Explore the Global High-Temperature Adhesives for SiC/GaN Power Module Packaging Market— analysis of key trends, regional growth, top players, and a 10-year forecast from 2026 to 2036.

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High-Temperature Adhesives for SiC/GaN Power Module Packaging Market

Key Insight

FMI suggests high-temperature adhesives for SiC/GaN power module packaging market was valued at USD 55.1 million in 2025. Demand is expected to reach USD 63.8 million in 2026 and USD 276.6 million by 2036. Silver sinter paste is poised to lead by adhesive chemistry with 46.0% share in 2026, and die attach is projected to lead by packaging function with 51% share in 2036.

March 20, 2026

Nikhil Kaitwade

250 Pages

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High-Temperature Adhesives for SiC/GaN Power Module Packaging Market

https://www.futuremarketinsights.com/reports/high-temperature-adhesives-for-sic-gan-power-module-packaging-market

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High-Temperature Adhesives for SiC/GaN Power Module Packaging Market

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