Wafer Level Packaging Market

Wafer Level Packaging Market: Global Industry Analysis and Opportunity Assessment 2016-2026

  • Ongoing
  • January 2020
  • REP-GB-2220
  • PDF PPT EXCEL
Wafer Level Packaging Market
  • SELECT LICENSE TYPE :

  • US$5,000
  • US$7,500
  • US$10,000

This Wafer Level Packaging market study offers a comprehensive analysis of the business models, key strategies, and respective market shares of some of the most prominent players in this landscape. Along with an in-depth commentary on the key influencing factors, market statistics in terms of revenues, segment-wise data, region-wise data, and country-wise data are offered in the full study. This study is one of the most comprehensive documentation that captures all the facets of the evolving Wafer Level Packaging market.


Packaging industry has made strides in terms of design incorporating functionality into the mix. Innovations in packaging have become key to keeping up with the changing needs of the consumers as well as the manufacturers. Packaging has encompassed almost all the industries in the world and they have individually experienced a shift in their packaging designs. One of the most interesting industries to incorporate packaging innovation into their operations is the semiconductor and technology industry.

Semiconductor and technology industry utilizes packaging not only in the overall packaging of the product, but also during the manufacturing of the product on the shop floor. One of these techniques is the wafer based packaging. Wafer based package being the same size as the die allows the wafer fabrication, packaging, testing and the burn-in during the manufacturing process till the shipment.

Market Growth Analysis

Disclaimer: This data is only a representation. Actual data may vary and will be available in the report.

Need granular data and specific insights that are hard to get?
Wafer level packaging Market- Market Segmentation:

Wafer level packaging Market- Market Dynamics:

With the rise in the demand for smaller and faster consumer electronics, we can expect the wafer level packaging market to experience a positive impact. Wafer level packaging allows for greater flexibility and integration providing a small, thin package giving us an active interposer. By decreasing the die size and increasing the wafer size, wafer level packaging is more cost effective compared to the conventional method of production of integrated circuits. With the rising demand for longer battery life and smaller designs in smart phones, we will find wafer level packaging to perfectly fit the bill. The open source appropriate technology allows for collaboration among different players in the market to produce a superior product that will keep redefining the technology and semiconductor sector. The wide use of wafer level packaging in radar technology has allowed it to become an essential art in the self-driving cars. Also, the healthcare medical devices sector and wearable devices market will heavily utilize wafer level packaging market. The boost in these sectors will positively impact the wafer level packaging market. The wafer level packaging is prone to chipping during the process of production and shipping.

Wafer level packaging Market- Regional Outlook:

In terms of geography, the wafer level packagingmarket has been divided in to five key regions; North America, Latin America, Europe, Asia-Pacific and Middle East & Africa. The wafer level packaging market is expected to exhibit an above average CAGR during the forecast period. Asia Pacific region will continue to show a rise in demand for wafer level packaging due to the rising disposable incomes in the market. The growing adoption of smartphones in India will permit the wafer level packagingmarket to experience a tumultuous rise in demand. The production of wafer level packagingwill be focused more in the APEJ region.

Wafer level packaging Market- Major Players:

Some of the key players in the wafer level packaging market are Jiangsu Changjiang Electronics Technology Co. Ltd., Infineon Technologies AG, KLA-Tencor Corration, China Wafer Level CSP Co. Ltd., Marvell Technology Group Ltd., Siliconware Precision Industries, Deca Technologies, Nanium SA, STATS ChipPAC Ltd.

The research report presents a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, and statistically supported and industry-validated market data. It also contains projections done using a suitable set of assumptions and methodologies. The research report provides analysis and information according to categories such as market segments, geographies, type, machine size and end use.

The report is a compilation of first-hand information, qualitative, and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macro-economic indicators and governing factors along with market attractiveness as per segments. The report also maps the qualitative impact of various market factors on market segments and geographies.

NOTE - All statements of fact, opinion, or analysis expressed in reports are those of the respective analysts. They do not necessarily reflect formal positions or views of Future Market Insights.

Unique Requirements? Customize this Report

  • Customize by Region, Country, Application, Product, & other segments
  • Integrate our Insights with your Existing Data
  • Determine the scope of the study to suit your requirements

Let FMI Help You!

  • Gain Insights on Key Wafer Level Packaging Market Impacting Forces
  • Know the Winning Strategies of Market Leaders
  • Get Deep-Dive Analysis on Each Segment
  • Identify the Sources that will Drive Top-Line Revenue

Based on the end use, the wafer level packaging market is segmented into:

  • Mobile and wireless communications
  • Internet of things
  • Automotive
  • Consumer electronics
  • Aerospace
  • Healthcare

Based on the type, the wafer level packaging market is segmented into:

  • Fan-Out Wafer Level Package
  • Fan-in Wafer Level Package
  • Fan-in Wafer Level Chip Scale Package
  • flip chip
  • 3DFOWLP

The report covers exhaustive analysis on:

  • Market Segments
  • Market Dynamics
  • Market Size
  • Supply & Demand
  • Current Trends/Issues/Challenges
  • Competition & Companies involved
  • Technology
  • Value Chain

Regional analysis includes

  • North America
  • Latin America
  • Europe
  • Asia Pacific
  • Middle East and Africa

Report Highlights:

  • Detailed overview of parent market
  • Changing market dynamics in the industry
  • In-depth market segmentation
  • Historical, current and projected market size in terms of volume and value
  • Recent industry trends and developments
  • Competitive landscape
  • Strategies of key players and products offered
  • Potential and niche segments, geographical regions exhibiting promising growth
  • A neutral perspective on market performance
  • Must-have information for market players to sustain and enhance their market footprint
Get in touch
Akshay Godge

Akshay Godge

Client Partner - Global Business Development

Pranay Mhaisekar

Pranay Mhaisekar

Business Development

* indicates mandatory fields
Request Sample Request customization Request Methodology