoing development in the field of IoT technology. Meanwhile, some of the other prominent companies are engaging in acquisitions and new product developments to cater to the increasing consumer demand globally by expanding their existing product portfolios.
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| Report Attributes | Details |
|---|---|
| Growth Rate | CAGR of 5.2% from 2022 to 2032 |
| Base Year for Estimation | 2021 |
| Historical Data | 2015 to 2020 |
| Forecast Period | 2022 to 2032 |
| Quantitative Units | Revenue in US$ Million, Volume in Kilotons and CAGR from 2022 to 2032 |
| Report Coverage | Revenue Forecast, Volume Forecast, Company Ranking, Competitive Landscape, Growth Factors, Trends and Pricing Analysis |
| Segments Covered | MIMO Configuration, Band, IEEE Standard, Vertical, End Use, Region |
| Regions Covered | North America; Latin America; Western Europe; Eastern Europe; APEJ; Japan; Middle East and Africa |
| Key Countries Profiled | USA, Canada, Brazil, Argentina, Germany, UK, France, Spain, Italy, Nordics, BENELUX, Australia & New Zealand, China, India, ASEAN, GCC, South Africa |
| Key Companies Profiled | Qualcomm Technologies, Inc.; Broadcom Inc.; MediaTek Inc.; Intel Corporation; Texas Instruments Incorporated.; Hewlett Packard Enterprise Co.; STMicroelectronics N.V.; Samsung Electronics Co., Ltd.; NXP Semiconductors N.V.; On Semiconductor Co., Inc.; Skyworks Solutions, Inc.; Cisco Systems Inc.; Simcom Wireless Solutions Limited; Peraso Technologies, Inc.; Cypress Semiconductor Corporation; Dell Technologies; CommScope Holding Co.; Quectel; Extreme Networks; ASUS |
| Customization | Available Upon Request |
MIMO Configuration:
Band:
IEEE Standard:
Vertical:
End Use:
Region:
FMI projects the global Wi-Fi semiconductor chipset market to expand at a 5.2% value CAGR by 2032.
Asia Pacific is expected to be the most opportunistic Wi-Fi semiconductor chipset market.
Qualcomm Technologies, Inc., Broadcom Inc., MediaTek Inc., Intel Corporation, Texas Instruments Incorporated., and Hewlett Packard Enterprise Co. are some of the prominent Wi-Fi semiconductor chipset manufacturers.
1. Executive Summary 1.1. Global Market Outlook 1.2. Demand-side Trends 1.3. Supply-side Trends 1.4. Technology Roadmap Analysis 1.5. Analysis and Recommendations 2. Market Overview 2.1. Market Coverage / Taxonomy 2.2. Market Definition / Scope / Limitations 3. Market Background 3.1. Market Dynamics 3.1.1. Drivers 3.1.2. Restraints 3.1.3. Opportunity 3.1.4. Trends 3.2. Scenario Forecast 3.2.1. Demand in Optimistic Scenario 3.2.2. Demand in Likely Scenario 3.2.3. Demand in Conservative Scenario 3.3. Opportunity Map Analysis 3.4. Investment Feasibility Matrix 3.5. Value Chain Analysis 3.5.1. Profit Margin Analysis 3.5.2. Service Providers 3.6. PESTLE and Porter’s Analysis 3.7. Regulatory Landscape 3.7.1. By Key Regions 3.7.2. By Key Countries 3.8. Regional Parent Market Outlook 4. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast, 2022-2032 4.1. Historical Market Size Value (US$ Mn) Analysis, 2017-2021 4.2. Current and Future Market Size Value (US$ Mn) Projections, 2022-2032 4.2.1. Y-o-Y Growth Trend Analysis 4.2.2. Absolute $ Opportunity Analysis 5. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By IEEE Standard 5.1. Introduction / Key Findings 5.2. Historical Market Size Value (US$ Mn) Analysis By IEEE Standard, 2017-2021 5.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By IEEE Standard, 2022-2032 5.3.1. 802.11 a/b/g/n 5.3.2. 802.11 ac 5.3.3. 802.11 ad 5.3.4. Others 5.4. Y-o-Y Growth Trend Analysis By IEEE Standard, 2017-2021 5.5. Absolute $ Opportunity Analysis By IEEE Standard, 2022-2032 Deep-dive segmentation will be available in the sample on request 6. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Technology 6.1. Introduction / Key Findings 6.2. Historical Market Size Value (US$ Mn) Analysis By Technology, 2017-2021 6.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By Technology, 2022-2032 6.3.1. Ultra-low Power Based Chipset 6.3.2. Integrated System-on-Chip Based Chipset 6.4. Y-o-Y Growth Trend Analysis By Technology, 2017-2021 6.5. Absolute $ Opportunity Analysis By Technology, 2022-2032 Deep-dive segmentation will be available in the sample on request 7. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Application 7.1. Introduction / Key Findings 7.2. Historical Market Size Value (US$ Mn) Analysis By Application, 2017-2021 7.3. Current and Future Market Size Value (US$ Mn) Analysis and Forecast By Application, 2022-2032 7.3.1. Consumer Electronics 7.3.2. Medical & Healthcare 7.3.3. Military & Defence 7.3.4. Automation 7.4. Y-o-Y Growth Trend Analysis By Application, 2017-2021 7.5. Absolute $ Opportunity Analysis By Application, 2022-2032 Deep-dive segmentation will be available in the sample on request 8. Global Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Region 8.1. Introduction 8.2. Historical Market Size Value (US$ Mn) Analysis By Region, 2017-2021 8.3. Current Market Size Value (US$ Mn) Analysis and Forecast By Region, 2022-2032 8.3.1. North America 8.3.2. Latin America 8.3.3. Europe 8.3.4. East Asia 8.3.5. South Asia & Pacific 8.3.6. MEA 8.4. Market Attractiveness Analysis By Region 9. North America Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country 9.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021 9.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032 9.2.1. By Country 9.2.1.1. U.S. 9.2.1.2. Canada 9.2.2. By IEEE Standard 9.2.3. By Technology 9.2.4. By Application 9.3. Market Attractiveness Analysis 9.3.1. By Country 9.3.2. By IEEE Standard 9.3.3. By Technology 9.3.4. By Application 9.4. Key Takeaways 10. Latin America Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country 10.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021 10.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032 10.2.1. By Country 10.2.1.1. Mexico 10.2.1.2. Brazil 10.2.1.3. Rest of Latin America 10.2.2. By IEEE Standard 10.2.3. By Technology 10.2.4. By Application 10.3. Market Attractiveness Analysis 10.3.1. By Country 10.3.2. By IEEE Standard 10.3.3. By Technology 10.3.4. By Application 10.4. Key Takeaways 11. Europe Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country 11.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021 11.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032 11.2.1. By Country 11.2.1.1. Germany 11.2.1.2. Italy 11.2.1.3. France 11.2.1.4. U.K. 11.2.1.5. Spain 11.2.1.6. BENELUX 11.2.1.7. Russia 11.2.1.8. Rest of Europe 11.2.2. By IEEE Standard 11.2.3. By Technology 11.2.4. By Application 11.3. Market Attractiveness Analysis 11.3.1. By Country 11.3.2. By IEEE Standard 11.3.3. By Technology 11.3.4. By Application 11.4. Key Takeaways 12. East Asia Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country 12.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021 12.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032 12.2.1. By Country 12.2.1.1. China 12.2.1.2. Japan 12.2.1.3. South Korea 12.2.2. By IEEE Standard 12.2.3. By Technology 12.2.4. By Application 12.3. Market Attractiveness Analysis 12.3.1. By Country 12.3.2. By IEEE Standard 12.3.3. By Technology 12.3.4. By Application 12.4. Key Takeaways 13. South Asia & Pacific Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country 13.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021 13.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032 13.2.1. By Country 13.2.1.1. India 13.2.1.2. ASEAN 13.2.1.3. Australia and New Zealand 13.2.1.4. Rest of South Asia & Pacific 13.2.2. By IEEE Standard 13.2.3. By Technology 13.2.4. By Application 13.3. Market Attractiveness Analysis 13.3.1. By Country 13.3.2. By IEEE Standard 13.3.3. By Technology 13.3.4. By Application 13.4. Key Takeaways 14. MEA Wi-Fi Semiconductor Chipset Market Analysis 2017-2021 and Forecast 2022-2032, By Country 14.1. Historical Market Size Value (US$ Mn) Trend Analysis By Market Taxonomy, 2017-2021 14.2. Market Size Value (US$ Mn) Forecast By Market Taxonomy, 2022-2032 14.2.1. By Country 14.2.1.1. GCC Countries 14.2.1.2. Turkey 14.2.1.3. South Africa 14.2.1.4. Rest of MEA 14.2.2. By IEEE Standard 14.2.3. By Technology 14.2.4. By Application 14.3. Market Attractiveness Analysis 14.3.1. By Country 14.3.2. By IEEE Standard 14.3.3. By Technology 14.3.4. By Application 14.4. Key Takeaways 15. Key Countries Wi-Fi Semiconductor Chipset Market Analysis 15.1. U.S. 15.1.1. Pricing Analysis 15.1.2. Market Share Analysis, 2021 15.1.2.1. By IEEE Standard 15.1.2.2. By Technology 15.1.2.3. By Application 15.2. Canada 15.2.1. Pricing Analysis 15.2.2. Market Share Analysis, 2021 15.2.2.1. By IEEE Standard 15.2.2.2. By Technology 15.2.2.3. By Application 15.3. Mexico 15.3.1. Pricing Analysis 15.3.2. Market Share Analysis, 2021 15.3.2.1. By IEEE Standard 15.3.2.2. By Technology 15.3.2.3. By Application 15.4. Brazil 15.4.1. Pricing Analysis 15.4.2. Market Share Analysis, 2021 15.4.2.1. By IEEE Standard 15.4.2.2. By Technology 15.4.2.3. By Application 15.5. Germany 15.5.1. Pricing Analysis 15.5.2. Market Share Analysis, 2021 15.5.2.1. By IEEE Standard 15.5.2.2. By Technology 15.5.2.3. By Application 15.6. Italy 15.6.1. Pricing Analysis 15.6.2. Market Share Analysis, 2021 15.6.2.1. By IEEE Standard 15.6.2.2. By Technology 15.6.2.3. By Application 15.7. France 15.7.1. Pricing Analysis 15.7.2. Market Share Analysis, 2021 15.7.2.1. By IEEE Standard 15.7.2.2. By Technology 15.7.2.3. By Application 15.8. U.K. 15.8.1. Pricing Analysis 15.8.2. Market Share Analysis, 2021 15.8.2.1. By IEEE Standard 15.8.2.2. By Technology 15.8.2.3. By Application 15.9. Spain 15.9.1. Pricing Analysis 15.9.2. Market Share Analysis, 2021 15.9.2.1. By IEEE Standard 15.9.2.2. By Technology 15.9.2.3. By Application 15.10. BENELUX 15.10.1. Pricing Analysis 15.10.2. Market Share Analysis, 2021 15.10.2.1. By IEEE Standard 15.10.2.2. By Technology 15.10.2.3. By Application 15.11. Russia 15.11.1. Pricing Analysis 15.11.2. Market Share Analysis, 2021 15.11.2.1. By IEEE Standard 15.11.2.2. By Technology 15.11.2.3. By Application 15.12. China 15.12.1. Pricing Analysis 15.12.2. Market Share Analysis, 2021 15.12.2.1. By IEEE Standard 15.12.2.2. By Technology 15.12.2.3. By Application 15.13. Japan 15.13.1. Pricing Analysis 15.13.2. Market Share Analysis, 2021 15.13.2.1. By IEEE Standard 15.13.2.2. By Technology 15.13.2.3. By Application 15.14. South Korea 15.14.1. Pricing Analysis 15.14.2. Market Share Analysis, 2021 15.14.2.1. By IEEE Standard 15.14.2.2. By Technology 15.14.2.3. By Application 15.15. India 15.15.1. Pricing Analysis 15.15.2. Market Share Analysis, 2021 15.15.2.1. By IEEE Standard 15.15.2.2. By Technology 15.15.2.3. By Application 15.16. ASEAN 15.16.1. Pricing Analysis 15.16.2. Market Share Analysis, 2021 15.16.2.1. By IEEE Standard 15.16.2.2. By Technology 15.16.2.3. By Application 15.17. Australia and New Zealand 15.17.1. Pricing Analysis 15.17.2. Market Share Analysis, 2021 15.17.2.1. By IEEE Standard 15.17.2.2. By Technology 15.17.2.3. By Application 15.18. GCC Countries 15.18.1. Pricing Analysis 15.18.2. Market Share Analysis, 2021 15.18.2.1. By IEEE Standard 15.18.2.2. By Technology 15.18.2.3. By Application 15.19. Turkey 15.19.1. Pricing Analysis 15.19.2. Market Share Analysis, 2021 15.19.2.1. By IEEE Standard 15.19.2.2. By Technology 15.19.2.3. By Application 15.20. South Africa 15.20.1. Pricing Analysis 15.20.2. Market Share Analysis, 2021 15.20.2.1. By IEEE Standard 15.20.2.2. By Technology 15.20.2.3. By Application 16. Market Structure Analysis 16.1. Competition Dashboard 16.2. Competition Benchmarking 16.3. Market Share Analysis of Top Players 16.3.1. By Regional 16.3.2. By IEEE Standard 16.3.3. By Technology 16.3.4. By Application 17. Competition Analysis 17.1. Competition Deep Dive 17.1.1. Telit 17.1.1.1. Overview 17.1.1.2. Product Portfolio 17.1.1.3. Profitability by Market Segments 17.1.1.4. Sales Footprint 17.1.1.5. Strategy Overview 17.1.1.5.1. Marketing Strategy 17.1.1.5.2. Product Strategy 17.1.1.5.3. Channel Strategy 17.1.2. Microchip Technology 17.1.2.1. Overview 17.1.2.2. Product Portfolio 17.1.2.3. Profitability by Market Segments 17.1.2.4. Sales Footprint 17.1.2.5. Strategy Overview 17.1.2.5.1. Marketing Strategy 17.1.2.5.2. Product Strategy 17.1.2.5.3. Channel Strategy 17.1.3. Intel Corp 17.1.3.1. Overview 17.1.3.2. Product Portfolio 17.1.3.3. Profitability by Market Segments 17.1.3.4. Sales Footprint 17.1.3.5. Strategy Overview 17.1.3.5.1. Marketing Strategy 17.1.3.5.2. Product Strategy 17.1.3.5.3. Channel Strategy 17.1.4. Marvell Technology Group Ltd 17.1.4.1. Overview 17.1.4.2. Product Portfolio 17.1.4.3. Profitability by Market Segments 17.1.4.4. Sales Footprint 17.1.4.5. Strategy Overview 17.1.4.5.1. Marketing Strategy 17.1.4.5.2. Product Strategy 17.1.4.5.3. Channel Strategy 17.1.5. Qualcomm Incorporated 17.1.5.1. Overview 17.1.5.2. Product Portfolio 17.1.5.3. Profitability by Market Segments 17.1.5.4. Sales Footprint 17.1.5.5. Strategy Overview 17.1.5.5.1. Marketing Strategy 17.1.5.5.2. Product Strategy 17.1.5.5.3. Channel Strategy 17.1.6. Texas Instruments Incorporated 17.1.6.1. Overview 17.1.6.2. Product Portfolio 17.1.6.3. Profitability by Market Segments 17.1.6.4. Sales Footprint 17.1.6.5. Strategy Overview 17.1.6.5.1. Marketing Strategy 17.1.6.5.2. Product Strategy 17.1.6.5.3. Channel Strategy 17.1.7. Broadcom Corporation 17.1.7.1. Overview 17.1.7.2. Product Portfolio 17.1.7.3. Profitability by Market Segments 17.1.7.4. Sales Footprint 17.1.7.5. Strategy Overview 17.1.7.5.1. Marketing Strategy 17.1.7.5.2. Product Strategy 17.1.7.5.3. Channel Strategy 18. Assumptions & Acronyms Used 19. Research Methodology
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Wi-Fi Semiconductor Chipset Market
