Electronic Circuit Board Level Underfill Material Market

Electronic Circuit Board Level Underfill Material Market: Glob Top Encapsulations Product Type Segment to Hold Significant Value Share in the Coming Years: Global Industry Analysis (2012 - 2016) and Opportunity Assessment (2017 - 2027)

Owing to increasing number and use of electronics products, the demand for board level underfill material is expected to increase in the coming years

The development of underfill technology is driven by the advances of the flip-chip technology and are generally epoxies that are loaded with a filler such as silica. Underfill materials offer stress relieving to solder joints, extend thermal aging and lifetime of device. Underfill technology is used to distribute and redistribute the thermo-mechanical stress created by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate. These underfill are made from different materials such as epoxy, silica, alumina, urethane and many others.

Future Market Insights has covered a detailed analysis on the electronic circuit board level underfill material market. This analysis includes segment wise intelligence, regional intelligence, competitive intelligence as well as weightage on trends, opportunities, drivers and restraints that have influence on the growth of the global market for electronic circuit board level underfill material. According to the acumen gleaned by Future Market Insights, the global electronic circuit board level underfill material is anticipated to grow at a high rate during the assessment period. During the 2012-2016 timeline, the global electronic circuit board level underfill material market reflected a comparatively slow growth rate, but it is projected to grow at a CAGR of 5.7% throughout the 2017-2027 timeline. In 2017, it is valued at around US$ 255 Mn and is estimated to reach a value of more than US$ 440 Mn by the end of the year of assessment. The main aspects contributing to the growth of the global electronic circuit board level underfill material market include increasing demand for smartphones, growth in consumer electronics sector, growing investments in electronics sector and increasing focus on electronics miniaturization.

Underfill segment to maintain status quo throughout the period of assessment

The underfill segment in the product type category is anticipated to grow at a significant pace in the coming years. This segment reflected a higher market share since past years and dominated the global market during the 2012-2016 timeline. It is likely to continue with this trend in the coming years and maintain its status quo. In 2017, this segment reflected a value of around US$ 147 Mn thus leading the global market. By the end of the year of assessment, this segment is poised to slate a value of more than US$ 260 Mn. The underfill segment is projected to grow at a high value CAGR throughout the forecast period as it is a preferred technology and has a high demand in the flip chips board type. This is the most lucrative segment from both revenue share ad growth perspectives.

electronic circuit board level underfill material market

Edge bonds to significantly contribute to the growth of the underfill segment

Underfill segment is further categorized into edge bonds and capillary fills sub segments. Of these, the edge bonds sub segment is expected to largely contribute to the market share of the parent segment. This sub segment is estimated to reach valuation of about US$ 165 Mn growing at a high value CAGR of 6.9% during the forecast period. Edge bonds technology is expected to be growing at this high CAGR owing to their low cost, fast processing and better rework ability. Edge/Corner bonding improves the mechanical reliability performance of the board. The capillary fills sub segment is projected to grow at a relatively slow value CAGR of 4.4% during the said period.

With a view to get a clear market picture of electronic circuit board level underfill material market, Future Market Insights has presented key acumen in a systematic format in its new research report titled “Electronic Circuit Board Level Underfill Material Market: Global Industry Analysis (2012-2016) and Opportunity Assessment (2017-2027)”. It uncovers each and every aspect of the market, with the help of a robust research platform. It unmasks numerous acumen on the macroeconomic factors, SWOT analysis, regulatory aspects, and other angles which govern the dynamics of the market influencing its growth. These traits help in devising an accurate marketing strategy or entry tactic or even expansion, simultaneously dealing with the unforeseen events present within the market scenario.

A unique research methodology to garner relevant market intelligence

At Future Market Insights, an exclusive research methodology is applied to garner necessary market intelligence. Secondary research, primary research and key opinions from subject matter experts, market observers and other external sources is carried out. The initial secondary research is initiated that is extensive in nature and covers all the angles of the electronic circuit board level underfill material market following which a primary research is initiated with which further deep diving is possible. Simultaneously, market observers and domain experts that have a completely unbiased knowledge about the market, are interviewed to gain vitals of the market pertaining to the market scenario across each market segment in different regions across the globe. Each key aspect or statistic or number is cross checked, re-verified, evaluated, analysed and validated over the course of the entire research. As every conversation gives a more or less different view, the statistics and data undergo a triangulation process to arrive at a certain number. This data point reflects maximum accuracy which fuels the credibility of the information that the report contains.

Market Segmentation

By Material

By Product Type

By Board Type

By Region

  • Quartz/Silicone

  • Alumina Based

  • Epoxy Based

  • Urethane Based

  • Acrylic Based

  • Others

  • Underfill

    • Capillary fills

    •  Edge Bonds

  • Gob Top Encapsulations

  • CSP (Chip Scale Package

  • BGA (Ball Grid array)

  • Flip Chips

  • North America

  •  Latin America

  • Western Europe

  • Eastern Europe

  • Asia Pacific excluding Japan (APEJ)

  • Japan

  • Middle East and Africa (MEA)

Competitive Assessment   

The research report on global electronic circuit board level underfill material market includes a separate chapter covering competitive analysis that includes several key players involved in the operations associated with electronic circuit board level underfill material            . Key information on these players such as their geographical spread, current scenario, their new strategies, their expansion plans, new developments in their products as well as innovation to enhance their product portfolio, marketing strategies, mergers and acquisitions as an expansion strategy, revenue, market share, company strength, strategic alliances, etc., has been covered in this chapter. This can give the reader a broad idea of the events occurring in the market, initiated by these players with the support of which new plans or tactics can be developed and implemented with a view to gain an edge over the competitive.

To sum up the characteristic features of the global electronic circuit board level underfill material market research report, it delivers an unbiased view of the global market along with key insights, along with a global perspective covering major regions. It includes an in-depth market segmentation, and provides actionable intelligence that can be used runtime, covers a detailed competitive scenario and puts forth a genuine and precise picture of the global market to support the reader in making informed decisions and gaining advantage in the long run.