Electronic Board Level Underfill Material Market
Find Out How Rapid Growth Of Electronics Industry Is Influencing Sales of Electronic Board Level Underfill Materials!
Electronic Board Level Underfill Material Market by Product Type, Material Type, Board Type & Region - Forecast 2022 - 2032
Electronic Board Level Underfill Material Market Outlook (2022-2032)
[200 Pages Report] The global electronic board level underfill material market size reached US$ 295.9 Mn in 2021 and is expected to touch a valuation of US$ 310.7 Mn in 2022. Furthermore, with rise in production and usage of electronic products, the overall sales of electronic board level underfill materials are projected to grow at 5.3% CAGR between 2022 and 2032, surpassing a valuation of US$ 520.7 Mn by the end of 2032.
|
Attribute |
Key Statistics |
|
Electronic Board Level Underfill Material Market Base Value (2021A) |
US$ 295.9 Mn |
|
Estimated Market Size (2022E) |
US$ 310.7 Mn |
|
Projected Market Size (2032F) |
US$ 520.7 Mn |
|
Value-based CAGR (2022-2032) |
5.3% |
|
Collective Value Share: Top 3 Countries (2022E) |
31.1% |
Underfill is typically utilized to spread and redistribute the thermo-mechanical stress caused by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate in order to improve the reliability of a CSP, BGA, or flip chip on an organic board package. These underfills are manufactured from a variety of substances, including epoxy, silica, alumina, silica gel, urethane, and many others.
Electronic board level underfill materials provide mechanical reinforcement to the solder joints and solder balls that connect a chip to a printed circuit board. Thus, they play a key role in extending thermal aging and lifetime of electronic devices.
Rising usage of consumer electronic products such as smartphones, tablets, cameras, laptops, etc. across the world is proving a major impetus to the growth of electronic board level underfill material market and the trend is likely to continue during the forecast period.
Over, the years, rapid penetration of digitalization and fast internet has result in the rapid growth of smartphone industry. People are choosing smartphones over other electronic devices like PC’s and laptops due to their mobility, usability, and affordable price. This surge in the adoption of smartphones along with the continous introduction of new generation smartphones at affordable prices is expected to act as a catalyst triggering growth in the electronic board level underfill material market.
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2015-2021 Electronic Board Level Underfill Material Market Outlook Compared to 2022-2032 Forecast
The global electronic board level underfill material market is set to expand at 5.3% CAGR between 2022 and 2032, in comparison to 3.1% CAGR registered during the historical period of 2015 and 2021. Growing usage of electronic devices and ongoing trend of miniaturization and development of multi-feature electronic devices are some of the key factors expected to boost growth in the global electronic board level underfill material market during the forecast period.
Growing propensity towards miniaturization of electronic devices is consistently increasing number of components on printed circuit boards (PCBs) which is propelling the demand graph of smaller, thinner, and highly integrated printed circuit boards (PCBs) incorporated with flip chip and other advanced technologies. This will continue to generate lucrative growth opportunities for electronic board level underfill material market during the assessment period.
Similarly, booming electronic industry across the world, rapid penetration of digitalization, and rsie in the export of electronic products will boost the demand for electronic board level underfill materials over the next ten years.
What are the Key Trends Driving the Electronic Board Level Underfill Material Market?
Rising Investments in Electronics Production to Push Sales of Electronic Board Level Underfill Materials in the Market”
The electronic industry is one of the most dynamic sectors of the economy and its meteoric rise has prompted major shifts in funding. The integration of manufacturing networks in the electronics sector have been very beneficial to the ASEAN region, as they have allowed for better commerce with bigger Asian economies like China.
China, however, is crucial not as a rival but as a developing market for the Asian electronic sector. China acquires raw materials and components from other Asian nations and then ships them all over the globe.
For instance, in January 2016, China’s Ministry of Industry and Information Technology, in partnership with an industry group and Ping and Bank, set up a US $30 billion fund for the electronic industry in China. This fund helps in addressing the issues faced by small and medium-sized electronic manufacturers, which have folded recently. This fund has also expanded the country’s technology capabilities and supports the country’s significant electronics supply chain.
Thus, rapid surge in the production of electronics will continue to foster growth of the global electronic board level underfill material market during the forecast period.
“Increasing Prominence of Miniaturization of Electronic Components to Supplement Market Growth'
Miniaturization of electronic devices has led to an increase in the number of components on a printed circuit board. This growing trend has enhanced the demand for smaller, thinner and more highly integrated printed circuit boards (PCBs) that are populated with flip chip technology. This nanotechnology and micro electromechanical systems (MEMS) are growing in functionality as well as acceptance in a majority of applications among various industries, such as consumer electronics and others. The current pace of miniaturization of electronic devices will result in a surge in demand for PCBs in near future.
Miniaturization of electronic devices, such as laptops, smartphones, consumer electronics and many more, has led to increased usage of underfills materials in encapsulation and cavity filling type applications, thereby creating growth prospects for the global electronic board level underfill material market.
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Why is the Demand for Electronic Board Level Underfill Materials Rising at a Robust Pace in the U.S.?
“Rapid Production and Usage of Electronic Products Fueling Sales in the U.S.”
As per FMI, the U.S. is projected to account for a significant share approximately of more than 19.4% in the global electronic board level underfill material market in 2022. Rapid growth in demand for electronic devices across the country is expected to propel the country’s consumption over the forecast period.
The U.S. is one of the largest consumers of electronic board level underfill materials across the globe. High disposable income and per capita expenditure of Americans is creating a huge demand for electronic devices such as home automation devices, smartphones, laptops, tablets, and various other. This in turn will continue to propel sales of electronic board level underfill materials during the forecast period.
Similarly, rise in the transport of electronic products will create growth opportunities for leading manufacturers across the U.S. during the assessment period.
Why is China Emerging as a Lucrative Market for Electronic Board Level Underfill Materials?
“Availability of Electronic Board Level Underfill Materials at Lower Prices Igniting Growth in China Market”
With rapid expansion of electronic industry and presence of product types at cheaper costs, the electronic board level underfill material market in China is poised to grow at a healthy pace of around 6.2% CAGR during the forecast period.
Most of the manufacturing companies based in China are focusing to enhance their market share and presence through offering innovative products in a short time cycle, at low cost, with improved product quality as well as higher performance.
Category-wise Insights
Which Product Type is High in Demand in the Global Electronic Board Level Underfill Material Market?
“Demand to Remain High for Underfills in the Market”
As per FMI, the underfills segment is expected to dominate the global electronic board level underfill material market during the forecast period, owing to the rising usage of underfills in a wide range of electronic products.
In recent years, demand for miniaturized electronic devices has been increasing. With the growing demand for miniature circuit geometries, underfill materials are becoming popular, which is slated to increase demand over the forecast period
Emerging trends reveal that the underfills segment will gain 140 BPS during the forecast period of 2022-2032
Which is The Most Preferred Material Type For Electronic Board Level Underfills?
“End Users Prefer Epoxy Based Electronic Board Level Underfills”
Among material types, epoxy based material is vastly used as a board level underfill material owing to its properties, such as high CTE (Coefficient of Thermal Expansion), which makes its very efficient to be used as an underfill material.
The epoxy based material segment is estimated to hold the highest value share in 2022 and is expected to gain 380 BPS over the forecast period.
However, Quartz/Silicone and Alumina based underfill material segment is also estimated to be growing at significant CAGR owing to their application in all board types.
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Competitive Landscape
Manufacturers of Electronic Board Level Underfill Material are positively engaged in expansion of their geographic and market presence in order to cater the rising demand for the product. They are engaged in expansion of production facilities and acquisitions/mergers of regional small, and medium level players to achieve domination in the market. For Instance,
- In May 2020, Parker Lord Corporation signed a strategic partnership with Brightwater United Aero Group for enhancing customer support throughout the world.
- In October 2019, Parker Hannifin, a global leader of motion and control technologies completed acquisition of LORD corporation for 3.8 billion dollars to start its engineering materials division.
- In December 2019, Henkel completed acquisitions of Deva Holdings Inc., a U.S based company to strengthen its distribution network in the U.S.
Scope of Report
|
Attribute |
Details |
|
Estimated Market Size (2022) |
US$ 310.7 Mn |
|
Projected Market Size (2032) |
US$ 520.7 Mn |
|
Anticipated Market Size (2022-20320 |
5.3% |
|
Forecast Period |
2022-2032 |
|
Historical Data Available for |
2015-2021 |
|
Market Analysis |
US$ Million for Value and Tons for Volume |
|
Key Regions Covered |
North America, Latin America, Europe, East Asia, South Asia Pacific, MEA. |
|
Key Countries Covered |
U.S., Canada, Brazil, Mexico, Germany, Italy, France, U.K., Spain, BENELUX, Russia, China, Japan South Korea, India, ASEAN, ANZ, GCC Countries, Turkey, South Africa and Northern Africa |
|
Key Segments Covered |
Product Type, Material Type, Board Type, and Region |
|
Key Companies Profiled |
|
|
Report Coverage |
Market Forecast, Company Share Analysis, Competition Intelligence, DROT Analysis, Market Dynamics and Challenges, and Strategic Growth Initiatives |
Electronic Board Level Underfill Material Market by Category
By Product Type:
- Underfills
- Capillary
- Edge Bonds
- Gob Top Encapsulations
By Material Type:
- Quartz / Silicone
- Alumina Based
- Epoxy Based
- Urethane Based
- Acrylic Based
- Others
By Board Type:
- CSP (Chip Scale Package)
- BGA (Ball Grid array)
- Flip Chips
By Region:
- North America
- Latin America
- Europe
- East Asia
- South Asia Pacific
- MEA
Frequently Asked Questions
What is the current size of global electronic board level underfill material market?
The global electronic board level underfill material market size is expected to total US$ 310.7 Mn in 2022.
At what rate will the electronic board level underfill material market grow from 2022 and 2032?
As per FMI, the global electronic board level underfill material market is estimated to exhibit a growth rate of 5.3% CAGR between 2022 and 2032 on value basis.
What is the projected valuation for the electronic board level underfill material market by 2032?
The overall electronic board level underfill material market is projecetd to reach a valuation of US$ 520.7 Mn by 2032.
Which product type segment dominates the electronic board level underfill material market?
Underfills segment is expected to lead the global electronic board level underfill material market in 2022 and beyond.
Who are the top players in the electronic board level underfill material market and what is their total share?
Henkel AG & Co. KGaA, Namics Corporation, ASE Group ,MacDermid Alpha Electronic Solutions, Parker LORD Corporation, H.B. Fuller Company, Dow Inc., ELANTAS GmbH, Zymet, Hitachi Chemical Co., Ltd., Panasonic Corporation, AI Technology, Inc, Indium Corporation, Sanyu Rec Co., Ltd., Dymax Corporation, Epoxy Technology, Inc., Protavic International, YINCAE Advanced Materials, LLC and others are the leading market players in the electronic board level underfill material market, collectively accountin
What is the demand outlook for electronic board level underfill material market in China?
Demand for electronic board underfill materials in China is expected to increase by 6.2% CAGR between 2022 and 2032 on value basis.
Table of Content
1. Executive Summary 1.1. Global Market Outlook 1.2. Demand Side Trends 1.3. Supply Side Trends 1.4. Analysis and Recommendations 2. Market Overview 2.1. Market Coverage / Taxonomy 2.2. Market Definition / Scope / Limitations 3. Key Market Trends 3.1. Key Trends Impacting the Market 3.2. Product Innovation / Development Trends 4. Key Success Factors 4.1. Product Adoption / Usage Analysis 4.2. Product USPs / Features 4.3. Strategic Promotional Strategies 5. Global Electronic Board Level Underfill Material Market Demand Analysis 2015-2021 and Forecast, 2022-2032 5.1. Historical Market Volume (Tons) Analysis, 2015-2021 5.2. Current and Future Market Volume (Tons) Projections, 2022-2032 5.3. Y-o-Y Growth Trend Analysis 6. Global Electronic Board Level Underfill Material Market - Pricing Analysis 6.1. Regional Pricing Analysis by Product Type 6.2. Pricing Break-up 6.2.1. Manufacturer Level Pricing 6.2.2. Distributor Level Pricing 6.3. Global Average Pricing Analysis Benchmark 7. Global Electronic Board Level Underfill Material Market Demand (in Value or Size in US$ Mn) Analysis 2015-2021 and Forecast, 2022-2032 7.1. Historical Market Value (US$ Mn) Analysis, 2015-2021 7.2. Current and Future Market Value (US$ Mn) Projections, 2022-2032 7.2.1. Y-o-Y Growth Trend Analysis 7.2.2. Absolute $ Opportunity Analysis 8. Market Background 8.1. Macro-Economic Factors 8.2. Forecast Factors - Relevance & Impact 8.3. Value Chain 8.3.1. List of Raw Material Suppliers 8.3.2. List of Manufacturers 8.3.3. List of End-users/potential buyers 8.4. COVID-19 Impact 8.5. Market Dynamics 8.5.1. Drivers 8.5.2. Restraints 8.5.3. Opportunity Analysis 8.6. Production Process Overview 8.7. Key Regulations Overview 9. Global Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032, by Product Type 9.1. Introduction / Key Findings 9.2. Historical Market Size (US$ Mn) and Volume Analysis by Product Type, 2015–2021 9.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast by Product Type, 2022–2032 9.3.1. Underfills 9.3.1.1. Capillary 9.3.1.2. Edge Bonds 9.3.2. Gob Top Encapsulations 9.4. Market Attractiveness Analysis by Product Type 10. Global Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032, by Material Type 10.1. Introduction / Key Findings 10.2. Historical Market Size (US$ Mn) and Volume Analysis by Material Type, 2015–2021 10.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast by Material Type, 2022–2032 10.3.1. Quartz/Silicone 10.3.2. Alumina Based 10.3.3. Epoxy Based 10.3.4. Urethane Based 10.3.5. Acrylic Based 10.3.6. Others 10.4. Market Attractiveness Analysis by Material Type 11. Global Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032, by Board Type 11.1. Introduction / Key Findings 11.2. Historical Market Size (US$ Mn) and Volume Analysis by Board Type, 2015–2021 11.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast by Board Type, 2022–2032 11.3.1. CSP (Chip Scale Package) 11.3.2. BGA (Ball Grid array) 11.3.3. Flip Chips 11.4. Market Attractiveness Analysis by Board Type 12. Global Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032, by Region 12.1. Introduction 12.2. Historical Market Size (US$ Mn) and Volume Analysis by Region, 2015–2021 12.3. Current Market Size (US$ Mn) and Volume Analysis and Forecast by Region, 2022–2032 12.3.1. North America 12.3.2. Latin America 12.3.3. Europe 12.3.4. East Asia 12.3.5. South Asia Pacific 12.3.6. Middle East & Africa 12.4. Market Attractiveness Analysis by Region 13. North America Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032 13.1. Introduction 13.2. Pricing Analysis 13.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2015–2021 13.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2022–2032 13.4.1. By Country 13.4.1.1. U.S. 13.4.1.2. Canada 13.4.2. By Product Type 13.4.3. By Material Type 13.4.4. By Board Type 13.5. Market Attractiveness Analysis 13.5.1. By Country 13.5.2. By Product Type 13.5.3. By Material Type 13.5.4. By Board Type 13.6. Drivers and Restraints - Impact Analysis 14. Latin America Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032 14.1. Introduction 14.2. Pricing Analysis 14.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2015–2021 14.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2022–2032 14.4.1. By Country 14.4.1.1. Brazil 14.4.1.2. Mexico 14.4.1.3. Rest of Latin America 14.4.2. By Product Type 14.4.3. By Material Type 14.4.4. By Board Type 14.5. Market Attractiveness Analysis 14.5.1. By Country 14.5.2. By Product Type 14.5.3. By Material Type 14.5.4. By Board Type 14.6. Drivers and Restraints - Impact Analysis 15. Europe Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032 15.1. Introduction 15.2. Pricing Analysis 15.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2015–2021 15.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2022–2032 15.4.1. By Country 15.4.1.1. Germany 15.4.1.2. Italy 15.4.1.3. France 15.4.1.4. U.K. 15.4.1.5. Spain 15.4.1.6. BENELUX 15.4.1.7. Russia 15.4.1.8. Rest of Europe 15.4.2. By Product Type 15.4.3. By Material Type 15.4.4. By Board Type 15.5. Market Attractiveness Analysis 15.5.1. By Country 15.5.2. By Product Type 15.5.3. By Material Type 15.5.4. By Board Type 15.6. Drivers and Restraints - Impact Analysis 16. South Asia & Pacific Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032 16.1. Introduction 16.2. Pricing Analysis 16.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2015–2021 16.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2022–2032 16.4.1. By Country 16.4.1.1. India 16.4.1.2. ASEAN 16.4.1.3. Rest of SAP 16.4.2. By Product Type 16.4.3. By Material Type 16.4.4. By Board Type 16.5. Market Attractiveness Analysis 16.5.1. By Country 16.5.2. By Product Type 16.5.3. By Material Type 16.5.4. By Board Type 16.6. Drivers and Restraints - Impact Analysis 17. East Asia Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032 17.1. Introduction 17.2. Pricing Analysis 17.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2015–2021 17.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2022–2032 17.4.1. By Country 17.4.1.1. China 17.4.1.2. Japan 17.4.1.3. South Korea 17.4.2. By Product Type 17.4.3. By Material Type 17.4.4. By Board Type 17.5. Market Attractiveness Analysis 17.5.1. By Country 17.5.2. By Product Type 17.5.3. By Material Type 17.5.4. By Board Type 17.6. Drivers and Restraints - Impact Analysis 18. Middle East and Africa Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032 18.1. Introduction 18.2. Pricing Analysis 18.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2015–2021 18.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2022–2032 18.4.1. By Country 18.4.1.1. GCC Countries 18.4.1.2. Turkey 18.4.1.3. Northern Africa 18.4.1.4. South Africa 18.4.1.5. Rest of Middle East and Africa 18.4.2. By Product Type 18.4.3. By Material Type 18.4.4. By Board Type 18.5. Market Attractiveness Analysis 18.5.1. By Country 18.5.2. By Product Type 18.5.3. By Material Type 18.5.4. By Board Type 18.6. Drivers and Restraints - Impact Analysis 19. Country-wise Electronic Board Level Underfill Material Market Analysis 19.1. U.S. Electronic Board Level Underfill Material Market Analysis 19.1.1. By Product Type 19.1.2. By Material Type 19.1.3. By Board Type 19.2. Canada Electronic Board Level Underfill Material Market Analysis 19.2.1. By Product Type 19.2.2. By Material Type 19.2.3. By Board Type 19.3. Mexico Electronic Board Level Underfill Material Market Analysis 19.3.1. By Product Type 19.3.2. By Material Type 19.3.3. By Board Type 19.4. Brazil Electronic Board Level Underfill Material Market Analysis 19.4.1. By Product Type 19.4.2. By Material Type 19.4.3. By Board Type 19.5. Germany Electronic Board Level Underfill Material Market Analysis 19.5.1. By Product Type 19.5.2. By Material Type 19.5.3. By Board Type 19.6. Italy Electronic Board Level Underfill Material Market Analysis 19.6.1. By Product Type 19.6.2. By Material Type 19.6.3. By Board Type 19.7. France Electronic Board Level Underfill Material Market Analysis 19.7.1. By Product Type 19.7.2. By Material Type 19.7.3. By Board Type 19.8. U.K. Electronic Board Level Underfill Material Market Analysis 19.8.1. By Product Type 19.8.2. By Material Type 19.8.3. By Board Type 19.9. Spain Electronic Board Level Underfill Material Market Analysis 19.9.1. By Product Type 19.9.2. By Material Type 19.9.3. By Board Type 19.10. BENELUX Electronic Board Level Underfill Material Market Analysis 19.10.1. By Product Type 19.10.2. By Material Type 19.10.3. By Board Type 19.11. Russia Electronic Board Level Underfill Material Market Analysis 19.11.1. By Product Type 19.11.2. By Material Type 19.11.3. By Board Type 19.12. China Electronic Board Level Underfill Material Market Analysis 19.12.1. By Product Type 19.12.2. By Material Type 19.12.3. By Board Type 19.13. Japan Electronic Board Level Underfill Material Market Analysis 19.13.1. By Product Type 19.13.2. By Material Type 19.13.3. By Board Type 19.14. South Korea Electronic Board Level Underfill Material Market Analysis 19.14.1. By Product Type 19.14.2. By Material Type 19.14.3. By Board Type 19.15. India Electronic Board Level Underfill Material Market Analysis 19.15.1. By Product Type 19.15.2. By Material Type 19.15.3. By Board Type 19.16. ASEAN Electronic Board Level Underfill Material Market Analysis 19.16.1. By Product Type 19.16.2. By Material Type 19.16.3. By Board Type 19.17. Australia and New Zealand Electronic Board Level Underfill Material Market Analysis 19.17.1. By Product Type 19.17.2. By Material Type 19.17.3. By Board Type 19.18. GCC Countries Electronic Board Level Underfill Material Market Analysis 19.18.1. By Product Type 19.18.2. By Material Type 19.18.3. By Board Type 19.19. Turkey Electronic Board Level Underfill Material Market Analysis 19.19.1. By Product Type 19.19.2. By Material Type 19.19.3. By Board Type 20. Market Structure Analysis 20.1. Market Analysis by Tier of Companies (Electronic Board Level Underfill Material Market) 20.2. Market Concentration 20.3. Market Share Analysis of Top Players 20.4. Market Presence Analysis 20.4.1. By Regional footprint of Players 20.4.2. Product foot print by Players 20.4.3. Channel Foot Print by Players 21. Competition Analysis 21.1. Competition Dashboard 21.2. Competition Benchmarking 21.3. Competition Deep Dive 21.3.1. Henkel AG & Co. KGaA 21.3.1.1. Overview 21.3.1.2. Product Portfolio 21.3.1.3. Key Financials 21.3.1.4. Sales Footprint 21.3.1.5. Strategy Overview 21.3.1.5.1. Marketing Strategy 21.3.1.5.2. Product Strategy 21.3.1.5.3. Overall Strategy 21.3.2. Namics Corporation 21.3.2.1. Overview 21.3.2.2. Product Portfolio 21.3.2.3. Key Financials 21.3.2.4. Sales Footprint 21.3.2.5. Strategy Overview 21.3.2.5.1. Marketing Strategy 21.3.2.5.2. Product Strategy 21.3.2.5.3. Overall Strategy 21.3.3. ASE Group 21.3.3.1. Overview 21.3.3.2. Product Portfolio 21.3.3.3. Key Financials 21.3.3.4. Sales Footprint 21.3.3.5. Strategy Overview 21.3.3.5.1. Marketing Strategy 21.3.3.5.2. Product Strategy 21.3.3.5.3. Overall Strategy 21.3.4. MacDermid Alpha Electronic Solutions 21.3.4.1. Overview 21.3.4.2. Product Portfolio 21.3.4.3. Key Financials 21.3.4.4. Sales Footprint 21.3.4.5. Strategy Overview 21.3.4.5.1. Marketing Strategy 21.3.4.5.2. Product Strategy 21.3.4.5.3. Overall Strategy 21.3.5. Parker LORD Corporation 21.3.5.1. Overview 21.3.5.2. Product Portfolio 21.3.5.3. Key Financials 21.3.5.4. Sales Footprint 21.3.5.5. Strategy Overview 21.3.5.5.1. Marketing Strategy 21.3.5.5.2. Product Strategy 21.3.5.5.3. Overall Strategy 21.3.6. H.B. Fuller Company 21.3.6.1. Overview 21.3.6.2. Product Portfolio 21.3.6.3. Key Financials 21.3.6.4. Sales Footprint 21.3.6.5. Strategy Overview 21.3.6.5.1. Marketing Strategy 21.3.6.5.2. Product Strategy 21.3.6.5.3. Overall Strategy 21.3.7. Dow Inc. 21.3.7.1. Overview 21.3.7.2. Product Portfolio 21.3.7.3. Key Financials 21.3.7.4. Sales Footprint 21.3.7.5. Strategy Overview 21.3.7.5.1. Marketing Strategy 21.3.7.5.2. Product Strategy 21.3.7.5.3. Overall Strategy 21.3.8. ELANTAS GmbH 21.3.8.1. Overview 21.3.8.2. Product Portfolio 21.3.8.3. Key Financials 21.3.8.4. Sales Footprint 21.3.8.5. Strategy Overview 21.3.8.5.1. Marketing Strategy 21.3.8.5.2. Product Strategy 21.3.8.5.3. Overall Strategy 21.3.9. Zymet 21.3.9.1. Overview 21.3.9.2. Product Portfolio 21.3.9.3. Key Financials 21.3.9.4. Sales Footprint 21.3.9.5. Strategy Overview 21.3.9.5.1. Marketing Strategy 21.3.9.5.2. Product Strategy 21.3.9.5.3. Overall Strategy 21.3.10. Hitachi Chemical Co., Ltd. 21.3.10.1. Overview 21.3.10.2. Product Portfolio 21.3.10.3. Key Financials 21.3.10.4. Sales Footprint 21.3.10.5. Strategy Overview 21.3.10.5.1. Marketing Strategy 21.3.10.5.2. Product Strategy 21.3.10.5.3. Overall Strategy 21.3.11. Panasonic Corporation 21.3.11.1. Overview 21.3.11.2. Product Portfolio 21.3.11.3. Key Financials 21.3.11.4. Sales Footprint 21.3.11.5. Strategy Overview 21.3.11.5.1. Marketing Strategy 21.3.11.5.2. Product Strategy 21.3.11.5.3. Overall Strategy 21.3.12. AI Technology, Inc 21.3.12.1. Overview 21.3.12.2. Product Portfolio 21.3.12.3. Key Financials 21.3.12.4. Sales Footprint 21.3.12.5. Strategy Overview 21.3.12.5.1. Marketing Strategy 21.3.12.5.2. Product Strategy 21.3.12.5.3. Overall Strategy 21.3.13. Indium Corporation 21.3.13.1. Overview 21.3.13.2. Product Portfolio 21.3.13.3. Key Financials 21.3.13.4. Sales Footprint 21.3.13.5. Strategy Overview 21.3.13.5.1. Marketing Strategy 21.3.13.5.2. Product Strategy 21.3.13.5.3. Overall Strategy 21.3.14. Sanyu Rec Co., Ltd. 21.3.14.1. Overview 21.3.14.2. Product Portfolio 21.3.14.3. Key Financials 21.3.14.4. Sales Footprint 21.3.14.5. Strategy Overview 21.3.14.5.1. Marketing Strategy 21.3.14.5.2. Product Strategy 21.3.14.5.3. Overall Strategy 21.3.15. Dymax Corporation 21.3.15.1. Overview 21.3.15.2. Product Portfolio 21.3.15.3. Key Financials 21.3.15.4. Sales Footprint 21.3.15.5. Strategy Overview 21.3.15.5.1. Marketing Strategy 21.3.15.5.2. Product Strategy 21.3.15.5.3. Overall Strategy 21.3.16. Epoxy Technology, Inc. 21.3.16.1. Overview 21.3.16.2. Product Portfolio 21.3.16.3. Key Financials 21.3.16.4. Sales Footprint 21.3.16.5. Strategy Overview 21.3.16.5.1. Marketing Strategy 21.3.16.5.2. Product Strategy 21.3.16.5.3. Overall Strategy 21.3.17. Protavic International 21.3.17.1. Overview 21.3.17.2. Product Portfolio 21.3.17.3. Key Financials 21.3.17.4. Sales Footprint 21.3.17.5. Strategy Overview 21.3.17.5.1. Marketing Strategy 21.3.17.5.2. Product Strategy 21.3.17.5.3. Overall Strategy 21.3.18. YINCAE Advanced Materials, LLC 21.3.18.1. Overview 21.3.18.2. Product Portfolio 21.3.18.3. Key Financials 21.3.18.4. Sales Footprint 21.3.18.5. Strategy Overview 21.3.18.5.1. Marketing Strategy 21.3.18.5.2. Product Strategy 21.3.18.5.3. Overall Strategy 22. Primary Survey Analysis 23. Assumptions and Acronyms Used 24. Research Methodology
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List of Tables
Table 01: Global Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032 Table 02: Global Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032 Table 03: Global Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032 Table 04: Global Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Region, 2015–2032 Table 05: Global Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Country, 2015–2032 Table 06: North America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032 Table 07: North America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032 Table 08: North America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032 Table 09: Latin America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Country, 2015–2032 Table 10: Latin America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032 Table 11: Latin America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032 Table 12: Latin America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032 Table 13: Europe Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Country, 2015–2032 Table 14: Europe Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032 Table 15: Europe Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032 Table 16: Europe Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032 Table 17: Europe Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Country, 2015–2032 Table 18: East Asia Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032 Table 19: East Asia Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032 Table 20: East Asia Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032 Table 21: Global Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Country, 2015–2032 Table 22: South Asia Pacific Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032 Table 23: South Asia Pacific Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032 Table 24: South Asia Pacific Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032 Table 25: MEA Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Country, 2015–2032 Table 26: MEA Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032 Table 27: MEA Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032 Table 27: MEA Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032
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Figure 01: Global Electronic Board Level Underfill Material Market Historical Volume (Tons), 2015 – 2021 Figure 02: Global Electronic Board Level Underfill Material Market Volume (Tons) Forecast, 2022 – 2032 Figure 03: Global Electronic Board Level Underfill Material Market Value (US$ Mn) Historical Data 2015–2021 Figure 04: Global Electronic Board Level Underfill Material Market Value (US$ Mn) Forecast 2022–2032 Figure 05: Global Electronic Board Level Underfill Material Market Absolute $ Opportunity Analysis, 2015–2032 Figure 06: Global Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032 Figure 07: Global Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032 Figure 08: Global Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032 Figure 09: Global Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032 Figure 10: Global Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032 Figure 11: Global Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032 Figure 12: Global Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032 Figure 13: Global Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032 Figure 14: Global Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032 Figure 15: Global Electronic Board Level Underfill Material Market Share and BPS Analysis by Region– 2022 & 2032 Figure 16: Global Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Region, 2021-2032 Figure 17: Global Electronic Board Level Underfill Material Market Attractiveness by Region, 2022-2032 Figure 18: North America Electronic Board Level Underfill Material Market Share and BPS Analysis by Country– 2022 & 2032 Figure 19: North America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Country, 2021-2032 Figure 20: North America Electronic Board Level Underfill Material Market Attractiveness by Country, 2022-2032 Figure 32: North America Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032 Figure 22: North America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032 Figure 23: North America Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032 Figure 24: North America Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032 Figure 25: North America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032 Figure 26: North America Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032 Figure 27: North America Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032 Figure 28: North America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032 Figure 29: North America Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032 Figure 30: Latin America Electronic Board Level Underfill Material Market Share and BPS Analysis by Country– 2022 & 2032 Figure 31: Latin America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Country, 2021-2032 Figure 32: Latin America Electronic Board Level Underfill Material Market Attractiveness by Country, 2022-2032 Figure 33: Latin America Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032 Figure 34: Latin America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032 Figure 35: Latin America Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032 Figure 36: Latin America Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032 Figure 37: Latin America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032 Figure 38: Latin America Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032 Figure 39: Latin America Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032 Figure 40: Latin America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032 Figure 41: Latin America Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032 Figure 42: Europe Electronic Board Level Underfill Material Market Share and BPS Analysis by Country– 2022 & 2032 Figure 43: Europe Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Country, 2021-2032 Figure 44: Europe Electronic Board Level Underfill Material Market Attractiveness by Country, 2022-2032 Figure 45: Europe Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032 Figure 46: Europe Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032 Figure 47: Europe Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032 Figure 48: Europe Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032 Figure 49: Europe Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032 Figure 50: Europe Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032 Figure 51: Europe Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032 Figure 52: Europe Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032 Figure 53: Europe Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032 Figure 54: East Asia Electronic Board Level Underfill Material Market Share and BPS Analysis by Country– 2022 & 2032 Figure 55: East Asia Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Country, 2021-2032 Figure 56: East Asia Electronic Board Level Underfill Material Market Attractiveness by Country, 2022-2032 Figure 57: East Asia Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032 Figure 58: East Asia Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032 Figure 59: East Asia Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032 Figure 60: East Asia Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032 Figure 61: East Asia Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032 Figure 62: East Asia Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032 Figure 63: East Asia Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032 Figure 64: East Asia Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032 Figure 65: East Asia Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032 Figure 66: South Asia Pacific Electronic Board Level Underfill Material Market Share and BPS Analysis by Country– 2022 & 2032 Figure 67: South Asia Pacific Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Country, 2021-2032 Figure 68: South Asia Pacific Electronic Board Level Underfill Material Market Attractiveness by Country, 2022-2032 Figure 69: South Asia Pacific Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032 Figure 70: South Asia Pacific Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032 Figure 71: South Asia Pacific Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032 Figure 72: South Asia Pacific Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032 Figure 73: South Asia Pacific Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032 Figure 74: South Asia Pacific Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032 Figure 75: South Asia Pacific Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032 Figure 76: South Asia Pacific Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032 Figure 77: South Asia Pacific Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032 Figure 78: MEA Electronic Board Level Underfill Material Market Share and BPS Analysis by Country– 2022 & 2032 Figure 79: MEA Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Country, 2021-2032 Figure 80: MEA Electronic Board Level Underfill Material Market Attractiveness by Country, 2022-2032 Figure 81: MEA Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032 Figure 82: MEA Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032 Figure 83: MEA Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032 Figure 84: MEA Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032 Figure 85: MEA Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032 Figure 86: MEA Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032 Figure 87: MEA Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032 Figure 88: MEA Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032 Figure 89: MEA Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032
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