Direct-to-chip liquid cooling is projected to account for 44.0% of Cooling Architecture demand in 2026, Dry coolers 29.0% of Heat Rejection / Secondary Loop, 251-500 kW 34.0% of Rack Density, Hyperscale AI 48.0% of Data Center Type and Cooling OEM direct 36.0% of Route to Market. Adoption is being shaped by higher accelerator heat flux, rack-level liquid integration and the need to make facility heat rejection compatible with AI infrastructure buildouts.