Two-Phase Direct-to-Chip Commissioning Services Market

How big is Two-Phase Direct-to-Chip Commissioning Services Market in 2026?

The market is projected to reach USD 339.4 Million in 2026 and USD 1102.0 Million by 2036, growing at a 12.5% CAGR.

Demand for two-phase direct-to-chip commissioning services is set to reach USD 339.4 million in 2026, with the market advancing at a 12.5% CAGR to reach USD 1102.0 million by 2036. Growth in this market is being shaped by a fundamental shift in how data center operators think about thermal readiness. As AI and high-performance computing clusters push power densities beyond what air cooling can manage, commissioning has moved from a component-level checklist to a system-level acceptance exercise. A single misconfigured flow setting can now idle computing capacity worth far more than the cooling infrastructure itself, which is pushing owners toward rigorous, evidence-based validation before clusters go live. This dynamic is the core driver reshaping service scope and spending patterns across the industry.

At the same time, execution complexity varies sharply by facility type. Hyperscale campuses built for phased expansion can apply repeatable acceptance procedures across sequential halls, creating efficiency and cost advantages. Brownfield retrofits, by contrast, demand deeper design validation before refrigerant loops and heat rejection systems can be safely integrated into existing infrastructure, representing a more complex but often higher-value service opportunity. Buyers increasingly commit budget when commissioning evidence ties directly to uptime guarantees, warranty acceptance, and a well-defined operating envelope for production clusters, an opportunity area for providers who can formalize this link.

Key Takeaways of Two-Phase Direct-to-Chip Commissioning Services Market

• Commissioning and balancing is estimated to hold 26.0% of service scope demand in 2026, while dry coolers account for 29.0% of heat rejection / secondary loop demand.
• Saudi Arabia leads country-wise CAGR at 14.1% from 2026 to 2036, followed by South Korea at 13.8%, as new AI compute deployments expand alongside power and data-center capacity.
• The 251-500 kW range is projected to lead rack density demand with a 34.0% share in 2026 due to high commissioning complexity at repeatable AI deployment scale.
• Refrigerant-side interoperability issues can prolong qualification cycles, even as warm-water heat rejection and brownfield retrofit conversions expand demand for design validation and balancing work.
• Directly evidenced participants include Accelsius, Vertiv, Parker Hannifin and ZutaCore. Market analysis also uses current ASHRAE and OCP technical documentation.

Analyst Perspective

"System handoff readiness is the right test for direct-to-chip commissioning. Stable flow and temperature are essential, but controls, alarms and the secondary fluid network also have to behave correctly. The service proves its value when the same checks can be repeated across a large AI deployment."

- Sudip Saha, Principal Analyst at Future Market Insights

How is the Two-Phase Direct-to-Chip Commissioning Services Market segmented?

The market is broken down by Service Scope, Heat Rejection / Secondary Loop, Rack Density, Data Center Type, Route to Market, and Region.

Each segmentation axis highlights a distinct part of the commissioning workload. For example, Service Scope separates initial project design from startup validation and failure analysis, while also distinguishing retrofit conversions from routine ongoing maintenance. Heat Rejection / Secondary Loop identifies exactly how rack-side thermal loads reach the facility's overall infrastructure. Rack Density indicates the specific testing burden created when significant heat is concentrated into smaller physical spaces. Data Center Type separates hyperscale AI environments from colocation, enterprise AI/HPC, and research/sovereign compute settings. Finally, Route to Market illustrates which entity owns the customer relationship and holds commissioning accountability. Collectively, these categories demonstrate that service demand relies on proving the entire connected thermal chain against site acceptance criteria, rather than just testing standalone cooling hardware.

Why does commissioning / balancing lead the service scope category?

Before any IT load is accepted, commissioning and balancing test the cooling path as a unified, connected system. Teams measure flow distribution and temperature responses, then verify controls, alarms, and leak detection systems. This task is complex because the rack-side and facility-side networks must operate seamlessly together under intended conditions, going far beyond simply adding fluid.

• Commissioning and balancing holds a 26.0% market share in 2026 because comprehensive acceptance testing is mandatory across both new installations and retrofits before operational handover can occur.
• In February 2025, Vertiv launched its Liquid Cooling Services globally, featuring startup and commissioning work that strictly verifies connected equipment and the function of heat-rejection or cooling loops.

Why do dry coolers lead the heat rejection / secondary loop category?

Direct-to-chip architectures can function with warmer facility-water temperatures, making dry coolers a highly practical option for heat rejection. ASHRAE notes that 45°C inlet water enables dry-cooler heat rejection and reduces the need for mechanical refrigeration. Consequently, commissioning tasks shift toward fan staging, approach-temperature checks, and the validation of pump curves, control sequences, and ambient-temperature boundaries. Unlike chilled-water plants, a dry cooler's available cooling margin fluctuates with outdoor weather conditions. Two-phase systems can also reject heat into these warmer facility loops, making the facility interface a core part of the acceptance boundary. While chillers remain necessary in certain climates or for specific design temperatures-and cooling towers or hybrid setups serve other priorities-dry-cooler projects require repeatable service work focused on proving chiller-less operation across expected environmental conditions.

• Dry coolers hold a 29.0% share in 2026 because warm-water direct-to-chip (DTC) designs are increasing the adoption of closed-loop heat rejection, which requires careful validation of controls and seasonal performance.
• ASHRAE’s 2026 AI Data Center Energy Performance Framework highlights 45°C inlet water as a primary enabler of dry-cooler-based heat rejection, though it notes sensitivity to high ambient temperatures.

Why does 251-500 kW lead the rack density category?

At the 251-500 kW level, rack density is high enough that a single commissioning error can trigger a system-wide thermal crisis, yet this segment is much more common than the most extreme rack designs. A single mistake here can jeopardize multiple high-value accelerators through shared manifolds or Coolant Distribution Units (CDUs). Basic leak checks are not enough; teams must rigorously confirm flow balance and control responses, test fault states, and monitor facility-loop behavior under representative loads. Lower-density projects often retain more air-assisted cooling, while racks above 500 kW generally require highly specialized architectures and represent a narrower deployment class.

• The 251-500 kW category commands a 34.0% share in 2026 because it merges high commissioning complexity with a rack-and-row scale that is frequently repeated across large AI deployments.
• The February 2025 Open Compute Project two-phase technical paper highlighted an in-row refrigerant-to-liquid CDU design rated at 400 kW, featuring 45°C facility water and an in-situ secondary fluid network, placing it squarely in this segment.

Why does hyperscale AI lead the data center type category?

Hyperscale AI deployments condense massive amounts of computing value and thermal load into repeated cluster blocks. This repetition drastically increases the value of standardized acceptance procedures, allowing a single rack or row test pattern to be scaled across an entire data hall. These hyperscale sites integrate the liquid cooling loop with power controls, building management systems, and facility heat rejection, creating multiple interfaces where a configuration error could delay a compute rollout. Hyperscale AI effectively combines massive deployment scale with an uncompromising need for documented readiness before expensive accelerator capacity is handed over to operations.

• Hyperscale AI holds a 48.0% share in 2026 because highly concentrated GPU deployments necessitate repeatable commissioning packages that carry high stakes for uptime and scheduling.
• In March 2026, Accelsius introduced the NeuCool IR150, an integrated two-phase rack combining a CDU with 42U of IT space and built-in manifolds to support up to 150 kW of cooling capacity.

Why does cooling OEM direct lead the route to market category?

Cooling Original Equipment Manufacturers (OEMs) remain a dominant route to market because two-phase performance relies heavily on proprietary design choices across cold plates, refrigerant circuits, CDU controls, and service procedures. Keeping the OEM engaged during startup ensures settings stay within the intended operating envelope and reduces friction when commissioning records are tied to warranty or support agreements. Direct OEM engagement offers the most value when a customer desires a single technical owner fully accountable for system startup-a factor that carries extra weight during early adoption phases while field practices are still being standardized.

• Cooling OEM direct holds a 36.0% share in 2026 because proprietary thermal controls and unique service procedures keep the cooling-system supplier intimately involved in acceptance testing and handover.
• In March 2025, Accelsius launched NeuGuard, providing lifecycle support from planning through deployment, with commissioning and ongoing maintenance delivered via its authorized-service ecosystem.

What are the drivers, restraints and opportunities in the Two-Phase Direct-to-Chip Commissioning Services Market?

AI rack densification is accelerating the need for meticulously verified system startups. However, two-phase integration complexity can cause project delays, while warm-water and retrofit architectures are opening up new service opportunities.

• Driver: Before any compute capacity can be released, high-density AI clusters demand that direct-to-chip thermal systems are rigorously validated under realistic loads.
• Restraint: Refrigerant-side controls and interoperability issues can prolong qualification cycles, while a lack of technician capability and facility integration challenges can further delay acceptance.
• Opportunity: Warm-water heat rejection and brownfield conversions are expanding the need for design validation and balancing, and fault testing alongside lifecycle optimization creates ongoing follow-on work.

Thermal uncertainty is becoming costlier as AI compute density increases. ASHRAE points to direct-to-chip cooling as an emerging standard for HPC, specifically highlighting warm-water architectures for high-density setups. Concurrently, the USA Department of Energy expects data-center electricity demand to sharply rise through 2028. This combination means cooling efficiency and uptime are now weighted equally with power availability in capital investment decisions. Simply adopting liquid cooling does not trigger this spend; the catalyst is the need to release high-cost compute into production with a guaranteed thermal operating margin.

Integration and acceptance remain the primary constraints. Pumped two-phase systems rely on refrigerant phase changes and require sufficient mass flow to prevent cold-plate dry-out. The Open Compute Project (February 2025) also highlights pressure limits, material compatibility, service connections, and refrigerant handling as additional hurdles. Because responsibility spans server hardware, cooling equipment, facility water, and controls, even technically sound projects can face delays if ownership is vague or field capabilities are lacking.

Treating commissioning as an ongoing part of thermal architecture optimization-rather than a one-time checklist-represents a major service opportunity. Warm-water loops can efficiently support dry coolers and reduce reliance on chillers. Furthermore, retrofitting brownfield data centers introduces two-phase cooling via designs that reject heat to existing facility water or assisted-air systems. Thermal simulation, seasonal heat-rejection testing, controls tuning, and baseline maintenance all create robust avenues for sustained project revenue.

Which country CAGRs are profiled in the Two-Phase Direct-to-Chip Commissioning Services Market?

Country	CAGR
USA	12.9%
South Korea	13.8%
Japan	13.5%
Saudi Arabia	14.1%
UAE	13.2%
France	12.5%

How do country-level CAGRs compare in the Two-Phase Direct-to-Chip Commissioning Services Market?

Across the six profiled countries, the CAGR ranges by only 1.6 percentage points, stretching from 14.1% in Saudi Arabia down to 12.5% in France. Saudi Arabia and South Korea lead the pack, closely followed by Japan, while the UAE sits slightly above the USA and France. Because this spread is relatively narrow, on-the-ground implementation conditions are a more vital metric than a simple growth ranking.

• Saudi Arabia is 0.3 percentage points above South Korea; with such a slim gap, project priorities will rely heavily on local delivery capabilities and heat-rejection designs rather than headline growth figures.
• South Korea is 0.3 percentage points ahead of Japan. Korea's policy-driven GPU expansion prioritizes rapid infrastructure readiness, whereas Japan focuses on highly controlled qualification and stable supply for its funded compute projects.
• Japan is 0.3 percentage points above the UAE. Japan follows a deeply structured domestic-compute path, whereas the UAE’s phased hyperscale projects generate continuous, repeated commissioning packages as new capacity comes online.
• The UAE is 0.3 percentage points above the USA, which is in turn 0.4 points above France. Although these are lower-growth markets percentage-wise, they still support massive absolute service pools, as the CAGR does not reflect the vast size of their existing installed bases.

Country-wise Analysis

• Hyperscale and colocation operators are increasingly treating cooling as a core component of the power-capacity challenge. With data centers projected by the DOE to consume up to 12.0% of USA electricity by 2028, power constraints drastically raise the cost of underperforming thermal infrastructure. Commissioning must connect full-load acceptance with energy performance and secondary-loop controls to ensure GPU capacity releases without excess non-IT load.
• AI compute acquisition is rapidly accelerating through public policy aimed at mitigating power and site constraints. In February 2025, the Ministry of Science and ICT targeted 18,000 advanced GPUs by mid-2026, outlining support for power supply and citing Power System Impact Assessments for data centers outside Seoul. Local engineering resources and staged acceptance plans are essential to align cooling startups with facility approvals.
• Domestic computational resources are viewed as strategically imperative under Japan's policy frameworks. METI approved up to JPY 72.5 billion in April 2024 for projects aimed at improving AI computational resources. The local market constraint is controlled infrastructure qualification rather than a lack of demand, meaning service providers must supply meticulous design documentation and repeatable acceptance records.
• Rapid data-center expansion demands thermal systems capable of reliable commissioning in high-ambient conditions. In April 2025, the Ministry of Communications and Information Technology reported a 42% capacity increase to 290.5 MW during 2023. Dry-cooler or hybrid commissioning expertise, seasonal performance testing, and localized service coverage are critical to support these phased additions.
• Hyperscale capacity in the UAE is being built in phases, allowing operators to standardize commissioning across successive data halls. In April 2025, an AED 2 billion hyperscale project was announced by the Dubai Media Office, developed by du with Microsoft as the primary tenant. The primary challenge here is maintaining consistent thermal acceptance as capacities and workloads scale up over time.
• France is developing massive data-center capacity in tandem with AI infrastructure investments. In May 2026, SoftBank Group Corp. committed to developing 3.1 GW of AI data center capacity in France in an initial phase, with a broader programme targeting up to 5 GW, announced at the Choose France summit hosted by President Macron. Service suppliers must provide commissioning teams that can seamlessly scale across massive projects and effectively validate warm-water heat rejection at the system level.

Who are the notable companies in the Two-Phase Direct-to-Chip Commissioning Services Market?

Competition is largely divided by who owns the thermal architecture versus who can successfully support it in the field.

Competitive Benchmarking: Two-Phase Direct-to-Chip Commissioning Services Market

Company	Two-Phase D2C Integration	Commissioning & Lifecycle Services	Fluid-Network & Secondary-Loop Support	Geographic Reach
Accelsius	High	High	Medium	North America and Europe with partner-led field support
Vertiv	Medium	High	High	More than 130 countries through a global service network
Parker Hannifin	Medium	Unscored	High	Global engineering and commercial network
ZutaCore	High	High	Medium	Americas, Europe, and Asia through direct and partner deployments

Key Developments in the Two-Phase Direct-to-Chip Commissioning Services Market

• March 2026, Accelsius, introduced the NeuCool IR150 at NVIDIA GTC, an integrated rack combining a two-phase CDU with 42U of IT space and built-in liquid and vapor manifolds for up to 150 kW of cooling.
• In May 2026, Vertiv, expanded its EMEA portfolio with the CoolChip CDU 2300 (2.3 MW liquid-to-liquid cooling) and CoolChip Fluid Network Row Manifolds, paired with liquid-cooling services to widen their commissioning scope.

Key Players in the Two-Phase Direct-to-Chip Commissioning Services Market

• Integrated Two-Phase Platforms (Accelsius, ZutaCore): These companies pair proprietary two-phase direct-to-chip architectures with deployment, validation, and lifecycle support, meaning their commissioning closely tracks proprietary system behaviors.
• Lifecycle Infrastructure Services (Vertiv): Approaching from a broad critical-infrastructure base, Vertiv combines design support and installation with startup, commissioning, fluid management, and maintenance across secondary fluid networks and heat-rejection systems.
• Fluid-Network Instrumentation (Parker Hannifin): This firm supplies essential two-phase engineering knowledge and fluid-network technologies used for measurement and control, which are vital for commissioning teams relying on accurate sensing and compatible field components.

Two-Phase Direct-to-Chip Commissioning Services Market - Report Scope

Coverage Field	Report Scope
Market breakdown	Service Scope; Heat Rejection / Secondary Loop; Rack Density; Data Center Type; Route to Market; Region
Quantitative Units	Revenue USD Million and CAGR in %.
Market Definition	Revenue from professional and lifecycle services directly tied to two-phase direct-to-chip cooling deployments. Includes design, simulation, commissioning, balancing, reliability analysis, retrofit, and managed maintenance. (Excludes hardware sales, unrelated EPC construction, single-phase, and immersion services).
Regions Covered	North America; Latin America; Western Europe; Eastern Europe; East Asia; South Asia and Pacific; Middle East and Africa
Countries Covered	USA, South Korea, Japan, Saudi Arabia, UAE, France, and more than twenty-five additional countries
Key Companies	Accelsius; Vertiv; Parker Hannifin; ZutaCore
Forecast Period	2026 to 2036
Approach	Hybrid bottom-up and top-down sizing reconciling service revenue by deployment scope, thermal architecture, buyer type, and country.

Two-Phase Direct-to-Chip Commissioning Services Market - Research Methodology

Method	Approach
Primary Research	Structured discussions with cooling OEMs, data-center operators, engineering firms, and decision-makers to test service scope, purchase triggers, workflows, and deployment frictions without relying on unsupported counts.
Desk Research	Review of government announcements, standards (ASHRAE, OCP), technical white papers, company filings, and dated project/service announcements explaining two-phase thermal architectures and build conditions.
Market Sizing	Hybrid sizing starting with addressable deployments and applying the service revenue boundary, reconciling against adoption timing, rack density, facility architecture, and service delivery routes for 2026-2036.
Data Validation	Cross-checking values across service scope, architecture, country conditions, and evidence while strictly excluding adjacent hardware or unverified claims.

(Competitive positioning within the research is based on documented product capability, route-to-market strength, technical support, and recent market activity; it is a qualitative comparison, not a market-share ranking.)

Two-Phase Direct-to-Chip Commissioning Services Market by Segments

Two-Phase Direct-to-Chip Commissioning Services Market segmented by Service Scope:

• Commissioning / balancing
• Design & simulation
• Reliability & failure analysis
• Retrofit / conversion
• Managed maintenance

Two-Phase Direct-to-Chip Commissioning Services Market segmented by Heat Rejection / Secondary Loop:

• Dry coolers
• Chillers
• Cooling towers / evaporative
• Facility water loop / district interface
• Hybrid systems

Two-Phase Direct-to-Chip Commissioning Services Market segmented by Rack Density:

• 251-500 kW
• 100-250 kW
• Below 100 kW
• Above 500 kW

Two-Phase Direct-to-Chip Commissioning Services Market segmented by Data Center Type:

• Hyperscale AI
• Colocation AI
• Enterprise AI/HPC
• Research / sovereign compute

Two-Phase Direct-to-Chip Commissioning Services Market segmented by Route to Market:

• Cooling OEM direct
• MEP / EPC integrator
• Server / rack OEM bundle
• Service & retrofit channel

Two-Phase Direct-to-Chip Commissioning Services Market by Region

• North America
  • United States
  • Canada
• Latin America
  • Brazil
  • Mexico
  • Argentina
  • Chile
• Western Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Benelux
  • Nordics
• Eastern Europe
  • Poland
  • Czech Republic
  • Romania
  • Hungary
• East Asia
  • China
  • Japan
  • South Korea
• South Asia and Pacific
  • India
  • ASEAN
  • Australia and New Zealand
• Middle East and Africa
  • GCC Countries
  • South Africa
  • Türkiye
  • Israel

Research Sources and Bibliography

• USA Department of Energy (2024, December 20). DOE Releases New Report Evaluating Increase in Electricity Demand from Data Centers.
• ASHRAE (2026). Integrated Design Principles | AI Data Center Energy Performance Framework.
• Open Compute Project Foundation (2021, June 23). Open Compute Project Liquid Cooling Logistics and Integration White Paper, Revision 1.0.
• Open Compute Project Foundation (2025, February 14). Pumped 2P Refrigerant-Based Direct Liquid Cooling (DLC) White Paper.
• Vertiv (2025, February 11). Vertiv Announces Global Launch of Liquid Cooling Services Portfolio....
• Vertiv (2026, May 26). Vertiv Expands Liquid Cooling Portfolio in EMEA to Accelerate AI-Ready Data Centre Deployments.
• Accelsius (2025, March 12). Accelsius Introduces NeuGuard: An Enterprise-Grade Support Program....
• Accelsius (2026, March 16). Accelsius Makes NVIDIA GTC Debut with NeuCool IR150....
• Parker Hannifin (2026, July 23). Parker Launches the SCVOT2 Vortex Flow & Temperature Sensor....
• ZutaCore (2026, June 2). ZutaCore Announces $100M+ Series C Momentum....
• Ministry of Science and ICT, Republic of Korea (2025, February 20). Korea to Expand AI Computing Infrastructure....
• Ministry of Economy, Trade and Industry, Japan (2024, April 19). Approval of Plans for Ensuring a Stable Supply of Cloud Programs....
• Ministry of Communications and Information Technology, Saudi Arabia (2025, April 27). Saudi Arabia’s Digital Economy: A New Era....
• Government of Dubai Media Office (2025, April 22). Hamdan bin Mohammed Witnesses Announcement of AED2 Billion Hyperscale Data Centre.

The bibliography is included as a reader reference and is not exhaustive. The complete source list is contained in the full report.

This Report Answers

• What are the 2026 and 2036 values for the Two-Phase Direct-to-Chip Commissioning Services Market?
• Which AI infrastructure and thermal-management pressures support demand for commissioning and lifecycle services?
• Why does Commissioning / balancing hold the leading position within Service Scope?
• How does the leadership of Dry coolers shape secondary-loop commissioning demand?
• Why does the 251-500 kW class lead the Rack Density segmentation?
• How do growth rates differ across the USA, South Korea, Japan, Saudi Arabia, UAE, and France?
• How do Accelsius, Vertiv, Parker Hannifin, and ZutaCore participate across system integration and service roles?
• Which interoperability, validation, field-skill, and retrofit constraints can slow adoption?