Rising microelectronics & semiconductor landscape is creating a trend of integrated circuits (ICs) that are vertically stacked, which is becoming a profitable solution for increased functionality, providing elevated performance, and decreasing power consumption to meet the electronic device’s requirement.
These ICs are witnessing tremendous demand by the medical, aerospace, military and consumer electronics sector. This helps in fulfilling the requirements of integrating disparate technologies, which includes the memory, logic, RF, and sensors in small forms for industrial applications.
The semiconductor industry is witnessing the emergence of 3D packaging trend using through-silicon vias (TSVs) technology. Emerging trend is driven by the need to reduce timing delays and enhancing the performance.
High aspect ratio, low cost, and formation & fillings technologies are necessary for today’s semiconductor industry. With an increase in functional integration requirements, water and assembly fabrication organizations are looking for 3D TSV technology.
Propagation of IoT-based devices and mounting awareness for energy efficient is triggering numerous manufacturing companies to innovate and improve their products by adopting 3D integrated products.
3D ICs are advanced technology which supports in designing and developing latest consumer goods by decreasing the size of components used in these devices. In addition to this, they provide better speed, efficiency, memory, and durability to these upcoming devices. Resultantly, 3D ICs are gaining popularity in several industries, thereby leading to a drastic increase in demand globally.
Owing to Covid-19 pandemic outbreak, many industries are witnessing significant shift in their business. The ongoing COVID-19 pandemic has adversely affected semiconductor industry in many countries due to lockdown imposed by governments to stop the spread of novel coronavirus.
Whereas increased demand for displays in the medical equipment is expected to fuel the demand of 3D ICs till the time coronavirus is not properly cured. In addition, increasing demand for respirators and ventilators is anticipated increase the growth of the 3D ICs market. Due to these factors would drive the 3D ICs market by 1.3X during Q3-Q4 2020. Thus the market is expected to grow at a steady rate amid this pandemic situation.
Increase in Demand for Consumer Electronics Thrive Market Growth
Rise in demand for compact and high-performance ICs in computers, laptops, tablets, mobile phone and all other consumer electronic products is expected to increase the demand for 3D ICs.
These are among the major factors encouraging the growth of the market. Better performance and higher band width, which is a mandatory aspect in manufacturing of energy efficient devices such as 3D LEDs
Growing R&D investments coupled with strategic partnerships amid the market players is anticipated to increase the applications of these 3D ICs. For instance, in August 2020, Samsung Electronics launched silicon-proven 3D IC packaging technology- eXtended-Cube (X-Cube) for next-gen high performance applications such as artificial intelligence AI, 5G, virtual reality (VR), augmented reality (AR), and wearable devices.
The development leverages TSV technology that enables significant leaps in data transfer power and speed efficiency in order to meet the growing performance demand for advanced applications.
Moreover, this technology is a major component in trending smart devices, owing to this 3D ICs market is expected to grow rapidly.
High Cost of 3D ICs Limits Growth of the Market
The 3D stack presents major technical and manufacturing challenges that include yield standardized IC interface, testability and scalability. Along with thermal management, industrial wafer to wafer bonding tools, mid-process examination tools, and lack of appropriate design and simulation tools are some of the key challenges affecting the mass production of 3D ICs.
Thus, due to the lack of such cost of production if the end-product (chip) turns out to be defective. This factor creates difficulty in economies of scale to realize along with restricting mass production. As a result, these dynamics are poised to restrain the growth of the 3D ICs market around the globe during the forecast period
Examples of some of the market participants in the global 3D ICs market identified across the value chain include
APAC accords the major share in the global 3D ICs market. The growth of the market is attributed to the rise in the demand for advanced architecture in the electronic products. This factor is expected to enhance the development of the global 3D ICs market in the region over the forecast period. On the other hand, North America is expected to grow rapidly due to the surge in demand for ICs in the major countries such as the U.S and Canada.
The 3D ICs market report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, and inputs from industry experts and industry participants across the value chain.
The report provides in-depth analysis of parent market trends, macro-economic indicators, and governing factors, along with market attractiveness as per segment. The market report also maps the qualitative impact of various market factors on market segments and geographies.
The 3D ICs market can be segmented on the basis of product type, substrate type, application, industry verticals and region.
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