Temporary Bonding Adhesives Market

Temporary Bonding Adhesives Market : Global Industry Analysis 2013 - 2017 and Opportunity Assessment; 2018 - 2028

  • Ongoing
  • March 2020
  • REP-GB-7468
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Temporary Bonding Adhesives Market
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This Temporary Bonding Adhesives market study offers a comprehensive analysis of the business models, key strategies, and respective market shares of some of the most prominent players in this landscape. Along with an in-depth commentary on the key influencing factors, market statistics in terms of revenues, segment-wise data, region-wise data, and country-wise data are offered in the full study. This study is one of the most comprehensive documentation that captures all the facets of the evolving Temporary Bonding Adhesives market.


Temporary Bonding Adhesives Market: Definition and Introduction

Temporary Bonding Adhesives are materials that create a reversible adhesive bond between two surfaces. This bond can be removed (known as deboning) after a set period of time, thus making it temporary in nature. Apart from applications in the industrial sector, temporary bonding adhesives are widely used for temporary bonding of a thin wafer and carrier material in semiconductor manufacturing. Thin wafers used in semiconductor packages are extremely fragile in nature and prone to damages during manufacturing processes. Temporary Bonding Adhesives provide adhesion between thin wafers and a slightly rigid wafer carrier, thereby providing support to the thin wafer and thus, protecting it from breakage, folding or warping during rigorous manufacturing processes. Temporary Bonding Adhesives are manufactured using a variety of chemical compositions, depending on the application they are being designed for and the types of manufacturing processes the semiconductor wafers are expected to go through. Temporary Bonding Adhesives are generally made from materials, such as low temperature waxes, oligomers and polymers of hydrocarbon origin, high temperature thermoplastics and others. Temporary bonding adhesives are expected to not only provide highly reliable adhesion between bonded surfaces, but also withstand difficult manufacturing conditions, such as electroplating, etching, etc. Temporary bonding adhesives should also demonstrate resistance to corrosion and other chemical extremities. Temporary bonding adhesives should also offer ease of application, uniform coating across surfaces, good adhesion to different materials and stability in fluctuating temperature ranges. Similarly, temporary bonding adhesives must also be able to de-bond, without causing damage to either of the two materials and without leaving any remnants on the surfaces. Temporary Bonding Adhesives, thus, essentially make an efficient support system during manufacturing processes.    

Market Growth Analysis

Disclaimer: This data is only a representation. Actual data may vary and will be available in the report.

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Temporary Bonding Adhesives Market: Segmentation

Temporary Bonding Adhesives Market: Dynamics

Growing demand for Temporary Bonding Adhesives is being witnessed as these systems provide effective protection to thin wafers in semiconductor and electronic devices manufacturing. Wafer thinning is gaining increasing application in device manufacturing as the demand grows owing to various benefits, such as heat dissipation, lower electrical resistance, ability of three-dimensional stacking and flexibility of substrate. Temporary bonding adhesives have become a critical requirement given the delicate nature of thin wafers and the importance of their fragile handling. The advancement in materials technology is leading to development of high quality temporary bonding adhesives, which are not only reliably doing their job, but also helping increase manufacturing throughput and improve overall efficiency. All of these benefits, combined with growing end use industry demand will drive growth of the Temporary Bonding Adhesives market.   

Temporary Bonding Adhesives Market: Regional Outlook

The demand for Temporary Bonding Adhesives is set to grow at a fast pace in the next five to ten years as the demand for manufacturing of high performance as well as increasingly small and compact electronic devices is expected to grow too. The Asia Pacific region is expected to be a remarkable market for temporary bonding adhesives as it is witnessing rapidly increasing consumer demand for electronic devices. The region has been continuously clocking highest annual smartphone sales in the world and is also home to some of the world’s largest semiconductor device fabrication units. North America is also a large market for Temporary Bonding Adhesives due to its large-scale semiconductor manufacturing industry, high demand for consumer electronic devices and presence of industry leading suppliers of temporary bonding adhesives. China, India, Japan, US, UK and Germany are some of the key countries to watch for in the Temporary Bonding Adhesives market.

Temporary Bonding Adhesives Market: Market Participants

The research report presents a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, and statistically supported and industry-validated market data. It also contains projections using a suitable set of assumptions and methodologies. The research report provides analysis and information according to market segments such as geographies, application, and industry.

The report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macro-economic indicators and governing factors along with market attractiveness as per segments. The report also maps the qualitative impact of various market factors on market segments and geographies.

NOTE - All statements of fact, opinion, or analysis expressed in reports are those of the respective analysts. They do not necessarily reflect formal positions or views of Future Market Insights

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On the basis of material type, the Temporary Bonding Adhesives market can be segmented into:

  • Wax
  • Silicones
  • Thermoplastics
  • Modified Epoxy
  • Others

On the basis of application, the Temporary Bonding Adhesives market can be segmented into:

  • Semiconductor
    • 3D Integrated Circuits
    • CMOS Image Sensors
    • Light-emitting Diodes (LED)
    • Memory and Logic Chips
    • Others
  • Manufacturing
  • Other Industrial

Examples of some of the market participants identified across the value chain of Temporary Bonding Adhesives market are:

  • 3M Company
  • Henkel Corporation
  • AI Technology, Inc
  • SUSS MicroTec
  • Brewer Science, Inc.
  • Dow Chemical Company
  • Thin Materials AG
  • I. du Pont de Nemours and Company (DuPont)
  • Nitto Denko
  • Valtech Corporation

The report covers exhaustive analysis on:

  • Market Segments
  • Market Dynamics
  • Market Size
  • Supply & Demand
  • Current Trends/Issues/Challenges
  • Competition & Companies involved
  • Technology
  • Value Chain

Regional analysis includes:

  • North America (U.S., Canada)
  • Latin America (Mexico, Brazil)
  • Western Europe (Germany, Italy, France, U.K, Spain)
  • Eastern Europe (Poland, Russia)
  • Asia Pacific (China, India, ASEAN, Australia & New Zealand)
  • Japan
  • Middle East and Africa (GCC Countries, S. Africa, Northern Africa)

Report Highlights:

  • Detailed overview of parent market
  • Changing market dynamics in the industry
  • In-depth market segmentation
  • Historical, current, and projected market size in terms of volume and value
  • Recent industry trends and developments
  • Competitive landscape
  • Strategies of key players and products offered
  • Potential and niche segments, geographical regions exhibiting promising growth
  • A neutral perspective on market performance
  • Must-have information for market players to sustain and enhance their market footprint
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Harish Tiwari

Harish Tiwari

Global Head - Business Development

Pranay Mhaisekar

Pranay Mhaisekar

Business Development

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