Epoxy Encapsulation Material Market

Epoxy Encapsulation Material Market: Global Industry Analysis 2013 - 2017 and Opportunity Assessment; 2018 - 2028

  • Ongoing
  • May 2020
  • REP-GB-9373
Epoxy Encapsulation Material Market

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This Epoxy Encapsulation Material market study offers a comprehensive analysis of the business models, key strategies, and respective market shares of some of the most prominent players in this landscape. Along with an in-depth commentary on the key influencing factors, market statistics in terms of revenues, segment-wise data, region-wise data, and country-wise data are offered in the full study. This study is one of the most comprehensive documentation that captures all the facets of the evolving Epoxy Encapsulation Material market.

Epoxy encapsulation material is an epoxy resin used as a semiconductor encapsulate. It finds applications in numerous products where semiconductors are used and employed, such as consumer home appliances, including refrigerators, television sets, vehicles and mobile phones, among others. With major economies moving towards digitalization, developments are being witnessed in the field of IT infrastructure. To match this progress, development of electronic products is picking pace, thereby creating demand for epoxy capsulation materials.

Epoxy Encapsulation is the method of fabricating electronic components with the help of epoxy encapsulation material i.e. epoxy resin, to enhance the physical properties of the electronic material used. In the commercial market-place, numerous resins or materials are available for the encapsulation process. Of this, the epoxy encapsulation material is the most adopted one. As the demand for mechanical safeguarding of electrical components, such as insulated PCBs (Printed circuit boards), continues to grow, manufacturers and suppliers are seeking effective solutions for encapsulation of electronic devices and thus, epoxy encapsulation materials are gaining traction. Also, substantial environmental challenges, such as vibration, moisture, general contamination and thermal or physical shock, have the ability to negatively affect the working of printed circuit boards and electronic components. Growing demand for shielding printed circuit boards has created demand-space for epoxy encapsulation materials globally. Application of epoxy encapsulation material protects the entire device from extreme atmospheric conditions through the formation of a widespread barrier.

Market Growth Analysis

Disclaimer: This data is only a representation. Actual data may vary and will be available in the report.

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Epoxy encapsulation material Market: Dynamics

In the past few years, the demand for epoxy encapsulation materials for semiconductor encapsulation has been quite high and with developments and innovations being witnessed in the semiconductor industry, the demand for epoxy encapsulation materials will remain high in the coming years. With prompt expansion in the semiconductor industry, need for PCBs in domestic, military, industrial and automotive products continues to increase. Mounting need to confirm the reliability of critical devices has molded the manufacturers to go for superior shielding solutions, such as epoxy encapsulation materials. Moreover, a rising number of possible requirements in the space of the LED products will further be expected to rev up the need for epoxy encapsulation material in the electronics industry. However, the special screening process for epoxy encapsulation material increases the overall cost, which is a major stumbling block in the full-scale adoption of epoxy encapsulation materials. 

Epoxy encapsulation material Market: Regional Trends

Countries present in the eastern part of the globe are pegged to be prominent countries in the epoxy encapsulation material market in terms of sales and consumption. China, ASEAN, South Korea and India are rapidly adopting novel technologies in electronic fabrication industry, which is creating substantial demand space for epoxy encapsulation materials.

Developed regions, which include the United States and Western Europe, are considered to be matured regions in the global epoxy encapsulation material market. Countries in Western Europe & North America provide a substantial base for electronic component manufacturing and will exhibit substantial consumption potential for epoxy encapsulation materials. Currently, LA, MEA & Eastern European regions are witnessing low consumption of epoxy encapsulation material. However, they are anticipated to develop as high growth avenues during the latter half of the assessment period. Moreover, these regions are seen as key production hubs for epoxy encapsulation materials because of low-interest rates & labor cost in the region.

Epoxy encapsulation material Market: Market Participants

Some of the market participants identified across the value of the global epoxy encapsulation material market chain are:

  • Sumitomo Bakelite
  • Hysol Huawei Electronics
  • Hexion
  • Shin-Etsu Chemical
  • Hitachi Chemical
  • Chang Chun Group
  • Eternal Materials
  • Tianjin Kaihua Insulating Material
  • Jiangsu zhongpeng new material 

The report covers exhaustive analysis on:

  • Epoxy encapsulation material Market Segments
  • Epoxy encapsulation material Market Dynamics
  • Epoxy encapsulation material Market Size
  • Current Trends/Issues/Challenges pertaining to Market
  • Competition & Companies involved in Epoxy encapsulation material Market
  • Technology related to Market
  • Value Chain associated to Epoxy encapsulation material Market

Regional analysis includes:

  • North America (U.S., Canada)
  • Latin America (Mexico, Brazil)
  • Western Europe (Germany, Italy, France, U.K, Spain)
  • Eastern Europe (Poland, Russia)
  • China
  • India
  • SEAP ( India, ASEAN, Australia & New Zealand)
  • Japan
  • Middle East and Africa (GCC Countries, S. Africa, Northern Africa)

The Epoxy encapsulation material Market report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macro-economic indicators and governing factors along with market attractiveness as per segments. The report also maps the qualitative impact of various market factors on Epoxy encapsulation material market segments and geographies.

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Epoxy encapsulation material Market: Segmentation

On the basis of type, the epoxy encapsulation material market has been segmented as:

  • Normal epoxy encapsulation material
  • Green epoxy encapsulation material

On the basis of grade, the epoxy encapsulation material market has been segmented as:

  • Standard grade epoxy encapsulation material
  • High thermal conductivity grade epoxy encapsulation material
  • Low stress grade epoxy encapsulation material
  • Conditioning wax grade epoxy encapsulation material

On the basis of application, the epoxy encapsulation material market has been segmented as:

  • Semiconductor Encapsulation
  • Electronic Components
  • Printed Circuit Boards
  • Prepags
  • Copper Clad Laminates

On the basis of end-use, the epoxy encapsulation material market has been segmented as:

  • Electronics & Electrical Component
  • Automotive component
  • Telecommunication Component
  • Others

Report Highlights:

  • Detailed overview of parent market
  • Changing Market dynamics in the industry
  • In-depth Market segmentation
  • Historical, current, and projected market size in terms of volume and value of market
  • Recent industry trends and developments in the market
  • Competitive landscape of the market
  • Strategies of key players and products offered in Epoxy encapsulation material market
  • Potential and niche segments, geographical regions exhibiting promising growth
  • A neutral perspective on market performance
  • Must-have information for market players to sustain and enhance their market footprint
Frequently Asked Questions

What research methodology is used to develop the Epoxy Encapsulation Material Market report?
  • FMI utilizes three branched methods to derive market measurements used to compile any report study (data derivation, triangulation and validation).
  • These approaches include accumulating data from both primary and secondary sources
  • Primary research involves interviews with industry operators and FMI's network of contacts spanning the world's value chain of the Epoxy Encapsulation Material Market. This is supported by a comprehensive literature analysis of information gathered through secondary sources
  • Analysis of several middle market stakeholders for country-wise data

In addition to up-to-date market figures and customized of the Epoxy Encapsulation Material Market, FMI offer consulting services to help businesses within industry navigate challenges and take well-informed decisions amidst the breakneck competition.

  • Most of the competitors are segregated according to their market share in 'Tier' wise statures.
  • Global market participants are scrutinized and global competition metrics are included with numerous competitor profiles referring to their business background and go-to market strategies.
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Harish Tiwari

Harish Tiwari

Global Head - Business Development

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