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Future Market Insights

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Molded Underfill Material Market Outlook (2022-2032)

The global molded underfill material market is slated to touch a market value of US$ 8 Billion in 2022, and is expected to register a value CAGR of 5% until 2032. As per Future Market Insights, molded underfill material market demand is likely to be valued at US$ 13.03 Billion by the end of the 2022-2032 assessment period.

Data Points Key Statistics
Expected Market Value in 2022 US$ 8 Billion
Projected Market Value in 2032 US$ 13.03 Billion
Growth Rate (2022 to 2032) 5% CAGR

The semiconductor industry is gaining traction across different end user sectors due to its multi-purpose products. This had led to the development of essential packaging required for semiconductor products. Thus, molded underfill materials are used on a large scale for packaging of semiconductor products.

In addition, the penetration of electrical devices is increasing the usage of molded underfill materials. As packaging has become an essential component, the reliance on the same has increased over time.

Molded underfill materials are being used owing to their low cost material as well as excellent reliability for different electrical applications. Moreover, the advancements in flip chips are leading to increasing use of molded underfill materials. The sizes of electrical applications are changing on a large scale.

This has led to innovation in packaging and changing the way molded underfill materials are used. As electrical applications require special type of packaging, the use of molded underfilled materials is largely favoring market for semiconductors and electrical appliances

Future Market Insights states that the various advantages attached to molded underfill are gaining traction for the same.

  • Dependency of flip chip packages on molded underfill materials is contributing to market growth.
  • Efficient packaging of small size electrical devices
  • Innovation in electrical devices is changing the use of molded materials and maximizing the use of the same

The penetration of Internet of Things and various devices is increasing the demand for molded underfill material. In the upcoming years, the demand for smaller electrical devices is expected to increase. This, in turn, will create lucrative opportunities for molded underfill materials for electrical device packaging. Furthermore, regions such as North America, Europe and Asia Pacific are increasing the demand for smart and advanced packaging.

Media and automotive industry too are increasingly adopting molded underfill materials for various purposes. Future Market Insights states that various industries are planning to integrate electrical devices in their existing models. This will increase the usage of molded underfill materials.

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Molded Underfill Material Market Overview

Underfill materials are compound formulations of inorganic fillers and organic polymers which are applicable in semiconductor packaging to attain enhanced thermo mechanical enactment. Molded underfill material are mold materials used as over mold compounds in wire bonded or flip chip CSP devices.

Flip chip is a major application for molded underfill material. The growing demand for smaller, lighter, efficient, and cost effective devices has tensed notable consideration towards the molded underfill material. Further, molded underfill is a most significant techniques that is used for the application of underfill materials.

Due to increasing price from end use industry, molded underfill material relatively cost effective technique and being a conventional process technique.

Molded Underfill Material Market: Drivers & Restraints

The major factors which are boosting the growth of molded underfill material market are increasing use of molded underfill material in flip chip packages. The prominent trends from consumer side are driving the global molded underfill material market growth. The growing demand for high performing, low cost, small size devices is a key driving factors for global molded underfill material market growth.

Moreover, high usage of molded underfill material from wafer level packaging and flip chip packaging due rising demand in tablets and smart phones is a prominent driving factor for global molded underfill material market demand over the forecast period.

Further, advancement and up-gradation in technology for molded underfill material market is directly effect by the innovation and coming advancements in electronic industry. In addition, few molded underfill material manufacturers in the market are offering molded underfill material products with lead free solder paste.

The global underfill material, a parent market for the global molded underfill material market is growing rapidly to continually expand at high CAGR in coming years. Global flip chip market is accounting high growth and is estimated to register significant growth in coming years which in turn increasing the growth of molded underfill material market.

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Ismail Sutaria

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Molded Underfill Material Market: Regional Outlook

Regarding geography, molded underfill material market has been categorized into seven key regions including North America, Western Europe, Eastern Europe, APEJ, Japan, Latin America, and the Middle East & Africa.

Molded underfill material market is expected to register healthy CAGR during the forecast period due to high demand of molded underfill material in wide range of application such as flip chips, ball grid array (BGA), and chip scale packaging (CSP) across the region.

In terms of regions, North America accounts for significant share for molded underfill material market, owing to the high demand from smart and advanced packaging in the region as related to other developed regions.

In terms of developing region of Asia-Pacific, the growth of the molded underfill material is comparatively high and with high CAGR in forecast period owed to factors such as such as globalization, rapid economic development, and increasing demand of the molded underfill material in packaging industry and its sub-verticals, and high usage of the molded underfill material in media and automotive industry.

In addition, Over the forecast period, Asia-Pacific market for is anticipated to grow significantly owing to the growth of packaging industry in the region. Overall, the global market for molded underfill material is expected to grow significantly by the end of forecast period.

Molded underfill material market for Asia Pacific is also expected to witness rapid growth during the forecast period primarily attributed to the growth of smart packaging market and increasing usage of molded underfill material in different industry verticals, especially in China and India. The molded underfill material market is growing at faster rate and is expected to grow at high CAGR in forecasted years.

Molded Underfill Material Market: Few Players

Few players identified in molded underfill material market are:-

  • Henkel
  • Won Chemicals Co. Ltd.
  • Epoxy Technology Inc.
  • AIM solder
  • Namics Corporation
  • Others 

The research report presents a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, and statistically supported and industry-validated market data. It also contains projections using a suitable set of assumptions and methodologies. The research report provides analysis and information according to categories such as market segments, geographies, type of product and applications.

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The report covers exhaust analysis on

  • Market Segments
  • Market Dynamics
  • Market Size
  • Supply & Demand
  • Current Trends/Issues/Challenges
  • Competition & Companies involved
  • Technology
  • Value Chain

The regional analysis includes

  • North America (U.S., Canada)
  • Latin America (Mexico. Brazil)
  • Western Europe (Germany, Italy, France, U.K, Spain)
  • Eastern Europe (Poland, Russia)
  • Asia-Pacific (China, India, ASEAN, Australia & New Zealand)
  • Japan
  • The Middle East and Africa (GCC Countries, S. Africa, Northern Africa)

The report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macro-economic indicators and governing factors along with market attractiveness as per segments. The report also maps the qualitative impact of various market factors on market segments and geographies.

Molded Underfill Material Market: Market Segmentation

The molded underfill material market is segmented into three parts based on technology types, application types, and geography.

Based on the technology type application molded underfill material market is segmented into:

  • Differential Scanning Calorimeter (DSC)
  • Thermo-gravimetrical Analyzer (TGA)
  • Thermal Mechanical Analyzer (TMA)
  • Coefficient of Thermal Expansion (CTE)
  • Dynamic Mechanic Analyzer (DMA)
  • Others

Based on the application molded underfill material market is segmented into:

  • Flip chips
  • Ball grid array (BGA)
  • Chip scale packaging (CSP)



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