Increasing Inclusion of IoT in Packaged Electronic Equipment to Favor the Ball Grid Array Packaging Industry

The ball grid array packaging industry continues to expand as the demand for high-performance denser type compact packaging continues to rise. Electronic devices such as smartwatches, smartphones, and TVs are the most significant factor that augments the ball grid array packaging market growth.

As per the analysis, increasing inclusion of IoT in packaged electronic equipment like MEMS sensors, gyroscopes, and pressure sensors to meet the demand for smart automotive solutions is likely to benefit the market and augment the market size in the forecast period.

Ongoing development in R&D activities related to electronic gadgets favored by a broad range of functions of low-cost multiple microchips connector in integrated circuits, electronic circuits is likely to carve out new paths for the ball grid array (BGA) packaging sector.

Expanding application of ball grid array packages in the automotive and industrial sectors is likely to offer remunerative opportunities to the market. It is used in the automotive sector for high-pin-count equipment as well as in combination with Flip chip (FC) technology to boost direct and short device-to-substrate connections.

The market is augmenting at a rapid pace owing to its low cost, denser type of packing, and also higher performance. The rising demand for diverse and smaller size packaging from electronic OEMs expands the ball grid array packaging market. Further, the growing semiconductor and IC chip industry is another salient factor strengthening the BGA market in the forecast period.

The survey highlights various benefits of ball grid array packaging as follows:

  • Reliable Construction: The pins used in the PGA packages are fragile and thin. Therefore, these pins can be damaged easily. However, this does not happen with BGA packages. In BGA, solder pads are connected to solder balls which makes the system more responsible.
  • High performance at High Speeds
  • Regulates Overheating: BGA packages comprise various thermal channels that take out the heat in the integrated circuit boards. This reduces the chances of overheating.
  • High Density: Various electronic applications demand miniature packages with various pins. Due to this reason, the Pin Grid Array and dual-in-line surface mount packages were introduced that offer lower track densities.
  • Less Component Damage: Unlike PGA, the solder balls of BGA are melted by the heating process, which enables them to adhere to the circuit board. This helps in reducing the chances of component damage.

Don't pay for what you don't need

Customize your report by selecting specific countries or regions and save 30%!

Ball Grid Array (BGA) Packaging Market Overview

Surface mount technology also called as SMT is a technique of mounting electronic components on the surface of printed circuit boards. Ball Grid Array also called as BGA is one of the types of surface mount packaging. BGA are more convenient and robust type of packages compared to the conventional packaging such as quad flat packaging.

The BGA are usually used widely in high-performance applications where high electrical and the thermal requirement is a top priority. BGA are available in plastic, ceramic and tape type of materials. The plastic BGA and thermally enhanced BGA are widely adopted. 

The BGA has enhanced ratio between PCB area and pin count due to the input and output connections. Besides, the solder balls are strong than the conventional packaging, provides reduced footprint, increased speed yield of integrated circuits. The global BGA market is expected to grow during the forecast period due growth in the system on the package.

The BGA market is driven rapidly due to its low cost, denser type of packing and also higher performance. The increasing demand for diverse and smaller size packaging from electronic OEM’s drives the global BGA market. Also, increasing semiconductor and IC chip industry drives the global BGA market.

However, the challenges in designing of BGA are critical which might restrain the global BGA market.

The global BGA market is geographically divided into five key regions including North America, Latin America, Europe, Asia-Pacific (APAC) and the Middle East & Africa (MEA).Asia Pacific, especially China, Taiwan, Hong Kong, Japan contributes majorly to the BGA market.

The semiconductor industry in Asian countries has the strong foothold, thus it is expected that BGA market will show strong growth during the forecast period. Followed by APAC are North America, Europe, Latin America and MEA.

Ball Grid Array (BGA) Packaging Market - Major Players

Some of the key players identified in the global BGA packaging market are Amkor Technology, TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology Co. STATS ChipPAC Ltd., ASE Group, Advanced Semiconductor Engineering, Inc., PARPRO, etc.

The research report presents a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, and statistically supported and industry-validated market data. It also contains projections done using a suitable set of assumptions and methodologies. The research report provides analysis and information according to categories such as market segments, geographies, type, machine size and end use.

Ismail Sutaria
Ismail Sutaria

Principal Consultant

Talk to Analyst

Find your sweet spots for generating winning opportunities in this market.

The report covers exhaustive analysis on

  • Market Segments
  • Market Dynamics
  • Market Size
  • Supply & Demand
  • Current Trends/Issues/Challenges
  • Competition & Companies involved
  • Technology
  • Value Chain

Regional analysis includes

  • North America
  • Latin America
  • Europe
  • Asia Pacific
  • Middle East and Africa

The report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides an in-depth analysis of parent market trends, macro-economic indicators, and governing factors, along with market attractiveness as per segments. The report also maps the qualitative impact of various factors on market segments and geographies.

Get the data you need at a Fraction of the cost

Personalize your report by choosing insights you need
and save 40%!

Ball Grid Array Bga Packaging Market

The global BGA market is segmented on the basis material type and BGA type.

Based on the material type of BGA, global BGA market is segmented into:

  • Ceramic/ (CBGA)
  • Plastic/ (PBGA)
  • Tape/ (TBGA)

Based on the type of BGA, global BGA market is segmented into:

  • Molded Array Process BGA
  • Thermally Enhanced BGA
  • Package on Package (PoP) BGA
  • Micro BGA



Surface Mount Technology Market

September 2024




Semiconductor Packaging Market

July 2022


August 2023

225 pages


Lay Flat Bags Market

September 2024




Quad-Flat-No-Lead Packaging Market

December 2017


306 pages

Explore Packaging Insights

View Reports
Future Market Insights

Ball Grid Array (BGA) Packaging Market

Schedule a Call