Automatic Dicing Saw Market Outlook (2023 to 2033)
The future of the automatic dicing saw market is looking bright, according to Future Market Insights. With a predicted value pool of US$ 1 billion by the end of 2023, this market is set to soar to new heights. But that's not all - the global demand for Automatic Dicing Saw is expected to rise at a CAGR of 7.2% to reach US$ 2 billion by 2033.
Data Points
Key Statistics
Expected Market Value in 2023
US$ 1 billion
Projected Market Value in 2033
US$ 2 billion
Growth Rate (2023 to 2033)
7.2% CAGR
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Cutting-Edge Demand: Exploring the Prominent Drivers of the Automatic Dicing Saw Market
Among the primary drivers of the automatic dicing saw market is the increasing demand for smartphones and other mobile devices. With the proliferation of mobile technology, there is a growing need for high-performance, low-power, and small-size semiconductors. The use of automatic dicing saws in the semiconductor manufacturing process allows for the efficient and precise cutting of wafers into individual chips, making it possible to produce smaller, more powerful chips for mobile devices.
The automatic dicing saw market is being driven by the growing demand for electric vehicles (EVs). EVs rely on a variety of semiconductor technologies, from power electronics and sensors to battery management systems and advanced driver assistance systems (ADAS). The use of automatic dicing saws in the manufacturing process enables the production of high-quality, reliable semiconductors, which are essential for the safe and efficient operation of EVs.
The automatic dicing saw market is also being driven by the increasing demand for precision manufacturing. With the growth of advanced technologies such as 5G, artificial intelligence (AI), and the internet of things (IoT), there is a growing need for high-precision, high-performance semiconductors. The use of automatic dicing saws in the manufacturing process enables manufacturers to produce chips with greater accuracy and precision, ensuring that they meet the demanding requirements of these advanced technologies.
The growing trend towards automation and Industry 4.0 is also driving the automatic dicing saw market. As manufacturers seek to improve efficiency and reduce costs, they are increasingly turning to automation and advanced manufacturing technologies. The use of automatic dicing saws is an essential part of this trend, as they allow for the efficient and precise cutting of wafers, making it possible to produce high-quality, reliable semiconductors at scale.
Slicing Success: Latest Trends in the Automatic Dicing Saw Market
Growth of the 5G market: The rollout of 5G technology is driving the demand for higher-performing semiconductors, which in turn is driving the demand for automatic dicing saws.
Advancements in laser dicing technology: The use of lasers for dicing wafers is becoming more common. This is due to its precision and ability to cut through advanced materials.
Adoption of smaller wafer sizes: With the demand for smaller and more powerful semiconductors, manufacturers are increasingly using smaller wafer sizes. This is driving the demand for automatic dicing saws that can handle these smaller sizes.
Increasing use of wafer thinning: Wafer thinning is becoming more popular as it can help to reduce the thickness of wafers, making them more flexible and easier to work with. Automatic dicing saws that can perform wafer thinning are in high demand.
Demand for automated inspection systems: As manufacturers seek to improve quality control and reduce defects, the demand for automatic dicing saws with integrated inspection systems is increasing.
Focus on sustainability: With a growing focus on sustainability, manufacturers are seeking to reduce waste and energy consumption in the manufacturing process. Automatic dicing saws that can improve efficiency and reduce waste are becoming more popular.
The demand will witness steady recovery in short-term, with optimistic growth outlook in the long-run. Growing semiconductor industry will amplify the opportunities in near future, and the application of automatic dicing saw in military & defense sector will provide momentum.
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What is Driving Demand for Automatic Dicing Saw?
Automatic dicing saws are involved in cutting process controlled automatically through software programming. Various applications of the product include cutting semiconductor and ceramic materials into almost any shapes with straight edges.
The significant demand for dicing saw comes from electronics and semiconductor industry where gradual increase in mass production and sales of various wafer dicing saw products and chiller for semiconductor production per year across the world.
In addition to traditional applications in semiconductor industry, the adoption is growing in the automotive and defense sector. The product has significant application in power modules, MEMS & Sensors for the automotive, industrial, mobile and medical market.
Semiconductor Industry Growth to be the Torch Bearer for Automatic Dicing Saw Sales
Rising demand for number of semiconductor devices required for data centers and IoT and along with increasing self-driving cars, component manufacturing sector are some of the major factors to drive the automatic dicing saws sales.
With penetration of semiconductors in almost all industry verticals the market is anticipated to witness growth. Manufacturers are focused on reducing footprints while improving production capacities at the same time, hence sales are likely to improve over the course of the assessment period.
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Asia Pacific Market Outlook
Asia-Pacific being the major semiconductor components production hub in the world and is anticipated to remain so for the coming years. Growing initiatives by the Chinese government such as Vision 2020 have strongly drawn attention from the international players to set up local production establishments. China remains worlds’ leading semiconductor manufacturer and hence significant demand for dicing saws.
Another emerging country in the region, Vietnam, has witnessed the recent rise in customs duties on imported electronics is creating a critical role in attracting tier one players like Apple to set up local plants. Again, study by SEMI, a prominent global association serving the manufacturing supply chain of the electronics industry, suggested that more than 90% of the foundries constructed in the world during 2017 were situated in the Asia Pacific.
It is anticipated that most of these foundries are focused in Japan & China which is expected to open up better opportunities for the automatic dicing equipment in the long term.
Europe Demand Outlook for Automatic Dicing Saw
Some of the leading product manufacturers in Europe are focused on supplying the smallest fully automatic Blade Dicers in the world, setting new standards with their small footprint and high-efficiency which is further creating opportunities for growth in the region.
Who are the Key Manufacturers and Suppliers of Automatic Dicing Saw?
Some of the leading manufacturers and suppliers of Automatic Dicing Saw include
DISCO Corporation
Dynatex International
TOKYO SEIMITSU
Loadpoint Micross Components
SR Co., Ltd
Advanced Dicing Technologies Ltd. (ADT)
Shenyang Heyan Technology Co., Ltd.
Accretech.
Major OEM companies dealing in automatic dicing saw business are providing semi as well as fully automatic dicing saws to suit a wide range of application requirements, from semiconductor research and development, through to medium and high volume production applications. Suppliers offers the equipment with a variety of capabilities, configurations as well as levels of automation, as well as peripheral accessories and instrumentation, to cater to an ever-growing range of buyer requirements.
The report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macro-economic indicators and governing factors along with market attractiveness as per segments.
The report also maps the qualitative impact of various market factors on market segments and geographies.
