The ball grid array packaging industry continues to expand as the demand for high-performance denser type compact packaging continues to rise. Electronic devices such as smartwatches, smartphones, and TVs are the most significant factor that augments the ball grid array packaging market growth.
As per the analysis, increasing inclusion of IoT in packaged electronic equipment like MEMS sensors, gyroscopes, and pressure sensors to meet the demand for smart automotive solutions is likely to benefit the market and augment the market size in the forecast period.
Ongoing development in R&D activities related to electronic gadgets favored by a broad range of functions of low-cost multiple microchips connector in integrated circuits, electronic circuits is likely to carve out new paths for the ball grid array (BGA) packaging sector.
Expanding application of ball grid array packages in the automotive and industrial sectors is likely to offer remunerative opportunities to the market. It is used in the automotive sector for high-pin-count equipment as well as in combination with Flip chip (FC) technology to boost direct and short device-to-substrate connections.
The market is augmenting at a rapid pace owing to its low cost, denser type of packing, and also higher performance. The rising demand for diverse and smaller size packaging from electronic OEMs expands the ball grid array packaging market. Further, the growing semiconductor and IC chip industry is another salient factor strengthening the BGA market in the forecast period.
The survey highlights various benefits of ball grid array packaging as follows:
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Surface mount technology also called as SMT is a technique of mounting electronic components on the surface of printed circuit boards. Ball Grid Array also called as BGA is one of the types of surface mount packaging. BGA are more convenient and robust type of packages compared to the conventional packaging such as quad flat packaging.
The BGA are usually used widely in high-performance applications where high electrical and the thermal requirement is a top priority. BGA are available in plastic, ceramic and tape type of materials. The plastic BGA and thermally enhanced BGA are widely adopted.
The BGA has enhanced ratio between PCB area and pin count due to the input and output connections. Besides, the solder balls are strong than the conventional packaging, provides reduced footprint, increased speed yield of integrated circuits. The global BGA market is expected to grow during the forecast period due growth in the system on the package.
The BGA market is driven rapidly due to its low cost, denser type of packing and also higher performance. The increasing demand for diverse and smaller size packaging from electronic OEM’s drives the global BGA market. Also, increasing semiconductor and IC chip industry drives the global BGA market.
However, the challenges in designing of BGA are critical which might restrain the global BGA market.
The global BGA market is geographically divided into five key regions including North America, Latin America, Europe, Asia-Pacific (APAC) and the Middle East & Africa (MEA).Asia Pacific, especially China, Taiwan, Hong Kong, Japan contributes majorly to the BGA market.
The semiconductor industry in Asian countries has the strong foothold, thus it is expected that BGA market will show strong growth during the forecast period. Followed by APAC are North America, Europe, Latin America and MEA.
Some of the key players identified in the global BGA packaging market are Amkor Technology, TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology Co. STATS ChipPAC Ltd., ASE Group, Advanced Semiconductor Engineering, Inc., PARPRO, etc.
The research report presents a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, and statistically supported and industry-validated market data. It also contains projections done using a suitable set of assumptions and methodologies. The research report provides analysis and information according to categories such as market segments, geographies, type, machine size and end use.
The report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides an in-depth analysis of parent market trends, macro-economic indicators, and governing factors, along with market attractiveness as per segments. The report also maps the qualitative impact of various factors on market segments and geographies.
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The global BGA market is segmented on the basis material type and BGA type.
Based on the material type of BGA, global BGA market is segmented into:
Based on the type of BGA, global BGA market is segmented into:
1. Executive Summary 2. Industry Introduction, including Taxonomy and Market Definition 3. Market Trends and Success Factors, including Macro-economic Factors, Market Dynamics, and Recent Industry Developments 4. Global Market Demand Analysis and Forecast, including Historical Analysis and Future Projections 5. Pricing Analysis 6. Global Market Analysis and Forecast 6.1. Material Type 6.2. Die Type 6.3. Application 7. Global Market Analysis and Forecast, By Material Type 7.1. Ceramic (CBGA) 7.2. Plastic (PBGA) 8. Global Market Analysis and Forecast, By Die Type 8.1. Die Up Cross-Section 8.2. Die Down Cross-Section 8.3. Stacked 9. Global Market Analysis and Forecast, By Application 9.1. Wafer Scale Packaging 9.2. Optoelectronic 9.3. Laser Diode Packaging 9.4. RF Device Packaging 9.5. Power Amplifier Packaging 9.6. Power Transistor Packaging 10. Global Market Analysis and Forecast, By Region 10.1. North America 10.2. Latin America 10.3. Western Europe 10.4. Eastern Europe 10.5. Asia Pacific 10.6. Middle East and Africa 11. North America Sales Analysis and Forecast, by Key Segments and Countries 12. Latin America Sales Analysis and Forecast, by Key Segments and Countries 13. Western Europe Sales Analysis and Forecast, by Key Segments and Countries 14. Eastern Europe Sales Analysis and Forecast, by Key Segments and Countries 15. Asia Pacific Sales Analysis and Forecast, by Key Segments and Countries 16. Middle East and Africa Sales Analysis and Forecast, by Key Segments and Countries 17. Sales Forecast by Material Type, Die Type, and Application for 30 Countries 18. Competition Outlook, including Market Structure Analysis, Company Share Analysis by Key Players, and Competition Dashboard 19. Company Profile 19.1. Company Name 19.2. Amkor Technology 19.3. TriQuint Semiconductor Inc. 19.4. Jiangsu Changjiang Electronics Technology Co. 19.5. STATS ChipPAC Ltd. 19.6. ASE Group 19.7. Advanced Semiconductor Engineering, Inc. 19.8. PARPRO Cooperation Inc. 19.9. Advanced Interconnections Inc. 19.10. Quick Pak Inc. 19.11. Corintech Ltd 19.12. Cypress Semiconductor Corp. 19.13. Infineon Technologies AG 19.14. NXP Semiconductors NV
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