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Electronic Board Level Underfill Material Market

Find Out How Rapid Growth Of Electronics Industry Is Influencing Sales of Electronic Board Level Underfill Materials!

Electronic Board Level Underfill Material Market by Product Type, Material Type, Board Type & Region - Forecast 2022 - 2032

Electronic Board Level Underfill Material Market Outlook (2022-2032)

[200 Pages Report] The global electronic board level underfill material market size reached US$ 295.9 Mn in 2021 and is expected to touch a valuation of US$ 310.7 Mn in 2022. Furthermore, with rise in production and usage of electronic products, the overall sales of electronic board level underfill materials are projected to grow at 5.3% CAGR between 2022 and 2032, surpassing a valuation of US$ 520.7 Mn by the end of 2032.

Attribute

Key Statistics

Electronic Board Level Underfill Material Market Base Value (2021A)

US$ 295.9 Mn

Estimated Market Size (2022E)

US$ 310.7 Mn

Projected Market Size (2032F)

US$ 520.7 Mn

Value-based CAGR (2022-2032)

5.3%

Collective Value Share: Top 3 Countries (2022E)

31.1%

Underfill is typically utilized to spread and redistribute the thermo-mechanical stress caused by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate in order to improve the reliability of a CSP, BGA, or flip chip on an organic board package. These underfills are manufactured from a variety of substances, including epoxy, silica, alumina, silica gel, urethane, and many others.

Electronic board level underfill materials provide mechanical reinforcement to the solder joints and solder balls that connect a chip to a printed circuit board. Thus, they play a key role in extending thermal aging and lifetime of electronic devices.

Rising usage of consumer electronic products such as smartphones, tablets, cameras, laptops, etc. across the world is proving a major impetus to the growth of electronic board level underfill material market and the trend is likely to continue during the forecast period.

Over, the years, rapid penetration of digitalization and fast internet has result in the rapid growth of smartphone industry. People are choosing smartphones over other electronic devices like PC’s and laptops due to their mobility, usability, and affordable price. This surge in the adoption of smartphones along with the continous introduction of new generation smartphones at affordable prices is expected to act as a catalyst triggering growth in the electronic board level underfill material market.

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2015-2021 Electronic Board Level Underfill Material Market Outlook Compared to 2022-2032 Forecast

The global electronic board level underfill material market is set to expand at 5.3% CAGR between 2022 and 2032, in comparison to 3.1% CAGR registered during the historical period of 2015 and 2021. Growing usage of electronic devices and ongoing trend of miniaturization and development of multi-feature electronic devices are some of the key factors expected to boost growth in the global electronic board level underfill material market during the forecast period.

Growing propensity towards miniaturization of electronic devices is consistently increasing number of components on printed circuit boards (PCBs) which is propelling the demand graph of smaller, thinner, and highly integrated printed circuit boards (PCBs) incorporated with flip chip and other advanced technologies. This will continue to generate lucrative growth opportunities for electronic board level underfill material market during the assessment period.

Similarly, booming electronic industry across the world, rapid penetration of digitalization, and rsie in the export of electronic products will boost the demand for electronic board level underfill materials over the next ten years.

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What are the Key Trends Driving the Electronic Board Level Underfill Material Market?

Rising Investments in Electronics Production to Push Sales of Electronic Board Level Underfill Materials in the Market”

The electronic industry is one of the most dynamic sectors of the economy and its meteoric rise has prompted major shifts in funding. The integration of manufacturing networks in the electronics sector have been very beneficial to the ASEAN region, as they have allowed for better commerce with bigger Asian economies like China.

China, however, is crucial not as a rival but as a developing market for the Asian electronic sector. China acquires raw materials and components from other Asian nations and then ships them all over the globe.

For instance, in January 2016, China’s Ministry of Industry and Information Technology, in partnership with an industry group and Ping and Bank, set up a US $30 billion fund for the electronic industry in China. This fund helps in addressing the issues faced by small and medium-sized electronic manufacturers, which have folded recently. This fund has also expanded the country’s technology capabilities and supports the country’s significant electronics supply chain.

Thus, rapid surge in the production of electronics will continue to foster growth of the global electronic board level underfill material market during the forecast period.

“Increasing Prominence of Miniaturization of Electronic Components to Supplement Market Growth'

Miniaturization of electronic devices has led to an increase in the number of components on a printed circuit board. This growing trend has enhanced the demand for smaller, thinner and more highly integrated printed circuit boards (PCBs) that are populated with flip chip technology. This nanotechnology and micro electromechanical systems (MEMS) are growing in functionality as well as acceptance in a majority of applications among various industries, such as consumer electronics and others. The current pace of miniaturization of electronic devices will result in a surge in demand for PCBs in near future.

Miniaturization of electronic devices, such as laptops, smartphones, consumer electronics and many more, has led to increased usage of underfills materials in encapsulation and cavity filling type applications, thereby creating growth prospects for the global electronic board level underfill material market.

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Nikhil Kaitwade
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Country-wise Insights

Why is the Demand for Electronic Board Level Underfill Materials Rising at a Robust Pace in the U.S.?

“Rapid Production and Usage of Electronic Products Fueling Sales in the U.S.”

As per FMI, the U.S. is projected to account for a significant share approximately of more than 19.4% in the global electronic board level underfill material market in 2022. Rapid growth in demand for electronic devices across the country is expected to propel the country’s consumption over the forecast period.

The U.S. is one of the largest consumers of electronic board level underfill materials across the globe. High disposable income and per capita expenditure of Americans is creating a huge demand for electronic devices such as home automation devices, smartphones, laptops, tablets, and various other. This in turn will continue to propel sales of electronic board level underfill materials during the forecast period.

Similarly, rise in the transport of electronic products will create growth opportunities for leading manufacturers across the U.S. during the assessment period.

Why is China Emerging as a Lucrative Market for Electronic Board Level Underfill Materials?

“Availability of Electronic Board Level Underfill Materials at Lower Prices Igniting Growth in China Market”

With rapid expansion of electronic industry and presence of product types at cheaper costs, the electronic board level underfill material market in China is poised to grow at a healthy pace of around 6.2% CAGR during the forecast period.

Most of the manufacturing companies based in China are focusing to enhance their market share and presence through offering innovative products in a short time cycle, at low cost, with improved product quality as well as higher performance.

Category-wise Insights

Which Product Type is High in Demand in the Global Electronic Board Level Underfill Material Market?

“Demand to Remain High for Underfills in the Market”

As per FMI, the underfills segment is expected to dominate the global electronic board level underfill material market during the forecast period, owing to the rising usage of underfills in a wide range of electronic products.

In recent years, demand for miniaturized electronic devices has been increasing. With the growing demand for miniature circuit geometries, underfill materials are becoming popular, which is slated to increase demand over the forecast period

Emerging trends reveal that the underfills segment will gain 140 BPS during the forecast period of 2022-2032

Which is The Most Preferred Material Type For Electronic Board Level Underfills?

“End Users Prefer Epoxy Based Electronic Board Level Underfills”

Among material types, epoxy based material is vastly used as a board level underfill material owing to its properties, such as high CTE (Coefficient of Thermal Expansion), which makes its very efficient to be used as an underfill material.

The epoxy based material segment is estimated to hold the highest value share in 2022 and is expected to gain 380 BPS over the forecast period.

However, Quartz/Silicone and Alumina based underfill material segment is also estimated to be growing at significant CAGR owing to their application in all board types.

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Competitive Landscape

Manufacturers of Electronic Board Level Underfill Material are positively engaged in expansion of their geographic and market presence in order to cater the rising demand for the product. They are engaged in expansion of production facilities and acquisitions/mergers of regional small, and medium level players to achieve domination in the market. For Instance,

  • In May 2020, Parker Lord Corporation signed a strategic partnership with Brightwater United Aero Group for enhancing customer support throughout the world.
  • In October 2019, Parker Hannifin, a global leader of motion and control technologies completed acquisition of LORD corporation for 3.8 billion dollars to start its engineering materials division.
  • In December 2019, Henkel completed acquisitions of Deva Holdings Inc., a U.S based company to strengthen its distribution network in the U.S.

Scope of Report

Attribute

Details

Estimated Market Size (2022)

US$ 310.7 Mn

Projected Market Size (2032)

US$ 520.7 Mn

Anticipated Market Size (2022-20320

5.3%

Forecast Period

2022-2032

Historical Data Available for

2015-2021

Market Analysis

US$ Million for Value and Tons for Volume

Key Regions Covered

North America, Latin America, Europe, East Asia, South Asia Pacific, MEA.

Key Countries Covered

U.S., Canada, Brazil, Mexico, Germany, Italy, France, U.K., Spain, BENELUX, Russia, China, Japan South Korea, India, ASEAN, ANZ, GCC Countries, Turkey, South Africa and Northern Africa

Key Segments Covered

Product Type, Material Type, Board Type, and Region

Key Companies Profiled

  • Henkel AG & Co. KGaA
  • Namics Corporation
  • ASE Group
  • MacDermid Alpha Electronic Solutions
  • Parker LORD Corporation
  • H.B. Fuller Company
  • Dow Inc.
  • ELANTAS GmbH
  • Zymet
  • Hitachi Chemical Co., Ltd.
  • Panasonic Corporation
  • AI Technology, Inc
  • Indium Corporation
  • Sanyu Rec Co., Ltd.
  • Dymax Corporation
  • Epoxy Technology, Inc.
  • Protavic International
  • YINCAE Advanced Materials, LLC

Report Coverage

Market Forecast, Company Share Analysis, Competition Intelligence, DROT Analysis, Market Dynamics and Challenges, and Strategic Growth Initiatives

Electronic Board Level Underfill Material Market by Category

By Product Type:

  • Underfills
    • Capillary
    • Edge Bonds
  • Gob Top Encapsulations

By Material Type:

  • Quartz / Silicone
  • Alumina Based
  • Epoxy Based
  • Urethane Based
  • Acrylic Based
  • Others

By Board Type:

  • CSP (Chip Scale Package)
  • BGA (Ball Grid array)
  • Flip Chips

By Region:

  • North America
  • Latin America
  • Europe
  • East Asia
  • South Asia Pacific
  • MEA

Frequently Asked Questions

The global electronic board level underfill material market size is expected to total US$ 310.7 Mn in 2022.

As per FMI, the global electronic board level underfill material market is estimated to exhibit a growth rate of 5.3% CAGR between 2022 and 2032 on value basis.

The overall electronic board level underfill material market is projecetd to reach a valuation of US$ 520.7 Mn by 2032.

Underfills segment is expected to lead the global electronic board level underfill material market in 2022 and beyond.

Henkel AG & Co. KGaA, Namics Corporation, ASE Group ,MacDermid Alpha Electronic Solutions, Parker LORD Corporation, H.B. Fuller Company, Dow Inc., ELANTAS GmbH, Zymet, Hitachi Chemical Co., Ltd., Panasonic Corporation, AI Technology, Inc, Indium Corporation, Sanyu Rec Co., Ltd., Dymax Corporation, Epoxy Technology, Inc., Protavic International, YINCAE Advanced Materials, LLC and others are the leading market players in the electronic board level underfill material market, collectively accountin

Demand for electronic board underfill materials in China is expected to increase by 6.2% CAGR between 2022 and 2032 on value basis.

Table of Content

1. Executive Summary

    1.1. Global Market Outlook

    1.2. Demand Side Trends

    1.3. Supply Side Trends

    1.4. Analysis and Recommendations

2. Market Overview

    2.1. Market Coverage / Taxonomy

    2.2. Market Definition / Scope / Limitations

3. Key Market Trends

    3.1. Key Trends Impacting the Market

    3.2. Product Innovation / Development Trends

4. Key Success Factors

    4.1. Product Adoption / Usage Analysis

    4.2. Product USPs / Features

    4.3. Strategic Promotional Strategies

5. Global Electronic Board Level Underfill Material Market Demand Analysis 2015-2021 and Forecast, 2022-2032

    5.1. Historical Market Volume (Tons) Analysis, 2015-2021

    5.2. Current and Future Market Volume (Tons) Projections, 2022-2032

    5.3. Y-o-Y Growth Trend Analysis

6. Global Electronic Board Level Underfill Material Market - Pricing Analysis

    6.1. Regional Pricing Analysis by Product Type

    6.2. Pricing Break-up

        6.2.1. Manufacturer Level Pricing

        6.2.2. Distributor Level Pricing

    6.3. Global Average Pricing Analysis Benchmark

7. Global Electronic Board Level Underfill Material Market Demand (in Value or Size in US$ Mn) Analysis 2015-2021 and Forecast, 2022-2032

    7.1. Historical Market Value (US$ Mn) Analysis, 2015-2021

    7.2. Current and Future Market Value (US$ Mn) Projections, 2022-2032

        7.2.1. Y-o-Y Growth Trend Analysis

        7.2.2. Absolute $ Opportunity Analysis

8. Market Background

    8.1. Macro-Economic Factors

    8.2. Forecast Factors - Relevance & Impact

    8.3. Value Chain

        8.3.1. List of Raw Material Suppliers

        8.3.2. List of Manufacturers

        8.3.3. List of End-users/potential buyers

    8.4. COVID-19 Impact

    8.5. Market Dynamics

        8.5.1. Drivers

        8.5.2. Restraints

        8.5.3. Opportunity Analysis

    8.6. Production Process Overview

    8.7. Key Regulations Overview

9. Global Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032, by Product Type

    9.1. Introduction / Key Findings

    9.2. Historical Market Size (US$ Mn) and Volume Analysis by Product Type, 2015–2021

    9.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast by Product Type, 2022–2032

        9.3.1. Underfills

            9.3.1.1. Capillary

            9.3.1.2. Edge Bonds

        9.3.2. Gob Top Encapsulations

    9.4. Market Attractiveness Analysis by Product Type

10. Global Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032, by Material Type

    10.1. Introduction / Key Findings

    10.2. Historical Market Size (US$ Mn) and Volume Analysis by Material Type, 2015–2021

    10.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast by Material Type, 2022–2032

        10.3.1. Quartz/Silicone

        10.3.2. Alumina Based

        10.3.3. Epoxy Based

        10.3.4. Urethane Based

        10.3.5. Acrylic Based

        10.3.6. Others

    10.4. Market Attractiveness Analysis by Material Type

11. Global Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032, by Board Type

    11.1. Introduction / Key Findings

    11.2. Historical Market Size (US$ Mn) and Volume Analysis by Board Type, 2015–2021

    11.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast by Board Type, 2022–2032

        11.3.1. CSP (Chip Scale Package)

        11.3.2. BGA (Ball Grid array)

        11.3.3. Flip Chips

    11.4. Market Attractiveness Analysis by Board Type

12. Global Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032, by Region

    12.1. Introduction

    12.2. Historical Market Size (US$ Mn) and Volume Analysis by Region, 2015–2021

    12.3. Current Market Size (US$ Mn) and Volume Analysis and Forecast by Region, 2022–2032

        12.3.1. North America

        12.3.2. Latin America

        12.3.3. Europe

        12.3.4. East Asia

        12.3.5. South Asia Pacific

        12.3.6. Middle East & Africa

    12.4. Market Attractiveness Analysis by Region

13. North America Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032

    13.1. Introduction

    13.2. Pricing Analysis

    13.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2015–2021

    13.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2022–2032

        13.4.1. By Country

            13.4.1.1. U.S.

            13.4.1.2. Canada

        13.4.2. By Product Type

        13.4.3. By Material Type

        13.4.4. By Board Type

    13.5. Market Attractiveness Analysis

        13.5.1. By Country

        13.5.2. By Product Type

        13.5.3. By Material Type

        13.5.4. By Board Type

    13.6. Drivers and Restraints - Impact Analysis

14. Latin America Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032

    14.1. Introduction

    14.2. Pricing Analysis

    14.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2015–2021

    14.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2022–2032

        14.4.1. By Country

            14.4.1.1. Brazil

            14.4.1.2. Mexico

            14.4.1.3. Rest of Latin America

        14.4.2. By Product Type

        14.4.3. By Material Type

        14.4.4. By Board Type

    14.5. Market Attractiveness Analysis

        14.5.1. By Country

        14.5.2. By Product Type

        14.5.3. By Material Type

        14.5.4. By Board Type

    14.6. Drivers and Restraints - Impact Analysis

15. Europe Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032

    15.1. Introduction

    15.2. Pricing Analysis

    15.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2015–2021

    15.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2022–2032

        15.4.1. By Country

            15.4.1.1. Germany

            15.4.1.2. Italy

            15.4.1.3. France

            15.4.1.4. U.K.

            15.4.1.5. Spain

            15.4.1.6. BENELUX

            15.4.1.7. Russia

            15.4.1.8. Rest of Europe

        15.4.2. By Product Type

        15.4.3. By Material Type

        15.4.4. By Board Type

    15.5. Market Attractiveness Analysis

        15.5.1. By Country

        15.5.2. By Product Type

        15.5.3. By Material Type

        15.5.4. By Board Type

    15.6. Drivers and Restraints - Impact Analysis

16. South Asia & Pacific Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032

    16.1. Introduction

    16.2. Pricing Analysis

    16.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2015–2021

    16.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2022–2032

        16.4.1. By Country

            16.4.1.1. India

            16.4.1.2. ASEAN

            16.4.1.3. Rest of SAP

        16.4.2. By Product Type

        16.4.3. By Material Type

        16.4.4. By Board Type

    16.5. Market Attractiveness Analysis

        16.5.1. By Country

        16.5.2. By Product Type

        16.5.3. By Material Type

        16.5.4. By Board Type

    16.6. Drivers and Restraints - Impact Analysis

17. East Asia Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032

    17.1. Introduction

    17.2. Pricing Analysis

    17.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2015–2021

    17.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2022–2032

        17.4.1. By Country

            17.4.1.1. China

            17.4.1.2. Japan

            17.4.1.3. South Korea

        17.4.2. By Product Type

        17.4.3. By Material Type

        17.4.4. By Board Type

    17.5. Market Attractiveness Analysis

        17.5.1. By Country

        17.5.2. By Product Type

        17.5.3. By Material Type

        17.5.4. By Board Type

    17.6. Drivers and Restraints - Impact Analysis

18. Middle East and Africa Electronic Board Level Underfill Material Market Analysis 2015–2021 and Forecast 2022–2032

    18.1. Introduction

    18.2. Pricing Analysis

    18.3. Historical Market Size (US$ Mn) and Volume Trend Analysis by Market Taxonomy, 2015–2021

    18.4. Market Size (US$ Mn) and Volume Forecast by Market Taxonomy, 2022–2032

        18.4.1. By Country

            18.4.1.1. GCC Countries

            18.4.1.2. Turkey

            18.4.1.3. Northern Africa

            18.4.1.4. South Africa

            18.4.1.5. Rest of Middle East and Africa

        18.4.2. By Product Type

        18.4.3. By Material Type

        18.4.4. By Board Type

    18.5. Market Attractiveness Analysis

        18.5.1. By Country

        18.5.2. By Product Type

        18.5.3. By Material Type

        18.5.4. By Board Type

    18.6. Drivers and Restraints - Impact Analysis

19. Country-wise Electronic Board Level Underfill Material Market Analysis 

    19.1. U.S. Electronic Board Level Underfill Material Market Analysis

        19.1.1. By Product Type

        19.1.2. By Material Type

        19.1.3. By Board Type

    19.2. Canada Electronic Board Level Underfill Material Market Analysis

        19.2.1. By Product Type

        19.2.2. By Material Type

        19.2.3. By Board Type

    19.3. Mexico Electronic Board Level Underfill Material Market Analysis

        19.3.1. By Product Type

        19.3.2. By Material Type

        19.3.3. By Board Type

    19.4. Brazil Electronic Board Level Underfill Material Market Analysis

        19.4.1. By Product Type

        19.4.2. By Material Type

        19.4.3. By Board Type

    19.5. Germany Electronic Board Level Underfill Material Market Analysis

        19.5.1. By Product Type

        19.5.2. By Material Type

        19.5.3. By Board Type

    19.6. Italy Electronic Board Level Underfill Material Market Analysis

        19.6.1. By Product Type

        19.6.2. By Material Type

        19.6.3. By Board Type

    19.7. France Electronic Board Level Underfill Material Market Analysis

        19.7.1. By Product Type

        19.7.2. By Material Type

        19.7.3. By Board Type

    19.8. U.K. Electronic Board Level Underfill Material Market Analysis

        19.8.1. By Product Type

        19.8.2. By Material Type

        19.8.3. By Board Type

    19.9. Spain Electronic Board Level Underfill Material Market Analysis

        19.9.1. By Product Type

        19.9.2. By Material Type

        19.9.3. By Board Type

    19.10. BENELUX Electronic Board Level Underfill Material Market Analysis

        19.10.1. By Product Type

        19.10.2. By Material Type

        19.10.3. By Board Type

    19.11. Russia Electronic Board Level Underfill Material Market Analysis

        19.11.1. By Product Type

        19.11.2. By Material Type

        19.11.3. By Board Type

    19.12. China Electronic Board Level Underfill Material Market Analysis

        19.12.1. By Product Type

        19.12.2. By Material Type

        19.12.3. By Board Type

    19.13. Japan Electronic Board Level Underfill Material Market Analysis

        19.13.1. By Product Type

        19.13.2. By Material Type

        19.13.3. By Board Type

    19.14. South Korea Electronic Board Level Underfill Material Market Analysis

        19.14.1. By Product Type

        19.14.2. By Material Type

        19.14.3. By Board Type

    19.15. India Electronic Board Level Underfill Material Market Analysis

        19.15.1. By Product Type

        19.15.2. By Material Type

        19.15.3. By Board Type

    19.16. ASEAN Electronic Board Level Underfill Material Market Analysis

        19.16.1. By Product Type

        19.16.2. By Material Type

        19.16.3. By Board Type

    19.17. Australia and New Zealand Electronic Board Level Underfill Material Market Analysis

        19.17.1. By Product Type

        19.17.2. By Material Type

        19.17.3. By Board Type

    19.18. GCC Countries Electronic Board Level Underfill Material Market Analysis

        19.18.1. By Product Type

        19.18.2. By Material Type

        19.18.3. By Board Type

    19.19. Turkey Electronic Board Level Underfill Material Market Analysis

        19.19.1. By Product Type

        19.19.2. By Material Type

        19.19.3. By Board Type

20. Market Structure Analysis

    20.1. Market Analysis by Tier of Companies (Electronic Board Level Underfill Material Market)

    20.2. Market Concentration

    20.3. Market Share Analysis of Top Players

    20.4. Market Presence Analysis

        20.4.1. By Regional footprint of Players

        20.4.2. Product foot print by Players

        20.4.3. Channel Foot Print by Players

21. Competition Analysis

    21.1. Competition Dashboard

    21.2. Competition Benchmarking

    21.3. Competition Deep Dive

        21.3.1. Henkel AG & Co. KGaA

            21.3.1.1. Overview

            21.3.1.2. Product Portfolio

            21.3.1.3. Key Financials

            21.3.1.4. Sales Footprint

            21.3.1.5. Strategy Overview

                21.3.1.5.1. Marketing Strategy

                21.3.1.5.2. Product Strategy

                21.3.1.5.3. Overall Strategy

        21.3.2. Namics Corporation

            21.3.2.1. Overview

            21.3.2.2. Product Portfolio

            21.3.2.3. Key Financials

            21.3.2.4. Sales Footprint

            21.3.2.5. Strategy Overview

                21.3.2.5.1. Marketing Strategy

                21.3.2.5.2. Product Strategy

                21.3.2.5.3. Overall Strategy

        21.3.3. ASE Group

            21.3.3.1. Overview

            21.3.3.2. Product Portfolio

            21.3.3.3. Key Financials

            21.3.3.4. Sales Footprint

            21.3.3.5. Strategy Overview

                21.3.3.5.1. Marketing Strategy

                21.3.3.5.2. Product Strategy

                21.3.3.5.3. Overall Strategy

        21.3.4. MacDermid Alpha Electronic Solutions

            21.3.4.1. Overview

            21.3.4.2. Product Portfolio

            21.3.4.3. Key Financials

            21.3.4.4. Sales Footprint

            21.3.4.5. Strategy Overview

                21.3.4.5.1. Marketing Strategy

                21.3.4.5.2. Product Strategy

                21.3.4.5.3. Overall Strategy

        21.3.5. Parker LORD Corporation

            21.3.5.1. Overview

            21.3.5.2. Product Portfolio

            21.3.5.3. Key Financials

            21.3.5.4. Sales Footprint

            21.3.5.5. Strategy Overview

                21.3.5.5.1. Marketing Strategy

                21.3.5.5.2. Product Strategy

                21.3.5.5.3. Overall Strategy

        21.3.6. H.B. Fuller Company

            21.3.6.1. Overview

            21.3.6.2. Product Portfolio

            21.3.6.3. Key Financials

            21.3.6.4. Sales Footprint

            21.3.6.5. Strategy Overview

                21.3.6.5.1. Marketing Strategy

                21.3.6.5.2. Product Strategy

                21.3.6.5.3. Overall Strategy

        21.3.7. Dow Inc.

            21.3.7.1. Overview

            21.3.7.2. Product Portfolio

            21.3.7.3. Key Financials

            21.3.7.4. Sales Footprint

            21.3.7.5. Strategy Overview

                21.3.7.5.1. Marketing Strategy

                21.3.7.5.2. Product Strategy

                21.3.7.5.3. Overall Strategy

        21.3.8. ELANTAS GmbH

            21.3.8.1. Overview

            21.3.8.2. Product Portfolio

            21.3.8.3. Key Financials

            21.3.8.4. Sales Footprint

            21.3.8.5. Strategy Overview

                21.3.8.5.1. Marketing Strategy

                21.3.8.5.2. Product Strategy

                21.3.8.5.3. Overall Strategy

        21.3.9. Zymet

            21.3.9.1. Overview

            21.3.9.2. Product Portfolio

            21.3.9.3. Key Financials

            21.3.9.4. Sales Footprint

            21.3.9.5. Strategy Overview

                21.3.9.5.1. Marketing Strategy

                21.3.9.5.2. Product Strategy

                21.3.9.5.3. Overall Strategy

        21.3.10. Hitachi Chemical Co., Ltd.

            21.3.10.1. Overview

            21.3.10.2. Product Portfolio

            21.3.10.3. Key Financials

            21.3.10.4. Sales Footprint

            21.3.10.5. Strategy Overview

                21.3.10.5.1. Marketing Strategy

                21.3.10.5.2. Product Strategy

                21.3.10.5.3. Overall Strategy

        21.3.11. Panasonic Corporation

            21.3.11.1. Overview

            21.3.11.2. Product Portfolio

            21.3.11.3. Key Financials

            21.3.11.4. Sales Footprint

            21.3.11.5. Strategy Overview

                21.3.11.5.1. Marketing Strategy

                21.3.11.5.2. Product Strategy

                21.3.11.5.3. Overall Strategy

        21.3.12. AI Technology, Inc

            21.3.12.1. Overview

            21.3.12.2. Product Portfolio

            21.3.12.3. Key Financials

            21.3.12.4. Sales Footprint

            21.3.12.5. Strategy Overview

                21.3.12.5.1. Marketing Strategy

                21.3.12.5.2. Product Strategy

                21.3.12.5.3. Overall Strategy

        21.3.13. Indium Corporation

            21.3.13.1. Overview

            21.3.13.2. Product Portfolio

            21.3.13.3. Key Financials

            21.3.13.4. Sales Footprint

            21.3.13.5. Strategy Overview

                21.3.13.5.1. Marketing Strategy

                21.3.13.5.2. Product Strategy

                21.3.13.5.3. Overall Strategy

        21.3.14. Sanyu Rec Co., Ltd.

            21.3.14.1. Overview

            21.3.14.2. Product Portfolio

            21.3.14.3. Key Financials

            21.3.14.4. Sales Footprint

            21.3.14.5. Strategy Overview

                21.3.14.5.1. Marketing Strategy

                21.3.14.5.2. Product Strategy

                21.3.14.5.3. Overall Strategy

        21.3.15. Dymax Corporation

            21.3.15.1. Overview

            21.3.15.2. Product Portfolio

            21.3.15.3. Key Financials

            21.3.15.4. Sales Footprint

            21.3.15.5. Strategy Overview

                21.3.15.5.1. Marketing Strategy

                21.3.15.5.2. Product Strategy

                21.3.15.5.3. Overall Strategy

        21.3.16. Epoxy Technology, Inc.

            21.3.16.1. Overview

            21.3.16.2. Product Portfolio

            21.3.16.3. Key Financials

            21.3.16.4. Sales Footprint

            21.3.16.5. Strategy Overview

                21.3.16.5.1. Marketing Strategy

                21.3.16.5.2. Product Strategy

                21.3.16.5.3. Overall Strategy

        21.3.17. Protavic International

            21.3.17.1. Overview

            21.3.17.2. Product Portfolio

            21.3.17.3. Key Financials

            21.3.17.4. Sales Footprint

            21.3.17.5. Strategy Overview

                21.3.17.5.1. Marketing Strategy

                21.3.17.5.2. Product Strategy

                21.3.17.5.3. Overall Strategy

        21.3.18. YINCAE Advanced Materials, LLC

            21.3.18.1. Overview

            21.3.18.2. Product Portfolio

            21.3.18.3. Key Financials

            21.3.18.4. Sales Footprint

            21.3.18.5. Strategy Overview

                21.3.18.5.1. Marketing Strategy

                21.3.18.5.2. Product Strategy

                21.3.18.5.3. Overall Strategy

22. Primary Survey Analysis

23. Assumptions and Acronyms Used

24. Research Methodology
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List of Tables

Table 01: Global Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032

Table 02: Global Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032

Table 03: Global Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032

Table 04: Global Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Region, 2015–2032

Table 05: Global Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Country, 2015–2032

Table 06: North America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032

Table 07: North America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032

Table 08: North America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032

Table 09: Latin America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Country, 2015–2032

Table 10: Latin America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032

Table 11: Latin America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032

Table 12: Latin America Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032

Table 13: Europe Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Country, 2015–2032

Table 14: Europe Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032

Table 15: Europe Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032

Table 16: Europe Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032

Table 17: Europe Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Country, 2015–2032

Table 18: East Asia Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032

Table 19: East Asia Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032

Table 20: East Asia Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032

Table 21: Global Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Country, 2015–2032

Table 22: South Asia Pacific Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032

Table 23: South Asia Pacific Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032

Table 24: South Asia Pacific Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032

Table 25: MEA Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Country, 2015–2032

Table 26: MEA Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Product Type, 2015–2032

Table 27: MEA Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Material Type, 2015–2032

Table 27: MEA Electronic Board Level Underfill Material Market Size (US$ Mn) & Volume (Tons) Forecast by Board Type, 2015–2032
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List of Charts

Figure 01: Global Electronic Board Level Underfill Material Market Historical Volume (Tons), 2015 – 2021

Figure 02: Global Electronic Board Level Underfill Material Market Volume (Tons) Forecast, 2022 – 2032

Figure 03: Global Electronic Board Level Underfill Material Market Value (US$ Mn) Historical Data 2015–2021

Figure 04: Global Electronic Board Level Underfill Material Market Value (US$ Mn) Forecast 2022–2032

Figure 05: Global Electronic Board Level Underfill Material Market Absolute $ Opportunity Analysis, 2015–2032

Figure 06: Global Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032

Figure 07: Global Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032

Figure 08: Global Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032

Figure 09: Global Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032

Figure 10: Global Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032

Figure 11: Global Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032

Figure 12: Global Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032

Figure 13: Global Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032

Figure 14: Global Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032

Figure 15: Global Electronic Board Level Underfill Material Market Share and BPS Analysis by Region– 2022 & 2032

Figure 16: Global Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Region, 2021-2032

Figure 17: Global Electronic Board Level Underfill Material Market Attractiveness by Region, 2022-2032

Figure 18: North America Electronic Board Level Underfill Material Market Share and BPS Analysis by Country– 2022 & 2032

Figure 19: North America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Country, 2021-2032

Figure 20: North America Electronic Board Level Underfill Material Market Attractiveness by Country, 2022-2032

Figure 32: North America Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032

Figure 22: North America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032

Figure 23: North America Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032

Figure 24: North America Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032

Figure 25: North America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032

Figure 26: North America Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032

Figure 27: North America Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032

Figure 28: North America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032

Figure 29: North America Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032

Figure 30: Latin America Electronic Board Level Underfill Material Market Share and BPS Analysis by Country– 2022 & 2032

Figure 31: Latin America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Country, 2021-2032

Figure 32: Latin America Electronic Board Level Underfill Material Market Attractiveness by Country, 2022-2032

Figure 33: Latin America Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032

Figure 34: Latin America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032

Figure 35: Latin America Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032

Figure 36: Latin America Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032

Figure 37: Latin America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032

Figure 38: Latin America Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032

Figure 39: Latin America Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032

Figure 40: Latin America Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032

Figure 41: Latin America Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032

Figure 42: Europe Electronic Board Level Underfill Material Market Share and BPS Analysis by Country– 2022 & 2032

Figure 43: Europe Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Country, 2021-2032

Figure 44: Europe Electronic Board Level Underfill Material Market Attractiveness by Country, 2022-2032

Figure 45: Europe Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032

Figure 46: Europe Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032

Figure 47: Europe Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032

Figure 48: Europe Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032

Figure 49: Europe Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032

Figure 50: Europe Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032

Figure 51: Europe Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032

Figure 52: Europe Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032

Figure 53: Europe Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032

Figure 54: East Asia Electronic Board Level Underfill Material Market Share and BPS Analysis by Country– 2022 & 2032

Figure 55: East Asia Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Country, 2021-2032

Figure 56: East Asia Electronic Board Level Underfill Material Market Attractiveness by Country, 2022-2032

Figure 57: East Asia Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032

Figure 58: East Asia Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032

Figure 59: East Asia Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032

Figure 60: East Asia Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032

Figure 61: East Asia Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032

Figure 62: East Asia Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032

Figure 63: East Asia Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032

Figure 64: East Asia Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032

Figure 65: East Asia Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032

Figure 66: South Asia Pacific Electronic Board Level Underfill Material Market Share and BPS Analysis by Country– 2022 & 2032

Figure 67: South Asia Pacific Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Country, 2021-2032

Figure 68: South Asia Pacific Electronic Board Level Underfill Material Market Attractiveness by Country, 2022-2032

Figure 69: South Asia Pacific Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032

Figure 70: South Asia Pacific Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032

Figure 71: South Asia Pacific Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032

Figure 72: South Asia Pacific Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032

Figure 73: South Asia Pacific Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032

Figure 74: South Asia Pacific Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032

Figure 75: South Asia Pacific Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032

Figure 76: South Asia Pacific Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032

Figure 77: South Asia Pacific Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032

Figure 78: MEA Electronic Board Level Underfill Material Market Share and BPS Analysis by Country– 2022 & 2032

Figure 79: MEA Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Country, 2021-2032

Figure 80: MEA Electronic Board Level Underfill Material Market Attractiveness by Country, 2022-2032

Figure 81: MEA Electronic Board Level Underfill Material Market Share and BPS Analysis by Product Type– 2022 & 2032

Figure 82: MEA Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Product Type, 2021-2032

Figure 83: MEA Electronic Board Level Underfill Material Market Attractiveness by Product Type, 2022-2032

Figure 84: MEA Electronic Board Level Underfill Material Market Share and BPS Analysis by Material Type– 2022 & 2032

Figure 85: MEA Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Material Type, 2021-2032

Figure 86: MEA Electronic Board Level Underfill Material Market Attractiveness by Material Type, 2022-2032

Figure 87: MEA Electronic Board Level Underfill Material Market Share and BPS Analysis by Board Type– 2022 & 2032

Figure 88: MEA Electronic Board Level Underfill Material Market Y-o-Y Growth Projections by Board Type, 2021-2032

Figure 89: MEA Electronic Board Level Underfill Material Market Attractiveness by Board Type, 2022-2032

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Electronic Board Level Underfill Material Market