Electronic Board Level Underfill Material Market Outlook (2023 to 2033)

The global electronic board level underfill material market size is expected to exceed US$ 327.2 million in 2023. Furthermore, with the rise in production and usage of electronic products, the overall sales of electronic board level underfill materials are projected to grow at 5.3% CAGR between 2023 and 2033, surpassing a valuation of US$ 548.3 million by the end of 2033.

Attribute Key Statistics
Estimated Market Size (2023E) US$ 327.2 million
Projected Market Size (2033F) US$ 548.3 million
Value-based CAGR (2023 to 2033) 5.3%
Collective Value Share: Top 3 Countries (2023E) 31.1%

Underfill is typically utilized to spread and redistribute the thermo-mechanical stress caused by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate to improve the reliability of a CSP, BGA, or flip chip on an organic board package. These underfills are manufactured from various substances, including epoxy, silica, alumina, silica gel, urethane, and many others.

Electronic board level underfill materials provide mechanical reinforcement to the solder joints and solder balls that connect a chip to a printed circuit board. Thus, they play a key role in extending thermal aging and the lifetime of electronic devices.

Rising usage of consumer electronic products, such as smartphones, tablets, cameras, laptops, etc., worldwide is proving a major impetus to the growth of the electronic board level underfill material market, and the trend is likely to continue during the forecast period.

Over the years, rapid penetration of digitalization and fast internet has resulted in the rapid growth of the smartphone industry. People choose smartphones over other electronic devices like PCs and laptops due to their mobility, usability, and affordable price. This surge in the adoption of smartphones, along with the continuous introduction of new generation smartphones at affordable prices, is expected to act as a catalyst triggering growth in the electronic board level underfill material market.

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2018 to 2022 Electronic Board Level Underfill Material Market Outlook Compared to 2023 to 2033 Forecast

The global electronic board level underfill material market is set to expand at 5.3% CAGR between 2023 and 2033, compared to 3.1% CAGR registered during the hand 2022. Growing usage of electronic devices and the ongoing trend of miniaturization and development of multi-feature electronic devices are key factors expected to boost growth in the global electronic board level underfill material market during the forecast period.

The growing propensity towards miniaturization of electronic devices is consistently increasing the number of components on printed circuit boards (PCBs), propelling the demand graph of smaller, thinner, highly integrated printed circuit boards (PCBs) incorporated with flip chip and other advanced technologies. This will continue to generate lucrative growth opportunities for the electronic board-level underfill material market during the assessment period.

Similarly, the booming electronic industry across the world, rapid penetration of digitalization, and rise in the export of electronic products will boost the demand for electronic board level underfill materials over the next ten years.

What are the Key Trends Driving the Electronic Board Level Underfill Material Market?

Rising Investments in Electronics Production to Push Sales of Electronic Board Level Underfill Materials in the Market

The electronic industry is one of the economy's most dynamic sectors, and its meteoric rise has prompted major shifts in funding. The integration of manufacturing networks in the electronics sector has benefited the ASEAN region, allowing for better commerce with bigger Asian economies like China.

China, however, is crucial not as a rival but as a developing market for the Asian electronic sector. China acquires raw materials and components from other Asian nations and then ships them all over the globe. For instance, in January 2016, China's Ministry of Industry and Information Technology, in partnership with an industry group and Ping and Bank, set up a US$ 30 billion fund for the electronic industry in China. This fund helps address the issues faced by small and medium-sized electronic manufacturers, which have folded recently. This fund has also expanded the country's technology capabilities and supports the country's significant electronics supply chain. Thus, a rapid surge in electronics production will continue to foster the global electronic board level underfill material market growth during the forecast period.

Increasing Prominence of Miniaturization of Electronic Components to Supplement Market Growth

Miniaturization of electronic devices has increased the number of components on a printed circuit board. This growing trend has increased demand for smaller, thinner, and more highly integrated printed circuit boards (PCBs) populated with flip chip technology. These nanotechnology and microelectromechanical systems (MEMS) are growing in functionality and acceptance in most applications among various industries, such as consumer electronics and others. The current pace of miniaturization of electronic devices will result in a surge in demand for PCBs shortly. Miniaturization of electronic devices, such as laptops, smartphones, consumer electronics, and many more, has led to increased usage of underfills materials in encapsulation and cavity filling type applications, thereby creating growth prospects for the global electronic board level underfill material market.

Nikhil Kaitwade
Nikhil Kaitwade

Principal Consultant

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Country-wise Insights

Why is the Demand for Electronic Board Level Underfill Materials Rising at a Robust Pace in the United States?

Rapid Production and Usage of Electronic Products Fueling Sales in the United States

As per FMI, the United States is projected to account for a significant share of approximately more than 19.4% in the global electronic board level underfill material market in 2023. Rapid growth in demand for electronic devices across the country is expected to propel the country's consumption over the forecast period.

The United States is one of the largest consumers of electronic board level underfill materials across the globe. High disposable income and per capita expenditure of Americans is creating a huge demand for electronic devices such as home automation devices, smartphones, laptops, tablets, and various other. This, in turn, will continue to propel sales of electronic board level underfill materials during the forecast period. Similarly, the rise in the transport of electronic products will create growth opportunities for leading manufacturers across the United States during the assessment period.

Why is China Emerging as a Lucrative Market for Electronic Board Level Underfill Materials?

Availability of Electronic Board Level Underfill Materials at Lower Prices Igniting Growth in China Market

With the rapid expansion of the electronic industry and the presence of product types at cheaper costs, the electronic board level underfill material market in China is poised to grow at a healthy pace of around 6.2% CAGR during the forecast period. Most of the manufacturing companies based in China are focusing on enhancing their market share and presence by offering innovative products in a short time cycle, at low cost, with improved product quality and higher performance.

Category-wise Insights

Which Product Type is High in Demand in the Global Electronic Board Level Underfill Material Market?

Demand to Remain High for Underfills in the Market

As per FMI, the underfills segment is expected to dominate the global electronic board level underfill material market during the forecast period, owing to the rising usage of underfills in a wide range of electronic products. In recent years, demand for miniaturized electronic devices has been increasing. With the growing demand for miniature circuit geometries, underfill materials are becoming popular, which is slated to increase demand over the forecast period. Emerging trends reveal that the underfills segment will gain 140 BPS during the forecast period of 2023 to 2033

Which is The Most Preferred Material Type for Electronic Board Level Underfills?

End Users Prefer Epoxy Based Electronic Board Level Underfills

Among material types, epoxy based material is vastly used as a board level underfill material owing to its properties, such as high CTE (Coefficient of Thermal Expansion), which makes it very efficient to be used as an underfill material.

The epoxy based material segment is estimated to hold the highest value share in 2023 and is expected to gain 380 BPS over the forecast period. However, due to their application in all board types, the Quartz/Silicone and Alumina underfill material segment is also estimated to grow at a significant CAGR.

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Competitive Landscape

Manufacturers of Electronic Board Level Underfill Material are positively engaged in the expansion of their geographic and market presence to cater to the rising demand for the product. They are expanding production facilities and acquisitions/mergers of regional small- and medium level players to achieve domination in the market. For instance,

  • In May 2020, Parker Lord Corporation signed a strategic partnership with Brightwater United Aero Group to enhance customer support worldwide.
  • In October 2019, Parker Hannifin, a global leader in motion and control technologies, completed the acquisition of LORD Corporation for 3.8 billion dollars to start its engineering materials division.
  • In December 2019, Henkel completed acquisitions of Deva Holdings Inc., a U.S based company, to strengthen its distribution network in the United States

Scope of Report

Attribute Details
Estimated Market Size (2023) US$ 327.2 million
Projected Market Size (2033) US$ 548.3 million
Anticipated Market Size (2023 to 2033) 5.3%
Forecast Period 2023 to 2033
Historical Data Available for 2018 to 2022
Market Analysis US$ Million for Value and Tons for Volume
Key Regions Covered North America; Latin America; Europe; East Asia; South Asia Pacific; MEA.
Key Countries Covered United States, Canada, Brazil, Mexico, Germany, Italy, France, UK, Spain, BENELUX, Russia, China, Japan, South Korea, India, ASEAN, ANZ, GCC Countries, Turkey, South Africa, and Northern Africa
Key Segments Covered Product Type, Material Type, Board Type, and Region
Key Companies Profiled Henkel AG & Co. KGaA; Namics Corporation; ASE Group; MacDermid Alpha Electronic Solutions; Parker LORD Corporation; H.B. Fuller Company; Dow Inc.; ELANTAS GmbH; Zymet; Hitachi Chemical Co., Ltd.; Panasonic Corporation; AI Technology, Inc; Indium Corporation; Sanyu Rec Co., Ltd.; Dymax Corporation; Epoxy Technology, Inc.; Protavic International; YINCAE Advanced Materials, LLC
Report Coverage Market Forecast, Company Share Analysis, Competition Intelligence, DROT Analysis, Market Dynamics and Challenges, and Strategic Growth Initiatives

Electronic Board Level Underfill Material Market by Category

By Product Type:

  • Underfills
  • Capillary
  • Edge Bonds
  • Gob Top Encapsulations

By Material Type:

  • Quartz / Silicone
  • Alumina Based
  • Epoxy Based
  • Urethane Based
  • Acrylic Based
  • Others

By Board Type:

  • CSP (Chip Scale Package)
  • BGA (Ball Grid array)
  • Flip Chips

By Region:

  • North America
  • Latin America
  • Europe
  • East Asia
  • South Asia Pacific
  • Middle East and Africa

Frequently Asked Questions

What will be the Yearly Growth Rate of Electronic Board Level Underfill Material Sales on a Global Level?

Demand for such underfill materials globally is forecasted to surge at 5.3% CAGR through 2033.

What is the Current Size of the Global Electronic Board Level Underfill Material Market?

The net worth of the global market in 2023 is estimated to be around US$ 327.2 million.

Which is the Popular Proton Pump Inhibitor based on Device Size?

The miniaturized electronic devices segment creates higher demand for the overall market.

What is the Collective Share of the Top 3 Countries in the Global Market?

The overall share of the top 3 countries could be almost 31.1% in 2023.

Which is the Leading Regional Market for Electronic Board Level Underfill Materials?

The United States market is poised to lead with almost 19.4% market share in 2023.

Table of Content

1. Executive Summary

    1.1. Global Market Outlook

    1.2. Demand-side Trends

    1.3. Supply-side Trends

    1.4. Technology Roadmap Analysis

    1.5. Analysis and Recommendations

2. Market Overview

    2.1. Market Coverage / Taxonomy

    2.2. Market Definition / Scope / Limitations

3. Market Background

    3.1. Market Dynamics

        3.1.1. Drivers

        3.1.2. Restraints

        3.1.3. Opportunity

        3.1.4. Trends

    3.2. Scenario Forecast

        3.2.1. Demand in Optimistic Scenario

        3.2.2. Demand in Likely Scenario

        3.2.3. Demand in Conservative Scenario

    3.3. Opportunity Map Analysis

    3.4. Product Life Cycle Analysis

    3.5. Supply Chain Analysis

        3.5.1. Supply Side Participants and their Roles

            3.5.1.1. Producers

            3.5.1.2. Mid-Level Participants (Traders/ Agents/ Brokers)

            3.5.1.3. Wholesalers and Distributors

        3.5.2. Value Added and Value Created at Node in the Supply Chain

        3.5.3. List of Raw Material Suppliers

        3.5.4. List of Existing and Potential Buyer’s

    3.6. Investment Feasibility Matrix

    3.7. Value Chain Analysis

        3.7.1. Profit Margin Analysis

        3.7.2. Wholesalers and Distributors

        3.7.3. Retailers

    3.8. PESTLE and Porter’s Analysis

    3.9. Regulatory Landscape

        3.9.1. By Key Regions

        3.9.2. By Key Countries

    3.10. Regional Parent Market Outlook

    3.11. Production and Consumption Statistics

    3.12. Import and Export Statistics

4. Global Market Analysis 2018 to 2022 and Forecast, 2023 to 2033

    4.1. Historical Market Size Value (US$ Million) & Volume (Tons) Analysis, 2018 to 2022

    4.2. Current and Future Market Size Value (US$ Million) & Volume (Tons) Projections, 2023 to 2033

        4.2.1. Y-o-Y Growth Trend Analysis

        4.2.2. Absolute $ Opportunity Analysis

5. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Product Type

    5.1. Introduction / Key Findings

    5.2. Historical Market Size Value (US$ Million) & Volume (Tons) Analysis By Product Type, 2018 to 2022

    5.3. Current and Future Market Size Value (US$ Million) & Volume (Tons) Analysis and Forecast By Product Type, 2023 to 2033

        5.3.1. Underfills

            5.3.1.1. Capillary

            5.3.1.2. Edge Bonds

        5.3.2. Gob Top Encapsulations

    5.4. Y-o-Y Growth Trend Analysis By Product Type, 2018 to 2022

    5.5. Absolute $ Opportunity Analysis By Product Type, 2023 to 2033

6. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Material Type

    6.1. Introduction / Key Findings

    6.2. Historical Market Size Value (US$ Million) & Volume (Tons) Analysis By Material Type, 2018 to 2022

    6.3. Current and Future Market Size Value (US$ Million) & Volume (Tons) Analysis and Forecast By Material Type, 2023 to 2033

        6.3.1. Quartz / Silicone

        6.3.2. Alumina Based

        6.3.3. Epoxy Based

        6.3.4. Urethane Based

        6.3.5. Acrylic Based

        6.3.6. Others

    6.4. Y-o-Y Growth Trend Analysis By Material Type, 2018 to 2022

    6.5. Absolute $ Opportunity Analysis By Material Type, 2023 to 2033

7. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Board Type

    7.1. Introduction / Key Findings

    7.2. Historical Market Size Value (US$ Million) & Volume (Tons) Analysis By Board Type, 2018 to 2022

    7.3. Current and Future Market Size Value (US$ Million) & Volume (Tons) Analysis and Forecast By Board Type, 2023 to 2033

        7.3.1. CSP (Chip Scale Package)

        7.3.2. BGA (Ball Grid array)

        7.3.3. Flip Chips

    7.4. Y-o-Y Growth Trend Analysis By Board Type, 2018 to 2022

    7.5. Absolute $ Opportunity Analysis By Board Type, 2023 to 2033

8. Global Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Region

    8.1. Introduction

    8.2. Historical Market Size Value (US$ Million) & Volume (Tons) Analysis By Region, 2018 to 2022

    8.3. Current Market Size Value (US$ Million) & Volume (Tons) Analysis and Forecast By Region, 2023 to 2033

        8.3.1. North America

        8.3.2. Latin America

        8.3.3. Western Europe

        8.3.4. Eastern Europe

        8.3.5. South Asia and Pacific

        8.3.6. East Asia

        8.3.7. Middle East and Africa

    8.4. Market Attractiveness Analysis By Region

9. North America Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country

    9.1. Historical Market Size Value (US$ Million) & Volume (Tons) Trend Analysis By Market Taxonomy, 2018 to 2022

    9.2. Market Size Value (US$ Million) & Volume (Tons) Forecast By Market Taxonomy, 2023 to 2033

        9.2.1. By Country

            9.2.1.1. USA

            9.2.1.2. Canada

        9.2.2. By Product Type

        9.2.3. By Material Type

        9.2.4. By Board Type

    9.3. Market Attractiveness Analysis

        9.3.1. By Country

        9.3.2. By Product Type

        9.3.3. By Material Type

        9.3.4. By Board Type

    9.4. Key Takeaways

10. Latin America Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country

    10.1. Historical Market Size Value (US$ Million) & Volume (Tons) Trend Analysis By Market Taxonomy, 2018 to 2022

    10.2. Market Size Value (US$ Million) & Volume (Tons) Forecast By Market Taxonomy, 2023 to 2033

        10.2.1. By Country

            10.2.1.1. Brazil

            10.2.1.2. Mexico

            10.2.1.3. Rest of Latin America

        10.2.2. By Product Type

        10.2.3. By Material Type

        10.2.4. By Board Type

    10.3. Market Attractiveness Analysis

        10.3.1. By Country

        10.3.2. By Product Type

        10.3.3. By Material Type

        10.3.4. By Board Type

    10.4. Key Takeaways

11. Western Europe Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country

    11.1. Historical Market Size Value (US$ Million) & Volume (Tons) Trend Analysis By Market Taxonomy, 2018 to 2022

    11.2. Market Size Value (US$ Million) & Volume (Tons) Forecast By Market Taxonomy, 2023 to 2033

        11.2.1. By Country

            11.2.1.1. Germany

            11.2.1.2. UK

            11.2.1.3. France

            11.2.1.4. Spain

            11.2.1.5. Italy

            11.2.1.6. Rest of Western Europe

        11.2.2. By Product Type

        11.2.3. By Material Type

        11.2.4. By Board Type

    11.3. Market Attractiveness Analysis

        11.3.1. By Country

        11.3.2. By Product Type

        11.3.3. By Material Type

        11.3.4. By Board Type

    11.4. Key Takeaways

12. Eastern Europe Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country

    12.1. Historical Market Size Value (US$ Million) & Volume (Tons) Trend Analysis By Market Taxonomy, 2018 to 2022

    12.2. Market Size Value (US$ Million) & Volume (Tons) Forecast By Market Taxonomy, 2023 to 2033

        12.2.1. By Country

            12.2.1.1. Poland

            12.2.1.2. Russia

            12.2.1.3. Czech Republic

            12.2.1.4. Romania

            12.2.1.5. Rest of Eastern Europe

        12.2.2. By Product Type

        12.2.3. By Material Type

        12.2.4. By Board Type

    12.3. Market Attractiveness Analysis

        12.3.1. By Country

        12.3.2. By Product Type

        12.3.3. By Material Type

        12.3.4. By Board Type

    12.4. Key Takeaways

13. South Asia and Pacific Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country

    13.1. Historical Market Size Value (US$ Million) & Volume (Tons) Trend Analysis By Market Taxonomy, 2018 to 2022

    13.2. Market Size Value (US$ Million) & Volume (Tons) Forecast By Market Taxonomy, 2023 to 2033

        13.2.1. By Country

            13.2.1.1. India

            13.2.1.2. Bangladesh

            13.2.1.3. Australia

            13.2.1.4. New Zealand

            13.2.1.5. Rest of South Asia and Pacific

        13.2.2. By Product Type

        13.2.3. By Material Type

        13.2.4. By Board Type

    13.3. Market Attractiveness Analysis

        13.3.1. By Country

        13.3.2. By Product Type

        13.3.3. By Material Type

        13.3.4. By Board Type

    13.4. Key Takeaways

14. East Asia Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country

    14.1. Historical Market Size Value (US$ Million) & Volume (Tons) Trend Analysis By Market Taxonomy, 2018 to 2022

    14.2. Market Size Value (US$ Million) & Volume (Tons) Forecast By Market Taxonomy, 2023 to 2033

        14.2.1. By Country

            14.2.1.1. China

            14.2.1.2. Japan

            14.2.1.3. South Korea

        14.2.2. By Product Type

        14.2.3. By Material Type

        14.2.4. By Board Type

    14.3. Market Attractiveness Analysis

        14.3.1. By Country

        14.3.2. By Product Type

        14.3.3. By Material Type

        14.3.4. By Board Type

    14.4. Key Takeaways

15. Middle East and Africa Market Analysis 2018 to 2022 and Forecast 2023 to 2033, By Country

    15.1. Historical Market Size Value (US$ Million) & Volume (Tons) Trend Analysis By Market Taxonomy, 2018 to 2022

    15.2. Market Size Value (US$ Million) & Volume (Tons) Forecast By Market Taxonomy, 2023 to 2033

        15.2.1. By Country

            15.2.1.1. GCC Countries

            15.2.1.2. South Africa

            15.2.1.3. Israel

            15.2.1.4. Rest of MEA

        15.2.2. By Product Type

        15.2.3. By Material Type

        15.2.4. By Board Type

    15.3. Market Attractiveness Analysis

        15.3.1. By Country

        15.3.2. By Product Type

        15.3.3. By Material Type

        15.3.4. By Board Type

    15.4. Key Takeaways

16. Key Countries Market Analysis

    16.1. USA

        16.1.1. Pricing Analysis

        16.1.2. Market Share Analysis, 2022

            16.1.2.1. By Product Type

            16.1.2.2. By Material Type

            16.1.2.3. By Board Type

    16.2. Canada

        16.2.1. Pricing Analysis

        16.2.2. Market Share Analysis, 2022

            16.2.2.1. By Product Type

            16.2.2.2. By Material Type

            16.2.2.3. By Board Type

    16.3. Brazil

        16.3.1. Pricing Analysis

        16.3.2. Market Share Analysis, 2022

            16.3.2.1. By Product Type

            16.3.2.2. By Material Type

            16.3.2.3. By Board Type

    16.4. Mexico

        16.4.1. Pricing Analysis

        16.4.2. Market Share Analysis, 2022

            16.4.2.1. By Product Type

            16.4.2.2. By Material Type

            16.4.2.3. By Board Type

    16.5. Germany

        16.5.1. Pricing Analysis

        16.5.2. Market Share Analysis, 2022

            16.5.2.1. By Product Type

            16.5.2.2. By Material Type

            16.5.2.3. By Board Type

    16.6. UK

        16.6.1. Pricing Analysis

        16.6.2. Market Share Analysis, 2022

            16.6.2.1. By Product Type

            16.6.2.2. By Material Type

            16.6.2.3. By Board Type

    16.7. France

        16.7.1. Pricing Analysis

        16.7.2. Market Share Analysis, 2022

            16.7.2.1. By Product Type

            16.7.2.2. By Material Type

            16.7.2.3. By Board Type

    16.8. Spain

        16.8.1. Pricing Analysis

        16.8.2. Market Share Analysis, 2022

            16.8.2.1. By Product Type

            16.8.2.2. By Material Type

            16.8.2.3. By Board Type

    16.9. Italy

        16.9.1. Pricing Analysis

        16.9.2. Market Share Analysis, 2022

            16.9.2.1. By Product Type

            16.9.2.2. By Material Type

            16.9.2.3. By Board Type

    16.10. Poland

        16.10.1. Pricing Analysis

        16.10.2. Market Share Analysis, 2022

            16.10.2.1. By Product Type

            16.10.2.2. By Material Type

            16.10.2.3. By Board Type

    16.11. Russia

        16.11.1. Pricing Analysis

        16.11.2. Market Share Analysis, 2022

            16.11.2.1. By Product Type

            16.11.2.2. By Material Type

            16.11.2.3. By Board Type

    16.12. Czech Republic

        16.12.1. Pricing Analysis

        16.12.2. Market Share Analysis, 2022

            16.12.2.1. By Product Type

            16.12.2.2. By Material Type

            16.12.2.3. By Board Type

    16.13. Romania

        16.13.1. Pricing Analysis

        16.13.2. Market Share Analysis, 2022

            16.13.2.1. By Product Type

            16.13.2.2. By Material Type

            16.13.2.3. By Board Type

    16.14. India

        16.14.1. Pricing Analysis

        16.14.2. Market Share Analysis, 2022

            16.14.2.1. By Product Type

            16.14.2.2. By Material Type

            16.14.2.3. By Board Type

    16.15. Bangladesh

        16.15.1. Pricing Analysis

        16.15.2. Market Share Analysis, 2022

            16.15.2.1. By Product Type

            16.15.2.2. By Material Type

            16.15.2.3. By Board Type

    16.16. Australia

        16.16.1. Pricing Analysis

        16.16.2. Market Share Analysis, 2022

            16.16.2.1. By Product Type

            16.16.2.2. By Material Type

            16.16.2.3. By Board Type

    16.17. New Zealand

        16.17.1. Pricing Analysis

        16.17.2. Market Share Analysis, 2022

            16.17.2.1. By Product Type

            16.17.2.2. By Material Type

            16.17.2.3. By Board Type

    16.18. China

        16.18.1. Pricing Analysis

        16.18.2. Market Share Analysis, 2022

            16.18.2.1. By Product Type

            16.18.2.2. By Material Type

            16.18.2.3. By Board Type

    16.19. Japan

        16.19.1. Pricing Analysis

        16.19.2. Market Share Analysis, 2022

            16.19.2.1. By Product Type

            16.19.2.2. By Material Type

            16.19.2.3. By Board Type

    16.20. South Korea

        16.20.1. Pricing Analysis

        16.20.2. Market Share Analysis, 2022

            16.20.2.1. By Product Type

            16.20.2.2. By Material Type

            16.20.2.3. By Board Type

    16.21. GCC Countries

        16.21.1. Pricing Analysis

        16.21.2. Market Share Analysis, 2022

            16.21.2.1. By Product Type

            16.21.2.2. By Material Type

            16.21.2.3. By Board Type

    16.22. South Africa

        16.22.1. Pricing Analysis

        16.22.2. Market Share Analysis, 2022

            16.22.2.1. By Product Type

            16.22.2.2. By Material Type

            16.22.2.3. By Board Type

    16.23. Israel

        16.23.1. Pricing Analysis

        16.23.2. Market Share Analysis, 2022

            16.23.2.1. By Product Type

            16.23.2.2. By Material Type

            16.23.2.3. By Board Type

17. Market Structure Analysis

    17.1. Competition Dashboard

    17.2. Competition Benchmarking

    17.3. Market Share Analysis of Top Players

        17.3.1. By Regional

        17.3.2. By Product Type

        17.3.3. By Material Type

        17.3.4. By Board Type

18. Competition Analysis

    18.1. Competition Deep Dive

        18.1.1. Henkel AG & Co. KGaA

            18.1.1.1. Overview

            18.1.1.2. Product Portfolio

            18.1.1.3. Profitability by Market Segments

            18.1.1.4. Sales Footprint

            18.1.1.5. Strategy Overview

                18.1.1.5.1. Marketing Strategy

                18.1.1.5.2. Product Strategy

                18.1.1.5.3. Channel Strategy

        18.1.2. Namics Corporation

            18.1.2.1. Overview

            18.1.2.2. Product Portfolio

            18.1.2.3. Profitability by Market Segments

            18.1.2.4. Sales Footprint

            18.1.2.5. Strategy Overview

                18.1.2.5.1. Marketing Strategy

                18.1.2.5.2. Product Strategy

                18.1.2.5.3. Channel Strategy

        18.1.3. ASE Group

            18.1.3.1. Overview

            18.1.3.2. Product Portfolio

            18.1.3.3. Profitability by Market Segments

            18.1.3.4. Sales Footprint

            18.1.3.5. Strategy Overview

                18.1.3.5.1. Marketing Strategy

                18.1.3.5.2. Product Strategy

                18.1.3.5.3. Channel Strategy

        18.1.4. MacDermid Alpha Electronic Solutions

            18.1.4.1. Overview

            18.1.4.2. Product Portfolio

            18.1.4.3. Profitability by Market Segments

            18.1.4.4. Sales Footprint

            18.1.4.5. Strategy Overview

                18.1.4.5.1. Marketing Strategy

                18.1.4.5.2. Product Strategy

                18.1.4.5.3. Channel Strategy

        18.1.5. Parker LORD Corporation

            18.1.5.1. Overview

            18.1.5.2. Product Portfolio

            18.1.5.3. Profitability by Market Segments

            18.1.5.4. Sales Footprint

            18.1.5.5. Strategy Overview

                18.1.5.5.1. Marketing Strategy

                18.1.5.5.2. Product Strategy

                18.1.5.5.3. Channel Strategy

        18.1.6. H.B. Fuller Company

            18.1.6.1. Overview

            18.1.6.2. Product Portfolio

            18.1.6.3. Profitability by Market Segments

            18.1.6.4. Sales Footprint

            18.1.6.5. Strategy Overview

                18.1.6.5.1. Marketing Strategy

                18.1.6.5.2. Product Strategy

                18.1.6.5.3. Channel Strategy

        18.1.7. Dow Inc.

            18.1.7.1. Overview

            18.1.7.2. Product Portfolio

            18.1.7.3. Profitability by Market Segments

            18.1.7.4. Sales Footprint

            18.1.7.5. Strategy Overview

                18.1.7.5.1. Marketing Strategy

                18.1.7.5.2. Product Strategy

                18.1.7.5.3. Channel Strategy

        18.1.8. ELANTAS GmbH

            18.1.8.1. Overview

            18.1.8.2. Product Portfolio

            18.1.8.3. Profitability by Market Segments

            18.1.8.4. Sales Footprint

            18.1.8.5. Strategy Overview

                18.1.8.5.1. Marketing Strategy

                18.1.8.5.2. Product Strategy

                18.1.8.5.3. Channel Strategy

        18.1.9. Zymet

            18.1.9.1. Overview

            18.1.9.2. Product Portfolio

            18.1.9.3. Profitability by Market Segments

            18.1.9.4. Sales Footprint

            18.1.9.5. Strategy Overview

                18.1.9.5.1. Marketing Strategy

                18.1.9.5.2. Product Strategy

                18.1.9.5.3. Channel Strategy

        18.1.10. Hitachi Chemical Co., Ltd.

            18.1.10.1. Overview

            18.1.10.2. Product Portfolio

            18.1.10.3. Profitability by Market Segments

            18.1.10.4. Sales Footprint

            18.1.10.5. Strategy Overview

                18.1.10.5.1. Marketing Strategy

                18.1.10.5.2. Product Strategy

                18.1.10.5.3. Channel Strategy

        18.1.11. Panasonic Corporation

            18.1.11.1. Overview

            18.1.11.2. Product Portfolio

            18.1.11.3. Profitability by Market Segments

            18.1.11.4. Sales Footprint

            18.1.11.5. Strategy Overview

                18.1.11.5.1. Marketing Strategy

                18.1.11.5.2. Product Strategy

                18.1.11.5.3. Channel Strategy

        18.1.12. AI Technology, Inc

            18.1.12.1. Overview

            18.1.12.2. Product Portfolio

            18.1.12.3. Profitability by Market Segments

            18.1.12.4. Sales Footprint

            18.1.12.5. Strategy Overview

                18.1.12.5.1. Marketing Strategy

                18.1.12.5.2. Product Strategy

                18.1.12.5.3. Channel Strategy

        18.1.13. Indium Corporation

            18.1.13.1. Overview

            18.1.13.2. Product Portfolio

            18.1.13.3. Profitability by Market Segments

            18.1.13.4. Sales Footprint

            18.1.13.5. Strategy Overview

                18.1.13.5.1. Marketing Strategy

                18.1.13.5.2. Product Strategy

                18.1.13.5.3. Channel Strategy

        18.1.14. Sanyu Rec Co., Ltd.

            18.1.14.1. Overview

            18.1.14.2. Product Portfolio

            18.1.14.3. Profitability by Market Segments

            18.1.14.4. Sales Footprint

            18.1.14.5. Strategy Overview

                18.1.14.5.1. Marketing Strategy

                18.1.14.5.2. Product Strategy

                18.1.14.5.3. Channel Strategy

        18.1.15. Dymax Corporation

            18.1.15.1. Overview

            18.1.15.2. Product Portfolio

            18.1.15.3. Profitability by Market Segments

            18.1.15.4. Sales Footprint

            18.1.15.5. Strategy Overview

                18.1.15.5.1. Marketing Strategy

                18.1.15.5.2. Product Strategy

                18.1.15.5.3. Channel Strategy

        18.1.16. Epoxy Technology, Inc.

            18.1.16.1. Overview

            18.1.16.2. Product Portfolio

            18.1.16.3. Profitability by Market Segments

            18.1.16.4. Sales Footprint

            18.1.16.5. Strategy Overview

                18.1.16.5.1. Marketing Strategy

                18.1.16.5.2. Product Strategy

                18.1.16.5.3. Channel Strategy

        18.1.17. Protavic International

            18.1.17.1. Overview

            18.1.17.2. Product Portfolio

            18.1.17.3. Profitability by Market Segments

            18.1.17.4. Sales Footprint

            18.1.17.5. Strategy Overview

                18.1.17.5.1. Marketing Strategy

                18.1.17.5.2. Product Strategy

                18.1.17.5.3. Channel Strategy

        18.1.18. YINCAE Advanced Materials, LLC

            18.1.18.1. Overview

            18.1.18.2. Product Portfolio

            18.1.18.3. Profitability by Market Segments

            18.1.18.4. Sales Footprint

            18.1.18.5. Strategy Overview

                18.1.18.5.1. Marketing Strategy

                18.1.18.5.2. Product Strategy

                18.1.18.5.3. Channel Strategy

19. Assumptions & Acronyms Used

20. Research Methodology

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